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Index of Titles

A complete list of all conference contributions. Use the alphabetical filter or the search box below to find specific submissions. Click on any contribution to view its session details.

List by Initial Letter: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z All Titles

Contribution Title	Author(s)	Session
1um glass via TGV formation by single-shot ultrafast Bessel pulses in GHz burst mode	Sakai, K	Advanced Packaging
Active alignment of defractive elements for optoelectronic MEMS	Sordo, Guido; Vadøy, Astrid-Sofie; Mithassel, Benedikt Andreas; Wright, Daniel	Materials and processes
Automated Characterization of Surface Quality and Defects of Ceramic Multilayer Packages	Selvakumar, Sesha Gopal; Zamankhani, Saba; Sattler, Kai-Uwe; Bartsch, Heike; Müller, Jens	Reliability
Bio-based TPU Smart Wound Dressing with Temperature and pH Sensing on a Skin-Conformal Patch	Pahl, Barbara (1); Loeher, Thomas (1); Lafendt, Soeren (2); Bendig, Stefan (3)	Flexible and medical electronics
Biocomposite Substrates for Structural Electronics: Mechanical Limits, Lamination Challenges, and Commercial Design Constraints	Luuk, Tatu	Advanced Packaging
CNN-Based Anisotropic Homogenization Finite Element Framework for PCB Warpage Analysis	Lai, Chin-Hung (1); Tsai, Shiu-Cheng (2); Liang, Yu-Jui (3)	Reliability
Coupled Multiphysics Simulation with Machine Learning Approach to predict humidity effects on PCB Surface	Lakkaraju, Anish Rao; Bahrebar, Sajjad; Ambat, Rajan	Reliability
Direct Attachment of RFID IC to Self-Healing Polymer-Based Tag Antenna: Towards Self-Assembly Methods	Yaqoob, Isra (1); Pournoori, Nikta (1); Oinas, Neea (2); Tiwari, Naveen (1); Tolvanen, Jarkko (2); Juuti, Jari (2); Ukkonen, Leena (1)	Flexible and medical electronics
Effect of PCB Moisture Absorption on Damage Evolution in Solder Joints	Akbari, Saeed; Andersson, Dag	Reliability
Electrically Insulating Heat Spreaders for High-Power Electronics: Comparing a Hexagonal Boron Nitride Composite to a Graphene/Kapton Laminate	Pashazadeh, Sajjad (1); Enmark, Markus (1); Hassan, Muhammad (2); Kamal, Arian (3); Kallio, Kai J (3); Liu, Johan (1); Guarriello, Luca (1); Lundgren, Per (1); Bolminger, Erik (2)	Materials and processes
Electronic Packaging Design for Humidity Robustness: Experimental and Modelling Approach	Ambat, Rajan	Reliability
Enabling Mutual Identification of Autonomous Vehicles via Battery‑less Ultrasonic Tags and 120‑GHz Radar Sensing	Ren, Siyu (2); Lu, Xiangyu (2); Gu, Chao (3); He, Zhongxia Simon (1,2)	Flexible and medical electronics
Gap filling processes for Quasi-Monolithic Integration applications	Lei, Long; Dill, Pauline; Eckstein, Marco; Schumann, Erik	Advanced Packaging
Glass Package Trends & Key Technology with Glass Core Evaluation Testing Method	Onishi, Tetsuya	Advanced Packaging
High-efficiency on-paper self-charging power sources	Fu, Yujie; Li, Zheng; Chen, Shiqian; Li, Jiantong	Flexible and medical electronics
Innovative UV Assisted Curing for Indium Based Low Melting Point µBumps used in Quantum Computing	Muller, Philippe (1); Jeck, Lukas (1); Bensu, Tunca Altintas (2); Leech, Damien (2); Kennes, Koen (2); Tussing, Sebastian (1); Richter, Max (1); Rapps, Thomas (1); Guerrero, Alice (3); Koch, Matthew (3)	Materials and processes
Micro-transfer-printing: Alternative to polymeric adhesive bonding	Hwang, How Yuan	Materials and processes
Miniaturization of Low-Power DC-DC Converters Using PCB Embedding for Avionic Applications	Sirkeci, Dincer	Advanced Packaging
Optimising chip assembly bond strength	Sordo, Guido; Wright, Daniel; Vardøy, Astrid-Sofie Borge	Materials and processes
Packaging challenges for energy-autonomous self-powered IoT sensing	Rusu, Cristina; Andersson, Dag; Staaf, Henrik	Advanced Packaging