Conference Agenda

Please go to the registration desk in the Exhibition area to collect your badge. We also offer on-site registration via the conftool portal.

The opening session is open to the public via registration as "exhibitor only" in the conftool portal.

Title: Growth Drivers and Limits for Advanced Packaging in the AI Data Center Era

To access this session free of charge, register as "exhibition only" at www.nordpac.org

Panel discussion chaired by Professor Mikael Östling, Professor of solid state electronics at KTH, Royal institute of Technology, Stockholm 

This meeting is open to the public, but only members can vote. 

Please join us for a welcome reception in the exhibition area. There will be complimentary finger food and a few drinks. This is a perfrect setting for mingling and networking. 

PLA-Based Sustainable PCBs – a Possible Path for Greener Electronics

Prof. Attila Géczy, Budapest University of Technology and Economics

To access the exhibition free of charge, plese register as "exhibition only" at www.nordpac.org 

Dr. Naveen Tiwari, Postdoctoral Research Fellow, Faculty of Medicine and Health Technology, Tampere University

The pilot line for »Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems« (APECS) is a central initiative within the EU Chips Act. It aims to accelerate innovation in chiplet technologies and strengthen Europe’s semiconductor research and manufacturing capabilities.

The Workshop will be chaired by Felix Mohn (APECS) and Rolf Aschenbrenner (Fraunhofer IZM).

Join us on a beautiful cruise around the Stockholm arpellago on the S/S Stockholm. 

Meet up at https://maps.app.goo.gl/PohZfvvumqARMDgi9 at 1745. The boat leaves at 1800. 

Information about the trip can be found here:  https://www.stromma.com/sv-se/stockholm/matkryssningar/middagskryssningar/ss-stockholm/