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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

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Session Overview

Session

AP9_Power Electronics Packaging

Time:

Friday, 13/Sept/2024:

1:45pm - 3:00pm

Session Chair: Klaus Pressel, Infineon

Location: MOA 5

MOA 5

Presentations

1:45pm - 2:10pm

Additive Fan-out Panel-level Processing for Power MOSFET Devices

Eric Rubingh², Edsger Smits^1,2, Francesca Chiappini^1,2, Roel Kusters², Tindara Verduci², Jackson Gualberto de Sousa¹, Thijs Bel², Jeroen van den Brand², Mark Luke Farrugia¹, Hero ‘t Mannetje²

¹Chip Integration Technology Center, Nijmegen, The Netherlands; ²Holst Centre TNO, Eindhoven, The Netherlands

2:10pm - 2:35pm

Advancing Packaging Solutions: Integrating Power Electronics Using LTCC Technology

Qaisar Khushi Muhammad¹, Peter Keil¹, Uwe Krieger¹, Manuel Heidenreich², Jörg Töpfer², Beate Capraro³, Dirk Schabbel³, Koji Koiwai¹

¹VIA electronic GmbH, Hermsdorf, Germany; ²University of Applied Sciences Jena, Jena, Germany; ³Fraunhofer IKTS, Hermsdorf, Germany

2:35pm - 3:00pm

Thermal Diffusivity Investigation of a Heat Pipe

Corina Ruxandra Mitulescu, Bogdan-Traian Mihailescu, Mihai Branzei, Paul Svasta

CETTI UNSTPB