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AP9_Power Electronics Packaging
Time:
Friday, 13/Sept/2024:
1:45pm - 3:00pm
Session Chair: Klaus Pressel , Infineon
Location: MOA 5 MOA 5
Presentations
1:45pm - 2:10pm Additive Fan-out Panel-level Processing for Power MOSFET Devices
Eric Rubingh2 , Edsger Smits1,2 , Francesca Chiappini 1,2 , Roel Kusters2 , Tindara Verduci2 , Jackson Gualberto de Sousa1 , Thijs Bel2 , Jeroen van den Brand2 , Mark Luke Farrugia1 , Hero ‘t Mannetje2
1 Chip Integration Technology Center, Nijmegen, The Netherlands; 2 Holst Centre TNO, Eindhoven, The Netherlands
2:10pm - 2:35pm Advancing Packaging Solutions: Integrating Power Electronics Using LTCC Technology
Qaisar Khushi Muhammad 1 , Peter Keil1 , Uwe Krieger1 , Manuel Heidenreich2 , Jörg Töpfer2 , Beate Capraro3 , Dirk Schabbel3 , Koji Koiwai1
1 VIA electronic GmbH, Hermsdorf, Germany; 2 University of Applied Sciences Jena, Jena, Germany; 3 Fraunhofer IKTS, Hermsdorf, Germany
2:35pm - 3:00pm Thermal Diffusivity Investigation of a Heat Pipe
Corina Ruxandra Mitulescu , Bogdan-Traian Mihailescu, Mihai Branzei, Paul Svasta
CETTI UNSTPB