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MIP6_New materials for Heterogeneous Integration
Time:
Friday, 13/Sept/2024:
1:45pm - 3:00pm
Session Chair: Nikhilendu Tiwary , Aalto University
Location: MOA 10-12 MOA 10-12
Presentations
1:45pm - 2:10pm Development of Novel BT Laminate Materials for mmWave Antenna and Heterogeneous Integration
Masashi Okaniwa , Yuji Kamata, Amane Matsunaga, Takashi Kobayashi, Takaaki Ogashiwa
MITSUBISHI GAS CHEMICAL COMPANY, INC., Japan
2:10pm - 2:35pm Parylene as a Novel Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging
Franz Selbmann 1,2 , Martin Kühn1,2 , Frank Roscher1 , Maik Wiemer1 , Harald Kuhn1,3 , Yvonne Joseph2
1 Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; 2 TU Bergakademie Freiberg, Institute of Nanoscale and Biobased Materials, Freiberg, Germany; 3 TU Chemnitz, Center for Microtechnologies, Chemnitz, Germany
2:35pm - 3:00pm Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors
Andrei Costina 1 , Markus Wöhrmann1 , Michael Schiffer1 , Martin Schneider-Ramelow2
1 Fraunhofer IZM, Berlin, Germany; 2 TU Berlin, Berlin, Germany