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AMT5_Advanced Materials and Processes
Time:
Friday, 13/Sept/2024:
11:00am - 12:15pm
Session Chair: Attila Géczy , Budapest University of Technology and Economics
Location: MOA 4 MOA 4
Presentations
11:00am - 11:25am Thin Substrate Bonding
Partia Naghibi
HRL Laboratories, United States of America
11:25am - 11:50am System-in-package Building block Development for Future Space Equipment
Hélène Jochem 1 , Hugo Garcia1 , Norbert Venet1 , Mirko Rocci2 , Lucas Sollecchia2 , Paolo Scalmati3 , Monique Mayr4 , Carlo Tuninetti5 , Giovanni Cucinella5 , Kim Ankeraa6 , Poul Juul6
1 Thales Alenia Space, Cannes, France; 2 Thales Alenia Space, Italy; 3 Somacis; 4 Panasonic; 5 IMT; 6 Hytek
11:50am - 12:15pm Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-tall Indium Bumps Across an Entire Chip
Andreas Schneider 1 , Aswathi Koorikkat1 , Navid Ghorbanian1 , Toby G. Brookes1 , John D. Lipp1 , David Burt2 , Marcus J. French1
1 UKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United Kingdom; 2 Kelvin Nanotechnology Ltd., Glasgow, United Kingdom