JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@estc-conference.net.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

AP8_Fan Out Reliability Aspects

Time:

Friday, 13/Sept/2024:

11:00am - 12:15pm

Session Chair: Grace O'Malley, INEMI

Location: MOA 5

MOA 5

Presentations

11:00am - 11:25am

Power Delivery for AI/HPC Microprocessors

Mark Li, Vikas Gupta

ASE, United States of America

11:25am - 11:50am

Reliability and RF Performance Assessment of Heterogeneous Integrated FO-WLP Test Structure Packages for Mixed RF Digital Front-End Application

Jesse C. Riedl¹, Vincent Bortolussi¹, Christophe Chang¹, Didier Floriot¹, Jonathan Leroy¹, Romain Mathieu¹, Julien Perraud³, Hermann Stieglauer², Gregory Uren¹, Benoit Lambert¹

¹UMS SAS, Villebon Sur Yvette, France; ²UMS GmbH, Ulm, Germany; ³Thales Research and Technology, Palaiseau, France

11:50am - 12:15pm

No Warpage and Fast Cure: UV-molding for FOWLP/FOPLP

Markus Schindler, Severin Ringelstetter, Martin Bues, Tobias Königer, Kilian Kreul

DELO Industrial Adhesives, Windach, Germany