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AP7_Fan Out Packages
Time:
Friday, 13/Sept/2024:
9:15am - 10:30am
Session Chair: Erik Jung , Fraunhofer IZM
Location: MOA 5 MOA 5
Presentations
9:15am - 9:40am INVITED TALK: Accelerating the AI Economy through Heterogeneous Integration
CP Hung
ASE, United States of America
9:40am - 10:05am Development of an Adaptive Re-distribution Patterning Process for Fan-out Packages with Embedded High I/O Components
Ruben Kahle 1 , Lars Böttcher1 , Luc Steffen Borchardt1 , Dionysios Manessis1 , Anna Meierfrankenfeld1 , Andreas Zluc2 , Andrea Casto2 , Stefano Sergio Oggioni2
1 Fraunhofer IZM, Berlin, Germany; 2 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, Austria
10:05am - 10:30am On the Design and Fabrication of SMT-compatible 3D-Freeform Antennas Based on Compression Molding and Direct Cu-Metallization
Marc Dreissigacker 1 , Friedrich Müller1 , Christian Tschoban2 , Tanja Braun2 , Karl-Friedrich Becker2 , Paul Perlwitz1 , Martin Schneider-Ramelow1
1 TU Berlin, Microperipheric Center, Berlin, Germany; 2 Fraunhofer IZM, Berlin, Germany