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MIP4_Mechanical properties of Materials for Interconnects
Time:
Friday, 13/Sept/2024:
9:15am - 10:30am
Session Chair: Glenn Hamilton Ross , Aalto University
Location: MOA 10-12 MOA 10-12
Presentations
9:15am - 9:40am Prediction of High Strain Rate Properties of Bi-doped SnAgCu Solders after Sustained High-temperature Operation
Pradeep Lall , Vishal Mehta, Mrinmoy Saha
Auburn University, Auburn, USA
9:40am - 10:05am Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages
Soichi Homma 1 , Daichi Okada2 , Akihito Sawanobori1 , Susumu Yamamoto1 , Hiroshi Nishikawa3
1 Memory Packaging Development Department, Kioxia Corporation, Japan; 2 Memory Packaging Engineering Department, Kioxia Corporation, Japan; 3 Joining and Welding Research Institute, Osaka University, Osaka, Japan
10:05am - 10:30am Effect of Minor Element Addition on Mechanical Properties and Microstructure of Sn-Bi Alloys
Hiroshi Nishikawa 1 , Yuki Hirata1 , Shiqi Zhou1 , Chih-han Yang2 , Shih-kang Lin2
1 Osaka University, Osaka, Japan; 2 National Cheng Kung University, Tainan City, Taiwan