IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

Emerging II

Time:

Thursday, 12/Sept/2024:

3:45pm - 5:15pm

Session Chair: Martin Schneider-Ramelow, Fraunhofer IZM

Location: MOA 4

MOA 4

Presentations

10 Golden Rules of Chip- Package- Board Interactions

Evelyn Napetschnig

Infineon technologies Austria AG, Graz, Austria

Trench-Based Fully Integrated Capacitors for Power Delivery in Heterogeneous Integration Platforms

Yousef Safari, Yushu Zhao, Boris Vaisband

ECE Department, McGill University, Montreal, Canada

Sustainable Temperature and Pressure Sensing Solution for Tire

Kimmo Antero Keränen¹, Timo Kurkela¹, Jyrki Ollila¹, Antti Tanskanen¹, Marko Korkalainen¹, Antoine Balin²

¹VTT Technical Research Centre of Finland, Espoo, Finland; ²Continental Reifen Deutschland GmbH, Germany