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Power2_Power Semiconductor Packaging and Cooling
Time:
Wednesday, 11/Sept/2024:
5:00pm - 6:15pm
Session Chair: Gudrun Feix , ECPE European Center for Power Electronics
Location: MOA 1+2 MOA 1+2
Presentations
5:00pm - 5:25pm Model-based Development to Improve Electrical and Thermal Performances for Robust Si Power MOSFETs Using Embedded Die Packaging Technology
Kentaro Mori , Kohei Oasa, Hitoshi Imi, Yutaro Hayashi, Tatsuya Ohguro, Tatsuya Nishiwaki, Fumiyoshi Kawashiro
Toshiba Electronic Devices & Storage Corporation, Japan
5:25pm - 5:50pm Research on Ultra-compact 3D SiC Power Module for EVs with Double Layer Cooling Technology
Keita Suzuki1 , Takumi Yumoto2 , Koji Bando2 , Tetsuo Endoh1 , Yoshikazu Takahashi 1
1 Tohoku University, Tohoku, Japan; 2 Shinko Electric Industries Co, LTD. Japan
5:50pm - 6:15pm An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®
Kaneeze Noorul Ain 1,2 , Guo Qi Zhang2 , Augusto Rodrigues1 , Md Nazmul Hasan1 , Karen Geens3 , Urmimala Chatterjee3 , Ali Roshanghias1 , Dominik Holzmann1
1 Silicon Austria Labs (SAL), Villach, Austria; 2 Delft University of Technology (TUD), Delft, The Netherlands; 3 Interuniversity Microelectronics Centre (IMEC), Loewen, Belgium