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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

MIP1_Advanced Material Architectures for Interconnects

Time:

Wednesday, 11/Sept/2024:

2:40pm - 3:55pm

Session Chair: Glenn Hamilton Ross, Aalto University

Location: MOA 10-12

MOA 10-12

Presentations

2:40pm - 3:05pm

Solid-state Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems

Steffen Bickel^1,2, Juliana Panchenko^1,2, Manuela Junghähnel¹

¹Fraunhofer IZM-ASSID, Moritzburg, Germany; ²TU Dresden, Dresden, Germany

3:05pm - 3:30pm

Superconducting Superlattice Interconnects for Cryogenic Systems

Charles Bon-mardion¹, Edouard Deschaseaux¹, Thierry Farjot¹, Alain Campo¹, Frédéric Ritton¹, Rémi Vélard¹, Hélène Duchemin¹, Céline Feautrier¹, Jean-Luc Sauvageot², Jean Charbonnier¹, Candice Thomas¹

¹Univ. Grenoble Alpes, CEA, LETI, Grenoble, France; ²Université Paris-Saclay, CEA, IRFU, Gif-sur-Yvette, France

3:30pm - 3:55pm

Aluminium-Aluminium Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminium Bonding Frames

Silvia Braun, Imants Cirulis, Klaus Vogel, Christian Hofmann, Maik Wiemer

Fraunhofer ENAS, Chemnitz, Germany

IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

Conference Agenda