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Index of Authors

A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding last name. Select the presentation in the right-hand column to access session and presentation details.

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Author(s) Organization(s) Session
Akbari, SaeedRise Research Institutes of Sweden, SwedenReliability  Presenter
Akshath Raj, VandanaManipal Institute of Technology, Manipal, IndiaFlexible and medical electronics
Ambat, RajanSection of Materials and Surface Engineering, DTU Construct, Technical University of Denmark, DenmarkReliability  Presenter
Reliability  Presenter
Andersson, DagRISE Research Institutes of Sweden, SwedenAdvanced Packaging
Reliability
Bahrebar, SajjadSection of Materials and Surface Engineering, DTU Construct, Technical University of Denmark, DenmarkReliability
Bartsch, HeikeTechnische Universität Ilmenau, GermanyReliability
Bendig, StefanWürth Elektronik GmbH, GermanyFlexible and medical electronics
Bensu, Tunca Altintas2IMEC vzw, Kappeldreef 75, 3001 Leuven, BelgiumMaterials and processes
Chen, ShiqianDepartment of Electronics and Embedded Systems, KTH Royal Institute of Technology, SwedenFlexible and medical electronics
Dill, PaulineFraunhofer Institute for Photonic Microsystems, Dresden, GermanyAdvanced Packaging
Eckstein, MarcoFraunhofer Institute for Photonic Microsystems, Dresden, GermanyAdvanced Packaging
Enmark, MarkusElectronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, SE-412 96 Göteborg, SwedenMaterials and processes
Fu, YujieDepartment of Electronics and Embedded Systems, KTH Royal Institute of Technology, SwedenFlexible and medical electronics  Presenter
Gu, ChaoCentre for Wireless Innovation, School of Electronics, Electrical Engineering and Computer Science, Queen’s University Belfast, BT3 9DT Belfast, U.K.Flexible and medical electronics
Guerrero, AliceBrewer Science, Inc., 2401 Brewer Drive, Rolla, MO 65401, USAMaterials and processes
Hassan, MuhammadSHT Smart High-Tech AB, Terminalvägen 12, SE-41879 Gothenburg, SwedenMaterials and processes
He, Zhongxia SimonChalmersIndustriTeknik, Sweden;
Beijing Institute of Technology (Zhuhai), China		Flexible and medical electronics  Presenter
Hwang, How YuanTyndall National Institute, IrelandMaterials and processes  Presenter
Jeck, Lukas1SUSS MicroTec Solutions GmbH & Co. KG, Ferdinand-von-Steinbeis Ring 10, 75447 Sternenfels, GermanyMaterials and processes
Juuti, JariFaculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, FinlandFlexible and medical electronics
Kallio, Kai JVolvo Car Corporation, Material Centre, Volvo Jakobs väg, SE-418 78 Göteborg, SwedenMaterials and processes
Kamal, ArianVolvo Car Corporation, Material Centre, Volvo Jakobs väg, SE-418 78 Göteborg, SwedenMaterials and processes
Kennes, Koen2IMEC vzw, Kappeldreef 75, 3001 Leuven, BelgiumMaterials and processes
Lafendt, SoerenEssity GmbH, GermanyFlexible and medical electronics
Lai, Chin-HungDepartment of Aeronautics and Astronautics, National Cheng Kung University, TaiwanReliability  Presenter
Lakkaraju, Anish RaoSection of Materials and Surface Engineering, DTU Construct, Technical University of Denmark, DenmarkReliability
Leech, Damien2IMEC vzw, Kappeldreef 75, 3001 Leuven, BelgiumMaterials and processes
Lei, LongFraunhofer Institute for Photonic Microsystems, Dresden, GermanyAdvanced Packaging  Presenter
Li, JiantongDepartment of Electronics and Embedded Systems, KTH Royal Institute of Technology, SwedenFlexible and medical electronics
Li, ZhengDepartment of Electronics and Embedded Systems, KTH Royal Institute of Technology, SwedenFlexible and medical electronics
Liang, Yu-JuiDepartment of Aeronautics and Astronautics, National Cheng Kung University, TaiwanReliability
Liu, JohanElectronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, SE-412 96 Göteborg, SwedenMaterials and processes
Loeher, ThomasFraunhofer IZM, GermanyFlexible and medical electronics
Lu, XiangyuBeijing Institute of Technology (Zhuhai), ChinaFlexible and medical electronics
Luuk, TatuORGANIC STEEL LTDAdvanced Packaging
Mithassel, Benedikt AndreasSmart Sensors and Microsystems, SINTEF Digital, NorwayMaterials and processes
Müller, JensTechnische Universität Ilmenau, GermanyReliability
Muller, Philippe1SUSS MicroTec Solutions GmbH & Co. KG, Ferdinand-von-Steinbeis Ring 10, 75447 Sternenfels, GermanyMaterials and processes  Presenter
Nayak, Subramanya G.Manipal Institute of Technology, Manipal, IndiaFlexible and medical electronics  Presenter
Oinas, NeeaFaculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, FinlandFlexible and medical electronics
Onishi, TetsuyaGrand Joint TechnologyAdvanced Packaging  Presenter
Pahl, BarbaraFraunhofer IZM, GermanyFlexible and medical electronics  Presenter
Pashazadeh, SajjadElectronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, SE-412 96 Göteborg, SwedenMaterials and processes  Presenter
Pournoori, NiktaFaculty of Medicine and Health Technology, Tampere University, Tampere, FinlandFlexible and medical electronics
Rapps, Thomas1SUSS MicroTec Solutions GmbH & Co. KG, Ferdinand-von-Steinbeis Ring 10, 75447 Sternenfels, GermanyMaterials and processes
Ren, SiyuBeijing Institute of Technology (Zhuhai), ChinaFlexible and medical electronics
Richter, Max1SUSS MicroTec Solutions GmbH & Co. KG, Ferdinand-von-Steinbeis Ring 10, 75447 Sternenfels, GermanyMaterials and processes
Rusu, CristinaRISE Research Institutes of Sweden, SwedenAdvanced Packaging  Presenter
Sakai, KEnplas Corporation, Japan.Advanced Packaging  Presenter
Sattler, Kai-UweTechnische Universität Ilmenau, GermanyReliability
Schumann, ErikFraunhofer Institute for Photonic Microsystems, Dresden, GermanyAdvanced Packaging
Selvakumar, Sesha GopalTechnische Universität Ilmenau, GermanyReliability  Presenter
Sirkeci, DincerTechnical University of Berlin, GermanyAdvanced Packaging  Presenter
Sordo, GuidoSmart Sensors and Microsystems, SINTEF Digital, NorwayMaterials and processes
Materials and processes  Presenter
Staaf, HenrikRISE Research Institutes of Sweden, SwedenAdvanced Packaging
Sundin, PhillipShellback Semiconductor Equipment, United States of AmericaMaterials and processes
Thalengala, AnanthakrishnaManipal Institute of Technology, Manipal, IndiaFlexible and medical electronics
Tiwari, NaveenFaculty of Medicine and Health Technology, Tampere University, Tampere, FinlandFlexible and medical electronics  Presenter
Tolvanen, JarkkoFaculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, FinlandFlexible and medical electronics
Tsai, Shiu-ChengSimutech Solution Corp., TaiwanReliability
Tussing, Sebastian1SUSS MicroTec Solutions GmbH & Co. KG, Ferdinand-von-Steinbeis Ring 10, 75447 Sternenfels, GermanyMaterials and processes
Ukkonen, LeenaFaculty of Medicine and Health Technology, Tampere University, Tampere, FinlandFlexible and medical electronics
Vadøy, Astrid-SofieSmart Sensors and Microsystems, SINTEF Digital, NorwayMaterials and processes
Vardøy, Astrid-Sofie BorgeSmart Sensors and Microsystems, SINTEF Digital, NorwayMaterials and processes
Wright, DanielSmart Sensors and Microsystems, SINTEF Digital, NorwayMaterials and processes  Presenter
Materials and processes
Yaqoob, IsraFaculty of Medicine and Health Technology, Tampere University, Tampere, FinlandFlexible and medical electronics
Zamankhani, SabaTechnische Universität Ilmenau, GermanyReliability