Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
|
Daily Overview | |
|
Location: Aurora Kista Science Tower Färögatan 33, 164 51 Kista, Sweden |
| 10:15am - 12:15pm |
Flexible and medical electronics Location: Aurora Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic Multi-Scale CNN-BiLSTM Network with Residual Kernel Attention for EEG Artifact Removal 1: Manipal Institute of Technology, Manipal, India; 2: Manipal Institute of Technology, Manipal, India; 3: Manipal Institute of Technology, Manipal, India 10:39am - 11:03am Direct Attachment of RFID IC to Self-Healing Polymer-Based Tag Antenna: Towards Self-Assembly Methods 1: Faculty of Medicine and Health Technology, Tampere University, Tampere, Finland; 2: Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, Finland 11:03am - 11:27am Bio-based TPU Smart Wound Dressing with Temperature and pH Sensing on a Skin-Conformal Patch 1: Fraunhofer IZM, Germany; 2: Essity GmbH, Germany; 3: Würth Elektronik GmbH, Germany 11:27am - 11:51am High-efficiency on-paper self-charging power sources Department of Electronics and Embedded Systems, KTH Royal Institute of Technology, Sweden 11:51am - 12:15pm Enabling Mutual Identification of Autonomous Vehicles via Battery‑less Ultrasonic Tags and 120‑GHz Radar Sensing 1: ChalmersIndustriTeknik, Sweden; 2: Beijing Institute of Technology (Zhuhai), China; 3: Centre for Wireless Innovation, School of Electronics, Electrical Engineering and Computer Science, Queen’s University Belfast, BT3 9DT Belfast, U.K. |
| 8:30am - 11:00am |
Advanced Packaging Location: Aurora Chair: Anders E. Petersen, Demant / Oticon Miniaturization of Low-Power DC-DC Converters Using PCB Embedding for Avionic Applications Technical University of Berlin, Germany 8:54am - 9:18am Gap filling processes for Quasi-Monolithic Integration applications Fraunhofer Institute for Photonic Microsystems, Dresden, Germany 9:18am - 9:42am Packaging challenges for energy-autonomous self-powered IoT sensing RISE Research Institutes of Sweden, Sweden 9:42am - 10:06am Biocomposite Substrates for Structural Electronics: Mechanical Limits, Lamination Challenges, and Commercial Design Constraints ORGANIC STEEL LTD 10:06am - 10:30am Glass Package Trends & Key Technology with Glass Core Evaluation Testing Method Grand Joint Technology 10:30am - 10:54am 1um glass via TGV formation by single-shot ultrafast Bessel pulses in GHz burst mode Enplas Corporation, Japan. |
