Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Daily Overview | |
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Location: Cyber Auditorium Kista Science Tower Färögatan 33, 164 51 Kista, Sweden |
| 9:00am - 9:15am |
Opening Session - Open to public Location: Cyber Auditorium Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic The opening session is open to the public via registration as "exhibitor only" in the conftool portal. |
| 9:15am - 10:00am |
Distinguisehd lecture by E. Jan Vardeman - Open to public Location: Cyber Auditorium Title: Growth Drivers and Limits for Advanced Packaging in the AI Data Center Era |
| 10:00am - 10:30am |
Exhibitor presentations - open to public Location: Cyber Auditorium To access this session free of charge, register as "exhibition only" at www.nordpac.org |
| 1:15pm - 2:00pm |
Realising the power of rail – how power electronics packaging and systems integration can shape the future of sustainable mobility - Ganesh Chandramouli, Alstrom Location: Cyber Auditorium Chair: Dr. Dag Andersson, RISE AB (Retired)
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| 2:15pm - 4:45pm |
Panel discussion on Packaging for quantum technology, power and emerging technologies Location: Cyber Auditorium Panel discussion chaired by Professor Mikael Östling, Professor of solid state electronics at KTH, Royal institute of Technology, Stockholm |
| 5:00pm - 5:30pm |
IMAPS Nordic General Assembly Location: Cyber Auditorium Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic This meeting is open to the public, but only members can vote. |
| 9:00am - 9:45am |
PLA-Based Sustainable PCBs – a Possible Path for Greener Electronics - Prof.Attila Géczy Location: Cyber Auditorium Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic PLA-Based Sustainable PCBs – a Possible Path for Greener Electronics Prof. Attila Géczy, Budapest University of Technology and Economics |
| 10:15am - 12:15pm |
Reliability Location: Cyber Auditorium Chair: Prof. Rajan Ambat, Technical University of Denmark Automated Characterization of Surface Quality and Defects of Ceramic Multilayer Packages Technische Universität Ilmenau, Germany 10:39am - 11:03am Effect of PCB Moisture Absorption on Damage Evolution in Solder Joints Rise Research Institutes of Sweden, Sweden 11:03am - 11:27am CNN-Based Anisotropic Homogenization Finite Element Framework for PCB Warpage Analysis 1: Department of Aeronautics and Astronautics, National Cheng Kung University, Taiwan; 2: Simutech Solution Corp., Taiwan; 3: Department of Aeronautics and Astronautics, National Cheng Kung University, Taiwan 11:27am - 11:51am Coupled Multiphysics Simulation with Machine Learning Approach to predict humidity effects on PCB Surface Section of Materials and Surface Engineering, DTU Construct, Technical University of Denmark, Denmark 11:51am - 12:15pm Electronic Packaging Design for Humidity Robustness: Experimental and Modelling Approach Technical University of Denmark, Denmark |
| 1:15pm - 2:45pm |
Short course: Self-healing materials for soft electronics - Dr. Naveen Tiwari Location: Cyber Auditorium Dr. Naveen Tiwari, Postdoctoral Research Fellow, Faculty of Medicine and Health Technology, Tampere University |
| 3:00pm - 4:30pm |
Workshop - Chiplet Integration Technologies powered by APECS Location: Cyber Auditorium Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic The pilot line for »Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems« (APECS) is a central initiative within the EU Chips Act. It aims to accelerate innovation in chiplet technologies and strengthen Europe’s semiconductor research and manufacturing capabilities. The Workshop will be chaired by Felix Mohn (APECS) and Rolf Aschenbrenner (Fraunhofer IZM). |
| 8:30am - 11:00am |
Materials and processes Location: Cyber Auditorium Chair: Dr. Jiantong Li, KTH Production-Proven Chemical-Free Green Alternative to Solvent and Piranha Wafer Processing using Ozone Shellback Semiconductor Equipment, United States of America 8:54am - 9:18am Micro-transfer-printing: Alternative to polymeric adhesive bonding Tyndall National Institute, Ireland 9:18am - 9:42am Optimising wire bond and chip assembly bond strength Smart Sensors and Microsystems, SINTEF Digital, Norway 9:42am - 10:06am Innovative UV Assisted Curing for Indium Based Low Melting Point µBumps used in Quantum Computing 1: 1SUSS MicroTec Solutions GmbH & Co. KG, Ferdinand-von-Steinbeis Ring 10, 75447 Sternenfels, Germany; 2: 2IMEC vzw, Kappeldreef 75, 3001 Leuven, Belgium; 3: Brewer Science, Inc., 2401 Brewer Drive, Rolla, MO 65401, USA 10:06am - 10:30am Active alignment of defractive elements for optoelectronic MEMS Smart Sensors and Microsystems, SINTEF Digital, Norway 10:30am - 10:54am Electrically Insulating Heat Spreaders for High-Power Electronics: A Comparative Study of Hexagonal Boron Nitride Composite and Graphene Laminate 1: Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, SE-412 96 Göteborg, Sweden; 2: SHT Smart High-Tech AB, Terminalvägen 12, SE-41879 Gothenburg, Sweden; 3: Volvo Car Corporation, Material Centre, Volvo Jakobs väg, SE-418 78 Göteborg, Sweden |
| 11:15am - 11:45am |
Keynote - TBD Location: Cyber Auditorium |
| 11:45am - 12:15pm |
Closing session and Best Paper Award Location: Cyber Auditorium |
