Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Agenda Overview |
| 8:00am - 10:00am |
Exhibitor setup Location: Exhibition area |
Morning snack Location: Exhibition area |
| 8:00am - 1:00pm |
Registration - Day 1 Location: Exhibition area Please go to the registration desk in the Exhibition area to collect your badge. We also offer on-site registration via the conftool portal. |
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| 9:00am - 9:15am |
Opening Session - Open to public Location: Cyber Auditorium Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic The opening session is open to the public via registration as "exhibitor only" in the conftool portal. |
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| 9:15am - 10:00am |
Distinguisehd lecture by E. Jan Vardeman - Open to public Location: Cyber Auditorium Title: Growth Drivers and Limits for Advanced Packaging in the AI Data Center Era |
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| 10:00am - 10:30am |
Exhibitor presentations - open to public Location: Cyber Auditorium To access this session free of charge, register as "exhibition only" at www.nordpac.org |
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| 10:30am - 12:15pm |
Laboratory tour of KTH Location: Exhibition area Chair: Dr. Jiantong Li, KTH |
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| 12:15pm - 1:15pm |
Lunch - only for paying participants Location: Exhibition area |
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| 1:15pm - 2:00pm |
Realising the power of rail – how power electronics packaging and systems integration can shape the future of sustainable mobility - Ganesh Chandramouli, Alstrom Location: Cyber Auditorium Chair: Dr. Dag Andersson, RISE AB (Retired)
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| 2:00pm - 2:15pm |
Break Location: Exhibition area |
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| 2:15pm - 4:45pm |
Panel discussion on Packaging for quantum technology, power and emerging technologies Location: Cyber Auditorium Panel discussion chaired by Professor Mikael Östling, Professor of solid state electronics at KTH, Royal institute of Technology, Stockholm |
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| 5:00pm - 5:30pm |
IMAPS Nordic General Assembly Location: Cyber Auditorium Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic This meeting is open to the public, but only members can vote. |
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| 6:00pm - 8:00pm |
Welcome Reception Location: Exhibition area Please join us for a welcome reception in the exhibition area. There will be complimentary finger food and a few drinks. This is a perfrect setting for mingling and networking. |
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| 8:00am - 10:00am |
Morning snack Location: Exhibition area |
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| 9:00am - 9:45am |
PLA-Based Sustainable PCBs – a Possible Path for Greener Electronics - Prof.Attila Géczy Location: Cyber Auditorium Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic PLA-Based Sustainable PCBs – a Possible Path for Greener Electronics Prof. Attila Géczy, Budapest University of Technology and Economics |
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| 9:00am - 4:15pm |
Exhibition - Open to public Location: Exhibition area To access the exhibition free of charge, plese register as "exhibition only" at www.nordpac.org |
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| 9:45am - 10:15am |
Break Location: Exhibition area |
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| 10:15am - 12:15pm |
Reliability Location: Cyber Auditorium Chair: Prof. Rajan Ambat, Technical University of Denmark Automated Characterization of Surface Quality and Defects of Ceramic Multilayer Packages Technische Universität Ilmenau, Germany 10:39am - 11:03am Effect of PCB Moisture Absorption on Damage Evolution in Solder Joints Rise Research Institutes of Sweden, Sweden 11:03am - 11:27am CNN-Based Anisotropic Homogenization Finite Element Framework for PCB Warpage Analysis 1: Department of Aeronautics and Astronautics, National Cheng Kung University, Taiwan; 2: Simutech Solution Corp., Taiwan; 3: Department of Aeronautics and Astronautics, National Cheng Kung University, Taiwan 11:27am - 11:51am Coupled Multiphysics Simulation with Machine Learning Approach to predict humidity effects on PCB Surface Section of Materials and Surface Engineering, DTU Construct, Technical University of Denmark, Denmark 11:51am - 12:15pm Electronic Packaging Design for Humidity Robustness: Experimental and Modelling Approach Technical University of Denmark, Denmark |
Flexible and medical electronics Location: Aurora Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic Multi-Scale CNN-BiLSTM Network with Residual Kernel Attention for EEG Artifact Removal 1: Manipal Institute of Technology, Manipal, India; 2: Manipal Institute of Technology, Manipal, India; 3: Manipal Institute of Technology, Manipal, India 10:39am - 11:03am Direct Attachment of RFID IC to Self-Healing Polymer-Based Tag Antenna: Towards Self-Assembly Methods 1: Faculty of Medicine and Health Technology, Tampere University, Tampere, Finland; 2: Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, Finland 11:03am - 11:27am Bio-based TPU Smart Wound Dressing with Temperature and pH Sensing on a Skin-Conformal Patch 1: Fraunhofer IZM, Germany; 2: Essity GmbH, Germany; 3: Würth Elektronik GmbH, Germany 11:27am - 11:51am High-efficiency on-paper self-charging power sources Department of Electronics and Embedded Systems, KTH Royal Institute of Technology, Sweden 11:51am - 12:15pm Enabling Mutual Identification of Autonomous Vehicles via Battery‑less Ultrasonic Tags and 120‑GHz Radar Sensing 1: ChalmersIndustriTeknik, Sweden; 2: Beijing Institute of Technology (Zhuhai), China; 3: Centre for Wireless Innovation, School of Electronics, Electrical Engineering and Computer Science, Queen’s University Belfast, BT3 9DT Belfast, U.K. |
| 12:15pm - 1:15pm |
Lunch Location: Exhibition area |
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| 1:15pm - 2:45pm |
Short course: Self-healing materials for soft electronics - Dr. Naveen Tiwari Location: Cyber Auditorium Dr. Naveen Tiwari, Postdoctoral Research Fellow, Faculty of Medicine and Health Technology, Tampere University |
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| 2:45pm - 3:00pm |
Break Location: Exhibition area |
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| 3:00pm - 4:30pm |
Workshop - Chiplet Integration Technologies powered by APECS Location: Cyber Auditorium Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic The pilot line for »Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems« (APECS) is a central initiative within the EU Chips Act. It aims to accelerate innovation in chiplet technologies and strengthen Europe’s semiconductor research and manufacturing capabilities. The Workshop will be chaired by Felix Mohn (APECS) and Rolf Aschenbrenner (Fraunhofer IZM). |
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| 6:00pm - 9:00pm |
Conference Dinner - Boat trip Location: S/S Stockholm Join us on a beautiful cruise around the Stockholm arpellago on the S/S Stockholm. Meet up at https://maps.app.goo.gl/PohZfvvumqARMDgi9 at 1745. The boat leaves at 1800. Information about the trip can be found here: https://www.stromma.com/sv-se/stockholm/matkryssningar/middagskryssningar/ss-stockholm/ |
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| 8:00am - 10:00am |
Morning snack Location: Exhibition area |
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| 8:30am - 11:00am |
Materials and processes Location: Cyber Auditorium Chair: Dr. Jiantong Li, KTH Production-Proven Chemical-Free Green Alternative to Solvent and Piranha Wafer Processing using Ozone Shellback Semiconductor Equipment, United States of America 8:54am - 9:18am Micro-transfer-printing: Alternative to polymeric adhesive bonding Tyndall National Institute, Ireland 9:18am - 9:42am Optimising wire bond and chip assembly bond strength Smart Sensors and Microsystems, SINTEF Digital, Norway 9:42am - 10:06am Innovative UV Assisted Curing for Indium Based Low Melting Point µBumps used in Quantum Computing 1: 1SUSS MicroTec Solutions GmbH & Co. KG, Ferdinand-von-Steinbeis Ring 10, 75447 Sternenfels, Germany; 2: 2IMEC vzw, Kappeldreef 75, 3001 Leuven, Belgium; 3: Brewer Science, Inc., 2401 Brewer Drive, Rolla, MO 65401, USA 10:06am - 10:30am Active alignment of defractive elements for optoelectronic MEMS Smart Sensors and Microsystems, SINTEF Digital, Norway 10:30am - 10:54am Electrically Insulating Heat Spreaders for High-Power Electronics: A Comparative Study of Hexagonal Boron Nitride Composite and Graphene Laminate 1: Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, SE-412 96 Göteborg, Sweden; 2: SHT Smart High-Tech AB, Terminalvägen 12, SE-41879 Gothenburg, Sweden; 3: Volvo Car Corporation, Material Centre, Volvo Jakobs väg, SE-418 78 Göteborg, Sweden |
Advanced Packaging Location: Aurora Chair: Anders E. Petersen, Demant / Oticon Miniaturization of Low-Power DC-DC Converters Using PCB Embedding for Avionic Applications Technical University of Berlin, Germany 8:54am - 9:18am Gap filling processes for Quasi-Monolithic Integration applications Fraunhofer Institute for Photonic Microsystems, Dresden, Germany 9:18am - 9:42am Packaging challenges for energy-autonomous self-powered IoT sensing RISE Research Institutes of Sweden, Sweden 9:42am - 10:06am Biocomposite Substrates for Structural Electronics: Mechanical Limits, Lamination Challenges, and Commercial Design Constraints ORGANIC STEEL LTD 10:06am - 10:30am Glass Package Trends & Key Technology with Glass Core Evaluation Testing Method Grand Joint Technology 10:30am - 10:54am 1um glass via TGV formation by single-shot ultrafast Bessel pulses in GHz burst mode Enplas Corporation, Japan. |
| 11:00am - 11:15am |
Break Location: Exhibition area |
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| 11:15am - 11:45am |
Keynote - TBD Location: Cyber Auditorium |
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| 11:45am - 12:15pm |
Closing session and Best Paper Award Location: Cyber Auditorium |
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| 12:15pm - 1:15pm |
Lunch Location: Exhibition area |
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