Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Daily Overview |
| 8:00am - 10:00am |
Morning snack Location: Exhibition area |
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| 8:30am - 11:00am |
Materials and processes Location: Cyber Auditorium Chair: Dr. Jiantong Li, KTH Production-Proven Chemical-Free Green Alternative to Solvent and Piranha Wafer Processing using Ozone Shellback Semiconductor Equipment, United States of America 8:54am - 9:18am Micro-transfer-printing: Alternative to polymeric adhesive bonding Tyndall National Institute, Ireland 9:18am - 9:42am Optimising wire bond and chip assembly bond strength Smart Sensors and Microsystems, SINTEF Digital, Norway 9:42am - 10:06am Innovative UV Assisted Curing for Indium Based Low Melting Point µBumps used in Quantum Computing 1: 1SUSS MicroTec Solutions GmbH & Co. KG, Ferdinand-von-Steinbeis Ring 10, 75447 Sternenfels, Germany; 2: 2IMEC vzw, Kappeldreef 75, 3001 Leuven, Belgium; 3: Brewer Science, Inc., 2401 Brewer Drive, Rolla, MO 65401, USA 10:06am - 10:30am Active alignment of defractive elements for optoelectronic MEMS Smart Sensors and Microsystems, SINTEF Digital, Norway 10:30am - 10:54am Electrically Insulating Heat Spreaders for High-Power Electronics: A Comparative Study of Hexagonal Boron Nitride Composite and Graphene Laminate 1: Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, SE-412 96 Göteborg, Sweden; 2: SHT Smart High-Tech AB, Terminalvägen 12, SE-41879 Gothenburg, Sweden; 3: Volvo Car Corporation, Material Centre, Volvo Jakobs väg, SE-418 78 Göteborg, Sweden |
Advanced Packaging Location: Aurora Chair: Anders E. Petersen, Demant / Oticon Miniaturization of Low-Power DC-DC Converters Using PCB Embedding for Avionic Applications Technical University of Berlin, Germany 8:54am - 9:18am Gap filling processes for Quasi-Monolithic Integration applications Fraunhofer Institute for Photonic Microsystems, Dresden, Germany 9:18am - 9:42am Packaging challenges for energy-autonomous self-powered IoT sensing RISE Research Institutes of Sweden, Sweden 9:42am - 10:06am Biocomposite Substrates for Structural Electronics: Mechanical Limits, Lamination Challenges, and Commercial Design Constraints ORGANIC STEEL LTD 10:06am - 10:30am Glass Package Trends & Key Technology with Glass Core Evaluation Testing Method Grand Joint Technology 10:30am - 10:54am 1um glass via TGV formation by single-shot ultrafast Bessel pulses in GHz burst mode Enplas Corporation, Japan. |
| 11:00am - 11:15am |
Break Location: Exhibition area |
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| 11:15am - 11:45am |
Keynote - TBD Location: Cyber Auditorium |
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| 11:45am - 12:15pm |
Closing session and Best Paper Award Location: Cyber Auditorium |
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| 12:15pm - 1:15pm |
Lunch Location: Exhibition area |
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