Conference Agenda

Automated Characterization of Surface Quality and Defects of Ceramic Multilayer Packages

Sesha Gopal Selvakumar, Saba Zamankhani, Kai-Uwe Sattler, Heike Bartsch, Jens Müller

Technische Universität Ilmenau, Germany

Effect of PCB Moisture Absorption on Damage Evolution in Solder Joints

Saeed Akbari, Dag Andersson

Rise Research Institutes of Sweden, Sweden

CNN-Based Anisotropic Homogenization Finite Element Framework for PCB Warpage Analysis

Chin-Hung Lai¹, Shiu-Cheng Tsai², Yu-Jui Liang³

1: Department of Aeronautics and Astronautics, National Cheng Kung University, Taiwan; 2: Simutech Solution Corp., Taiwan; 3: Department of Aeronautics and Astronautics, National Cheng Kung University, Taiwan

Coupled Multiphysics Simulation with Machine Learning Approach to predict humidity effects on PCB Surface

Anish Rao Lakkaraju, Sajjad Bahrebar, Rajan Ambat

Section of Materials and Surface Engineering, DTU Construct, Technical University of Denmark, Denmark

Electronic Packaging Design for Humidity Robustness: Experimental and Modelling Approach

Rajan Ambat

Technical University of Denmark, Denmark

Multi-Scale CNN-BiLSTM Network with Residual Kernel Attention for EEG Artifact Removal

Subramanya G. Nayak¹, Vandana Akshath Raj², Ananthakrishna Thalengala³

1: Manipal Institute of Technology, Manipal, India; 2: Manipal Institute of Technology, Manipal, India; 3: Manipal Institute of Technology, Manipal, India

Direct Attachment of RFID IC to Self-Healing Polymer-Based Tag Antenna: Towards Self-Assembly Methods

Isra Yaqoob¹, Nikta Pournoori¹, Neea Oinas², Naveen Tiwari¹, Jarkko Tolvanen², Jari Juuti², Leena Ukkonen¹

1: Faculty of Medicine and Health Technology, Tampere University, Tampere, Finland; 2: Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, Finland

Bio-based TPU Smart Wound Dressing with Temperature and pH Sensing on a Skin-Conformal Patch

Barbara Pahl¹, Thomas Loeher¹, Soeren Lafendt², Stefan Bendig³

1: Fraunhofer IZM, Germany; 2: Essity GmbH, Germany; 3: Würth Elektronik GmbH, Germany

High-efficiency on-paper self-charging power sources

Yujie Fu, Zheng Li, Shiqian Chen, Jiantong Li

Department of Electronics and Embedded Systems, KTH Royal Institute of Technology, Sweden

Enabling Mutual Identification of Autonomous Vehicles via Battery‑less Ultrasonic Tags and 120‑GHz Radar Sensing

Siyu Ren², Xiangyu Lu², Chao Gu³, Zhongxia Simon He^1,2

1: ChalmersIndustriTeknik, Sweden; 2: Beijing Institute of Technology (Zhuhai), China; 3: Centre for Wireless Innovation, School of Electronics, Electrical Engineering and Computer Science, Queen’s University Belfast, BT3 9DT Belfast, U.K.