Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Tuesday, 10/June/2025 | |
| 8:00am - 10:00am |
MS1: Morning snack Location: Exhibition hall Pastry, fruit, coffee and tea available in the exhibition hall. |
| 8:00am - 1:00pm |
Reg1: Registration Location: Exhibition hall |
| 9:00am - 10:15am |
OS: Opening session and exhibitor presentations Location: Konferancesal Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic This session opens the conference and includes also presentations from our excellent exhibitors.
This session is open to all participants, also "exhibition only" |
| 10:15am - 11:00am |
CB1: Break - Tea, Coffee and networking Location: Exhibition hall |
| 11:00am - 12:00pm |
DL: Distringuisehd Lecture by John Lau, Unimicron Technology Corporation Location: Konferancesal Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic This session is open to all participants, also "exhibition only" passes. |
| 12:00pm - 1:00pm |
Lunch1: Lunch Location: Exhibition hall Only for paying participants |
| 1:00pm - 4:30pm |
WS_Photo: Workshop on Photonics sensing and packaging Location: Konferancesal Chair: Dr. Firehun Dullo, SINTEF AS Photonic platforms integrate multiple optical components into compact designs, enabling precise light control and manipulation. They have transformed traditionally bulky and expensive systems into miniaturized, cost-effective on-a chip devices with multi-modal integration and enhanced performance.
To fully realize the potential of photonics technology, advanced packaging is essential. This includes integrating light sources, detectors, and microfluidics using heterogeneous, monolithic, and hybrid approaches, along with microelectronics co-integration for seamless operation. This workshop will explore these advancements, addressing key challenges and innovations in photonics sensing and packaging to drive future breakthroughs |
| 5:00pm - 5:30pm |
IMAPS_GM: IMAPS Nordic General Meeting Location: Konferancesal Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic IMAPS Nordic General Meeting for IMAPS Nordic members. |
| 6:00pm - 9:00pm |
WR: Welcome reception Location: Exhibition hall Join us at the welcome reception with your fellow conference participants while enjoying the lovely Copenhagen evening. Finger food and drinks will be served. |
| Date: Wednesday, 11/June/2025 | ||
| 8:00am - 10:00am |
E_setup: Exhibitor setup Location: Exhibition hall |
MS2: Morning snack Location: Exhibition hall Pastry, fruit, coffee and tea available in the exhibition hall. |
| 9:00am - 9:45am |
Keynote 1: Thor Højlund Olsen, Demant - Amplifying innovation: Harnessing technology to revolutionize Hearing Healthcare Location: Konferancesal Chair: Anders E. Petersen, Demant / Oticon Thor Højlund Olsen, Demant - Amplifying innovation: Harnessing technology to revolutionize Hearing Healthcare |
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| 9:00am - 4:15pm |
Exh1: Exhibitions Location: Exhibition hall Open to all participants |
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| 9:45am - 10:15am |
CB2: Break - Tea, Coffee and networking Location: Exhibition hall |
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| 10:15am - 12:15pm |
T1A: Application of novel packaging technologies Location: Konferancesal Thick 3D Graphene coating with lower weight and enhanced heat dissipation 1: KTH Royal Institute of Technology, Sweden; 2: Uppsala University, Sweden 10:39am - 11:03am Reverse-offset printed flexible chips assembled on thermoplastic polyurethane: studies on mechanical tolerance 1: VTT Technical Research Centre of Finland Ltd, Finland; 2: Tampere University, Faculty of Information and Communication Sciences, Finland 11:03am - 11:27am Harnessing Genetic Algorithms for On-chip Programmable Optical Router Design Sharif University of Technology, Iran, Islamic Republic of 11:27am - 11:51am Nanosensor for Detection of Explosive Compounds CUNY, United States of America 11:51am - 12:15pm From Organic to Glass Core substrates: the journey of IC substrates to enable AI and HPC systems Yole Group, France |
T1B: Materials for packaging solutions Location: Room 104 Investigation how nanostructured silicon surfaces impact reactive bonding between silicon-silicon and silicon-low-temperature cofired ceramics 1: Department of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, Germany; 2: Production Technology Group, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, Germany; 3: Chair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany 10:39am - 11:03am Graphene based conductive inks on biodegradable substrates 1: SINTEF Industry, Norway; 2: SINTEF Digital / IMAPS Nordic, Norway; 3: LayerOne Materials AS, Norway; 4: Organic Steel 11:03am - 11:27am LTCC-Resistors for High Voltage Sensors 1: IMST GmbH, Kamp-Lintfort, Germany; 2: Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, Germany 11:27am - 11:51am Feasibility study of laterally sintered ceramic inserts in silicon substrate openings Technische Universität Ilmenau, Department of Electronics Technology, Germany 11:51am - 12:15pm E-align – preliminary tests for novel anisotropically conductive tape 1: SINTEF Digital / IMAPS Nordic, Norway; 2: Condalign AS, Oslo, Norway |
| 12:15pm - 1:15pm |
Lunch2: Lunch Location: Exhibition hall Only for paying participants |
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| 1:15pm - 4:15pm |
WS_Medical: WorkShop - A deep dive on Packaging Electronics for Implantable Medical Devices Location: Konferancesal Chair: Prof. anne vanhoestenberghe, King's College London Interactive workshop with a deep dive into packaging electronics for implantable medical device. A panel discussion with audience questions. |
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| 6:00pm - 10:00pm |
CD: Conference dinner Location: Konferancesal |
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| Date: Thursday, 12/June/2025 | ||
| 8:00am - 10:00am |
MS3: Morning snack Location: Exhibition hall Pastry, fruit, coffee and tea available in the exhibition hall. |
|
| 9:00am - 9:45am |
Keynote 2: Dr. Suzanne Costello, Forensic Eyes Ltd - Hermeticity of electronic packages: Can we really prove an ultra-low leak rate? Location: Konferancesal |
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| 9:00am - 2:00pm |
Exh2 Location: Exhibition hall Open to all participants |
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| 9:45am - 10:15am |
CB3: Break - Tea, Coffee and networking Location: Exhibition hall |
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| 10:15am - 12:15pm |
T2A: Reliability Location: Konferancesal Status of the Howl and Mann equation in different applications: Systematic Review KCL, United Kingdom 10:39am - 11:03am On the Stability of Silicone-Encapsulated CMOS ICs: Accelerated Life Testing for Implantable Electronics Imperial College London, United Kingdom 11:03am - 11:27am A concept for monitoring the failure risk of a power electronic component using a surrogate model Fraunhofer ENAS, Germany 11:27am - 11:51am Effect of applied voltage and condensation on dendritic growth mechanisms and subsequent thermal release on PCBs Technical University of Denmark, Denmark 11:51am - 12:15pm Improved Vacuum Performance and Temperature Uniformity in MEMS Packaging with the SRO Getter Through Advanced Tooling and System Design ATV Technologie GmbH, Germany |
T2B: Innovative packaging processes Location: Room 104 Advanced Laser-Assisted Technique for Bonding Miniature Multichannel Laser Diode to Silicon Photonics Circuit Tampere University, Finland 10:39am - 11:03am Advanced Microscopy Techniques for Accurate Alignment in Photonic Integration 1: Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; 2: Computational Imaging Group, ICT Faculty, Tampere University; 3: Advanced Coherent Sources Group, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; 4: Ampliconyx Oy, Finland; 5: TU Ilmenau, Germany 11:03am - 11:27am Cu sinter bonding for SiC power devices in air Korea Insititute of Industrial Technology (KITECH), Korea, Republic of (South Korea) 11:27am - 11:51am Al FPCB/Cu FPCB lap solder joints based on transient and steady thermal transfer methods Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea) 11:51am - 12:15pm Hermetic packaging challenges for a pressure sensor design MEMSCAP AS, Norway |
| 12:15pm - 1:15pm |
Lunch3: Lunch Location: Exhibition hall Only for paying participants |
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| 1:15pm - 2:00pm |
Keynote 3: Professor Rajan Ambat, DTU - Humidity Caused Failures in Electronics: Obstacle for use in Green Transition Technologies Location: Konferancesal Chair: Anders E. Petersen, Demant / Oticon |
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| 2:00pm - 2:30pm |
CLS: Closing session and Best Paper Awards Location: Konferancesal |
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