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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Date: Tuesday, 10/June/2025
8:00am - 10:00am	MS1: Morning snack Location: Exhibition hall Pastry, fruit, coffee and tea available in the exhibition hall.
8:00am - 1:00pm	Reg1: Registration Location: Exhibition hall
9:00am - 10:15am	OS: Opening session and exhibitor presentations Location: Konferancesal Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic This session opens the conference and includes also presentations from our excellent exhibitors. This session is open to all participants, also "exhibition only"
10:15am - 11:00am	CB1: Break - Tea, Coffee and networking Location: Exhibition hall
11:00am - 12:00pm	DL: Distringuisehd Lecture by John Lau, Unimicron Technology Corporation Location: Konferancesal Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic This session is open to all participants, also "exhibition only" passes.
12:00pm - 1:00pm	Lunch1: Lunch Location: Exhibition hall Only for paying participants
1:00pm - 4:30pm	WS_Photo: Workshop on Photonics sensing and packaging Location: Konferancesal Chair: Dr. Firehun Dullo, SINTEF AS Photonic platforms integrate multiple optical components into compact designs, enabling precise light control and manipulation. They have transformed traditionally bulky and expensive systems into miniaturized, cost-effective on-a chip devices with multi-modal integration and enhanced performance. To fully realize the potential of photonics technology, advanced packaging is essential. This includes integrating light sources, detectors, and microfluidics using heterogeneous, monolithic, and hybrid approaches, along with microelectronics co-integration for seamless operation. This workshop will explore these advancements, addressing key challenges and innovations in photonics sensing and packaging to drive future breakthroughs
5:00pm - 5:30pm	IMAPS_GM: IMAPS Nordic General Meeting Location: Konferancesal Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic IMAPS Nordic General Meeting for IMAPS Nordic members.
6:00pm - 9:00pm	WR: Welcome reception Location: Exhibition hall Join us at the welcome reception with your fellow conference participants while enjoying the lovely Copenhagen evening. Finger food and drinks will be served.

Date: Wednesday, 11/June/2025
8:00am - 10:00am	E_setup: Exhibitor setup Location: Exhibition hall	MS2: Morning snack Location: Exhibition hall Pastry, fruit, coffee and tea available in the exhibition hall.
9:00am - 9:45am	Keynote 1: Thor Højlund Olsen, Demant - Amplifying innovation: Harnessing technology to revolutionize Hearing Healthcare Location: Konferancesal Chair: Anders E. Petersen, Demant / Oticon Thor Højlund Olsen, Demant - Amplifying innovation: Harnessing technology to revolutionize Hearing Healthcare
9:00am - 4:15pm	Exh1: Exhibitions Location: Exhibition hall Open to all participants
9:45am - 10:15am	CB2: Break - Tea, Coffee and networking Location: Exhibition hall
10:15am - 12:15pm	T1A: Application of novel packaging technologies Location: Konferancesal 10:15am - 10:39am Thick 3D Graphene coating with lower weight and enhanced heat dissipation Yingchun Su¹, Zheng Li¹, Shiqian Chen¹, Wei Xia², Jiantong Li¹ 1: KTH Royal Institute of Technology, Sweden; 2: Uppsala University, Sweden 10:39am - 11:03am Reverse-offset printed flexible chips assembled on thermoplastic polyurethane: studies on mechanical tolerance Kim Eiroma¹, Katja Laine², Tuomas Happonen¹, Asko Sneck¹, Olli Halonen¹, Henrik Sandberg¹, Matti Mäntysalo², Jaakko Leppäniemi¹ 1: VTT Technical Research Centre of Finland Ltd, Finland; 2: Tampere University, Faculty of Information and Communication Sciences, Finland 11:03am - 11:27am Harnessing Genetic Algorithms for On-chip Programmable Optical Router Design Sanaz Zarei Sharif University of Technology, Iran, Islamic Republic of 11:27am - 11:51am Nanosensor for Detection of Explosive Compounds Bruce Kim, Thambiraj Selvarathinam, Reaz Uddin Bhuiyan CUNY, United States of America 11:51am - 12:15pm From Organic to Glass Core substrates: the journey of IC substrates to enable AI and HPC systems M.Bilal Hachemi Yole Group, France	T1B: Materials for packaging solutions Location: Room 104 10:15am - 10:39am Investigation how nanostructured silicon surfaces impact reactive bonding between silicon-silicon and silicon-low-temperature cofired ceramics Konrad Jaekel¹, Marcus Glaser², Yesenia Haydee Sauni Camposano³, Sebastian Matthes³, Peter Schaaf³, Jean Pierre Bergmann², Jens Müller¹, Heike Bartsch¹ 1: Department of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, Germany; 2: Production Technology Group, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, Germany; 3: Chair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany 10:39am - 11:03am Graphene based conductive inks on biodegradable substrates Donald Malcolm Evans¹, Kalpna Rajput¹, Vetle Øversjøen¹, Daniel Nilsen Wright², Morten Eikenes³, Bjørn Gading Solemsli³, Terje Didriksen¹, Tatu Luuk⁴ 1: SINTEF Industry, Norway; 2: SINTEF Digital / IMAPS Nordic, Norway; 3: LayerOne Materials AS, Norway; 4: Organic Steel 11:03am - 11:27am LTCC-Resistors for High Voltage Sensors Peter Uhlig¹, Richard Schmidt², Andreas Wien¹, Kathrin Reinhard², Stefan Körner², Sebastian Stark² 1: IMST GmbH, Kamp-Lintfort, Germany; 2: Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, Germany 11:27am - 11:51am Feasibility study of laterally sintered ceramic inserts in silicon substrate openings Michael Fischer, Cathleen Kleinholz, Alexander Schulz, Björn Müller, Jens Müller Technische Universität Ilmenau, Department of Electronics Technology, Germany 11:51am - 12:15pm E-align – preliminary tests for novel anisotropically conductive tape Daniel Wright¹, Guido Sordo¹, Alessandro Liberale¹, Øyvind Alsos², Erik Roede² 1: SINTEF Digital / IMAPS Nordic, Norway; 2: Condalign AS, Oslo, Norway
12:15pm - 1:15pm	Lunch2: Lunch Location: Exhibition hall Only for paying participants
1:15pm - 4:15pm	WS_Medical: WorkShop - A deep dive on Packaging Electronics for Implantable Medical Devices Location: Konferancesal Chair: Prof. anne vanhoestenberghe, King's College London Interactive workshop with a deep dive into packaging electronics for implantable medical device. A panel discussion with audience questions.
6:00pm - 10:00pm	CD: Conference dinner Location: Konferancesal

Date: Thursday, 12/June/2025
8:00am - 10:00am	MS3: Morning snack Location: Exhibition hall Pastry, fruit, coffee and tea available in the exhibition hall.
9:00am - 9:45am	Keynote 2: Dr. Suzanne Costello, Forensic Eyes Ltd - Hermeticity of electronic packages: Can we really prove an ultra-low leak rate? Location: Konferancesal
9:00am - 2:00pm	Exh2 Location: Exhibition hall Open to all participants
9:45am - 10:15am	CB3: Break - Tea, Coffee and networking Location: Exhibition hall
10:15am - 12:15pm	T2A: Reliability Location: Konferancesal 10:15am - 10:39am Status of the Howl and Mann equation in different applications: Systematic Review Melissa Tseung KCL, United Kingdom 10:39am - 11:03am On the Stability of Silicone-Encapsulated CMOS ICs: Accelerated Life Testing for Implantable Electronics Ahmad Shah Idil Imperial College London, United Kingdom 11:03am - 11:27am A concept for monitoring the failure risk of a power electronic component using a surrogate model Jain Chacko, Kshitij Anil Kolas, Sven Rzepka Fraunhofer ENAS, Germany 11:27am - 11:51am Effect of applied voltage and condensation on dendritic growth mechanisms and subsequent thermal release on PCBs Jyothsna Murli Rao, Leila Moazami, Anish Rao Lakkaraju, Kapil Kumar Gupta, Rajan Ambat Technical University of Denmark, Denmark 11:51am - 12:15pm Improved Vacuum Performance and Temperature Uniformity in MEMS Packaging with the SRO Getter Through Advanced Tooling and System Design Veit Große, Christian Hoffmann ATV Technologie GmbH, Germany	T2B: Innovative packaging processes Location: Room 104 10:15am - 10:39am Advanced Laser-Assisted Technique for Bonding Miniature Multichannel Laser Diode to Silicon Photonics Circuit Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina Tampere University, Finland 10:39am - 11:03am Advanced Microscopy Techniques for Accurate Alignment in Photonic Integration Aleksandr Vlasov¹, Igor Shevkunov², Karen Egiazarian², Andrei Gurovich^1,4, Denis Rozhkov⁵, Mikko Närhi³, Jukka Viheriälä¹, Mircea Guina¹ 1: Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; 2: Computational Imaging Group, ICT Faculty, Tampere University; 3: Advanced Coherent Sources Group, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; 4: Ampliconyx Oy, Finland; 5: TU Ilmenau, Germany 11:03am - 11:27am Cu sinter bonding for SiC power devices in air Dongjin Kim, YehRi Kim Korea Insititute of Industrial Technology (KITECH), Korea, Republic of (South Korea) 11:27am - 11:51am Al FPCB/Cu FPCB lap solder joints based on transient and steady thermal transfer methods Shin-Il Kim, Eunjin Jo, YehRi Kim, Dongjin Kim Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea) 11:51am - 12:15pm Hermetic packaging challenges for a pressure sensor design Åsmund Sandvand MEMSCAP AS, Norway
12:15pm - 1:15pm	Lunch3: Lunch Location: Exhibition hall Only for paying participants
1:15pm - 2:00pm	Keynote 3: Professor Rajan Ambat, DTU - Humidity Caused Failures in Electronics: Obstacle for use in Green Transition Technologies Location: Konferancesal Chair: Anders E. Petersen, Demant / Oticon
2:00pm - 2:30pm	CLS: Closing session and Best Paper Awards Location: Konferancesal

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