Index of Authors
A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding last name. Select the presentation in the right-hand column to access session and presentation details.
List Options: Authors and Sessions · Authors and Sessions (Short Titles) · Authors and Presentations
| Author(s) | Organisation(s) | Session |
|---|---|---|
| Alsos, Øyvind | Condalign AS, Oslo, Norway | Materials for packaging solutions |
| Ambat, Rajan | Technical University of Denmark, Denmark | Reliability Presenter |
| Bartsch, Heike | Department of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, Germany | Materials for packaging solutions |
| Belle, Branson | SINTEF Industry, Norway | Materials for packaging solutions |
| Bergmann, Jean Pierre | Production Technology Group, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, Germany | Materials for packaging solutions |
| Chacko, Jain | Fraunhofer ENAS, Germany | Reliability Presenter |
| Chen, Shiqian | KTH Royal Institute of Technology, Sweden | Application of novel packaging technologies |
| Didriksen, Terje | SINTEF Industry, Norway | Materials for packaging solutions |
| Egiazarian, Karen | Computational Imaging Group, Faculty of Information Technology and Communication Sciences, Tampere University | Innovative packaging processes |
| Eikenes, Morten | LayerOne Materials AS, Norway | Materials for packaging solutions |
| Eiroma, Kim | VTT Technical Research Centre of Finland Ltd, Finland | Application of novel packaging technologies Presenter |
| Evans, Donald Malcolm | SINTEF Industry, Norway | Materials for packaging solutions Presenter |
| Fischer, Michael | Technische Universität Ilmenau, Department of Electronics Technology, Germany | Materials for packaging solutions |
| Glaser, Marcus | Production Technology Group, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, Germany | Materials for packaging solutions |
| Große, Veit | ATV Technologie GmbH, Germany | Reliability |
| Guina, Mircea | Tampere University, Finland; Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University | Innovative packaging processes Innovative packaging processes |
| Gupta, Kapil Kumar | Technical University of Denmark, Denmark | Reliability |
| Gurovich, Andrei | Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; Ampliconyx Oy, Finland | Innovative packaging processes |
| Guttormson, Hjørtur | SINTEF Digital / IMAPS Nordic, Norway | Materials for packaging solutions |
| Hachemi, M.Bilal | Yole Group, France | Application of novel packaging technologies Presenter |
| Halonen, Olli | VTT Technical Research Centre of Finland Ltd, Finland | Application of novel packaging technologies |
| Happonen, Tuomas | VTT Technical Research Centre of Finland Ltd, Finland | Application of novel packaging technologies |
| Heaysman, Clare | London Institute for Healthcare Engineering, King’s College London, London, United Kingdom | Reliability |
| Hoffmann, Christian | ATV Technologie GmbH, Germany | Reliability |
| Jaekel, Konrad | Department of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, Germany | Materials for packaging solutions Presenter |
| Jo, Eunjin | Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea) | Innovative packaging processes |
| Kim, Bruce | The Grove School of Engineering, The City College of New York, USA | Application of novel packaging technologies Presenter |
| Kim, Dongjin | Korea Insititute of Industrial Technology (KITECH), Korea, Republic of (South Korea); Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea) | Innovative packaging processes Presenter Innovative packaging processes |
| Kim, Shin-Il | Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea) | Innovative packaging processes Presenter |
| Kim, YehRi | Korea Insititute of Industrial Technology (KITECH), Korea, Republic of (South Korea); Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea) | Innovative packaging processes Innovative packaging processes |
| Kleinholz, Cathleen | Technische Universität Ilmenau, Department of Electronics Technology, Germany | Materials for packaging solutions |
| Kolas, Kshitij Anil | Fraunhofer ENAS, Germany | Reliability |
| Körner, Stefan | Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, Germany | Materials for packaging solutions |
| Laine, Katja | Tampere University, Faculty of Information and Communication Sciences, Finland | Application of novel packaging technologies |
| Lakkaraju, Anish Rao | Technical University of Denmark, Denmark | Reliability |
| Lehtinen, Santeri | Tampere University, Finland | Innovative packaging processes |
| Leppäniemi, Jaakko | VTT Technical Research Centre of Finland Ltd, Finland | Application of novel packaging technologies |
| Li, Jiantong | KTH Royal Institute of Technology, Sweden | Application of novel packaging technologies Presenter |
| Li, Zheng | KTH Royal Institute of Technology, Sweden | Application of novel packaging technologies |
| Liberale, Alessandro | SINTEF Digital / IMAPS Nordic, Norway | Materials for packaging solutions |
| Luuk, Tatu | Organic Steel | Materials for packaging solutions |
| Mäntysalo, Matti | Tampere University, Faculty of Information and Communication Sciences, Finland | Application of novel packaging technologies |
| Matthes, Sebastian | Chair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany | Materials for packaging solutions |
| Moazami, Leila | Technical University of Denmark, Denmark | Reliability |
| Müller, Björn | Technische Universität Ilmenau, Department of Electronics Technology, Germany | Materials for packaging solutions |
| Müller, Jens | Department of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, Germany; Technische Universität Ilmenau, Department of Electronics Technology, Germany | Materials for packaging solutions Materials for packaging solutions Presenter |
| Närhi, Mikko | Advanced Coherent Sources Group, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University | Innovative packaging processes |
| Ng Tseung, Melissa | School of Biomedical Engineering & Imaging Sciences, King’s College London, London, United Kingdom | Reliability Presenter |
| Øversjøen, Vetle | SINTEF Industry, Norway | Materials for packaging solutions |
| Park, Jong W. | Korea Research Institute of Ships and Ocean, Daejeon, Korea. | Application of novel packaging technologies |
| Rajput, Kalpna | SINTEF Industry, Norway | Materials for packaging solutions |
| Rao, Jyothsna Murli | Technical University of Denmark, Denmark | Reliability |
| Reinhard, Kathrin | Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, Germany | Materials for packaging solutions |
| Roede, Erik | Condalign AS, Oslo, Norway | Materials for packaging solutions |
| Rozhkov, Denis | TU Ilmenau, Germany | Innovative packaging processes |
| Rzepka, Sven | Fraunhofer ENAS, Germany | Reliability |
| Salmi, Joel | Tampere University, Finland | Innovative packaging processes |
| Sandberg, Henrik | VTT Technical Research Centre of Finland Ltd, Finland | Application of novel packaging technologies |
| Sandvand, Åsmund | MEMSCAP AS, Norway | Innovative packaging processes Presenter |
| Sauni Camposano, Yesenia Haydee | Chair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany | Materials for packaging solutions |
| Schaaf, Peter | Chair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany | Materials for packaging solutions |
| Schmidt, Richard | Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, Germany | Materials for packaging solutions |
| Schulz, Alexander | Technische Universität Ilmenau, Department of Electronics Technology, Germany | Materials for packaging solutions |
| Selvarathinam, Thambiraj | The Grove School of Engineering, The City College of New York, USA | Application of novel packaging technologies |
| Shah Idil, Ahmad | Imperial College London, United Kingdom | Reliability Presenter |
| Shevkunov, Igor | Computational Imaging Group, Faculty of Information Technology and Communication Sciences, Tampere University | Innovative packaging processes |
| Sneck, Asko | VTT Technical Research Centre of Finland Ltd, Finland | Application of novel packaging technologies |
| Solemsli, Bjørn Gading | LayerOne Materials AS, Norway | Materials for packaging solutions |
| Sordo, Guido | SINTEF Digital / IMAPS Nordic, Norway | Materials for packaging solutions |
| Stark, Sebastian | Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, Germany | Materials for packaging solutions |
| Su, Yingchun | KTH Royal Institute of Technology, Sweden | Application of novel packaging technologies |
| Tuorila, Heidi | Tampere University, Finland | Innovative packaging processes |
| Uhlig, Peter | IMST GmbH, Kamp-Lintfort, Germany | Materials for packaging solutions Presenter |
| Vanhoestenberghe, Anne | School of Biomedical Engineering & Imaging Sciences, King’s College London, London, United Kingdom | Reliability |
| Viheriälä, Jukka | Tampere University, Finland; Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University | Innovative packaging processes Innovative packaging processes |
| Vlasov, Aleksandr | Tampere University, Finland; Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University | Innovative packaging processes Presenter Innovative packaging processes Presenter |
| Wien, Andreas | IMST GmbH, Kamp-Lintfort, Germany | Materials for packaging solutions |
| Wright, Daniel Nilsen | SINTEF Digital / IMAPS Nordic, Norway | Materials for packaging solutions Presenter Materials for packaging solutions |
| Xia, Wei | Uppsala University, Sweden | Application of novel packaging technologies |
| Yang, Juan | SINTEF Industry, Norway | Materials for packaging solutions |
| Zarei, Sanaz | Sharif University of Technology, Iran, Islamic Republic of | Application of novel packaging technologies Presenter |
