Index of Authors

A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding surname. Select the presentation in the right-hand column to access session and presentation details.

Session Overview
 
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List Options: Authors and Sessions · Authors and Sessions (Short Titles) · Authors and Presentations
 
Author(s) Organisation(s) Session
Alsos, ØyvindCondalign AS, Oslo, NorwayMaterials for packaging solutions  Presenter
Ambat, RajanTechnical University of Denmark, DenmarkReliability
Bartsch, HeikeDepartment of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, GermanyMaterials for packaging solutions
Bergmann, Jean PierreProduction Technology Group, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, GermanyMaterials for packaging solutions
Bhuiyan, Reaz UddinCUNY, United States of AmericaApplication of novel packaging technologies
Chacko, JainFraunhofer ENAS, GermanyReliability  Presenter
Chen, ShiqianKTH Royal Institute of Technology, SwedenApplication of novel packaging technologies
Didriksen, TerjeSINTEF Industry, NorwayMaterials for packaging solutions
Egiazarian, KarenComputational Imaging Group, ICT Faculty, Tampere UniversityInnovative packaging processes
Eikenes, MortenLayerOne Materials AS, NorwayMaterials for packaging solutions
Eiroma, KimVTT Technical Research Centre of Finland Ltd, FinlandApplication of novel packaging technologies  Presenter
Evans, Donald MalcolmSINTEF Industry, NorwayMaterials for packaging solutions  Presenter
Fischer, MichaelTechnische Universität Ilmenau, Department of Electronics Technology, GermanyMaterials for packaging solutions
Glaser, MarcusProduction Technology Group, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, GermanyMaterials for packaging solutions
Große, VeitATV Technologie GmbH, GermanyReliability
Guina, MirceaTampere University, Finland;
Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University		Innovative packaging processes
Innovative packaging processes
Gupta, Kapil KumarTechnical University of Denmark, DenmarkReliability
Gurovich, AndreiOptoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University;
Ampliconyx Oy, Finland		Innovative packaging processes
Hachemi, M.BilalYole Group, FranceApplication of novel packaging technologies  Presenter
Halonen, OlliVTT Technical Research Centre of Finland Ltd, FinlandApplication of novel packaging technologies
Happonen, TuomasVTT Technical Research Centre of Finland Ltd, FinlandApplication of novel packaging technologies
Hoffmann, ChristianATV Technologie GmbH, GermanyReliability
Jaekel, KonradDepartment of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, GermanyMaterials for packaging solutions  Presenter
Jo, EunjinKorea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea)Innovative packaging processes
Kim, BruceCUNY, United States of AmericaApplication of novel packaging technologies  Presenter
Kim, DongjinKorea Insititute of Industrial Technology (KITECH), Korea, Republic of (South Korea);
Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea)		Innovative packaging processes  Presenter
Innovative packaging processes
Kim, Shin-IlKorea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea)Innovative packaging processes  Presenter
Kim, YehRiKorea Insititute of Industrial Technology (KITECH), Korea, Republic of (South Korea);
Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea)		Innovative packaging processes
Innovative packaging processes
Kleinholz, CathleenTechnische Universität Ilmenau, Department of Electronics Technology, GermanyMaterials for packaging solutions
Kolas, Kshitij AnilFraunhofer ENAS, GermanyReliability
Körner, StefanFraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, GermanyMaterials for packaging solutions
Laine, KatjaTampere University, Faculty of Information and Communication Sciences, FinlandApplication of novel packaging technologies
Lakkaraju, Anish RaoTechnical University of Denmark, DenmarkReliability
Lehtinen, SanteriTampere University, FinlandInnovative packaging processes
Leppäniemi, JaakkoVTT Technical Research Centre of Finland Ltd, FinlandApplication of novel packaging technologies
Li, JiantongKTH Royal Institute of Technology, SwedenApplication of novel packaging technologies  Presenter
Li, ZhengKTH Royal Institute of Technology, SwedenApplication of novel packaging technologies
Liberale, AlessandroSINTEF Digital / IMAPS Nordic, NorwayMaterials for packaging solutions
Luuk, TatuOrganic SteelMaterials for packaging solutions
Mäntysalo, MattiTampere University, Faculty of Information and Communication Sciences, FinlandApplication of novel packaging technologies
Matthes, SebastianChair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, GermanyMaterials for packaging solutions
Moazami, LeilaTechnical University of Denmark, DenmarkReliability
Müller, BjörnTechnische Universität Ilmenau, Department of Electronics Technology, GermanyMaterials for packaging solutions
Müller, JensDepartment of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, Germany;
Technische Universität Ilmenau, Department of Electronics Technology, Germany		Materials for packaging solutions
Materials for packaging solutions  Presenter
Närhi, MikkoAdvanced Coherent Sources Group, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere UniversityInnovative packaging processes
Øversjøen, VetleSINTEF Industry, NorwayMaterials for packaging solutions
Rajput, KalpnaSINTEF Industry, NorwayMaterials for packaging solutions
Rao, Jyothsna MurliTechnical University of Denmark, DenmarkReliability  Presenter
Reinhard, KathrinFraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, GermanyMaterials for packaging solutions
Roede, ErikCondalign AS, Oslo, NorwayMaterials for packaging solutions
Rozhkov, DenisTU Ilmenau, GermanyInnovative packaging processes
Rzepka, SvenFraunhofer ENAS, GermanyReliability
Salmi, JoelTampere University, FinlandInnovative packaging processes
Sandberg, HenrikVTT Technical Research Centre of Finland Ltd, FinlandApplication of novel packaging technologies
Sandvand, ÅsmundMEMSCAP AS, NorwayInnovative packaging processes  Presenter
Sauni Camposano, Yesenia HaydeeChair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, GermanyMaterials for packaging solutions
Schaaf, PeterChair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, GermanyMaterials for packaging solutions
Schmidt, RichardFraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, GermanyMaterials for packaging solutions
Schulz, AlexanderTechnische Universität Ilmenau, Department of Electronics Technology, GermanyMaterials for packaging solutions
Selvarathinam, ThambirajCUNY, United States of AmericaApplication of novel packaging technologies
Shah Idil, AhmadImperial College London, United KingdomReliability  Presenter
Shevkunov, IgorComputational Imaging Group, ICT Faculty, Tampere UniversityInnovative packaging processes
Sneck, AskoVTT Technical Research Centre of Finland Ltd, FinlandApplication of novel packaging technologies
Solemsli, Bjørn GadingLayerOne Materials AS, NorwayMaterials for packaging solutions
Sordo, GuidoSINTEF Digital / IMAPS Nordic, NorwayMaterials for packaging solutions
Stark, SebastianFraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, GermanyMaterials for packaging solutions
Su, YingchunKTH Royal Institute of Technology, SwedenApplication of novel packaging technologies
Tseung, MelissaKCL, United KingdomReliability  Presenter
Tuorila, HeidiTampere University, FinlandInnovative packaging processes
Uhlig, PeterIMST GmbH, Kamp-Lintfort, GermanyMaterials for packaging solutions  Presenter
Viheriälä, JukkaTampere University, Finland;
Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University		Innovative packaging processes
Innovative packaging processes
Vlasov, AleksandrTampere University, Finland;
Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University		Innovative packaging processes  Presenter
Innovative packaging processes  Presenter
Wien, AndreasIMST GmbH, Kamp-Lintfort, GermanyMaterials for packaging solutions
Wright, Daniel NilsenSINTEF Digital / IMAPS Nordic, NorwayMaterials for packaging solutions
Materials for packaging solutions
Xia, WeiUppsala University, SwedenApplication of novel packaging technologies
Zarei, SanazSharif University of Technology, Iran, Islamic Republic ofApplication of novel packaging technologies  Presenter