Conference Agenda

Investigation how nanostructured silicon surfaces impact reactive bonding between silicon-silicon and silicon-low-temperature cofired ceramics

Konrad Jaekel¹, Marcus Glaser², Yesenia Haydee Sauni Camposano³, Sebastian Matthes³, Peter Schaaf³, Jean Pierre Bergmann², Jens Müller¹, Heike Bartsch¹

1: Department of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, Germany; 2: Production Technology Group, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, Germany; 3: Chair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany

Graphene based conductive inks on biodegradable substrates

Donald Malcolm Evans¹, Kalpna Rajput¹, Vetle Øversjøen¹, Daniel Nilsen Wright², Morten Eikenes³, Bjørn Gading Solemsli³, Terje Didriksen¹, Tatu Luuk⁴

1: SINTEF Industry, Norway; 2: SINTEF Digital / IMAPS Nordic, Norway; 3: LayerOne Materials AS, Norway; 4: Organic Steel

LTCC-Resistors for High Voltage Sensors

Peter Uhlig¹, Richard Schmidt², Andreas Wien¹, Kathrin Reinhard², Stefan Körner², Sebastian Stark²

1: IMST GmbH, Kamp-Lintfort, Germany; 2: Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, Germany

Feasibility study of laterally sintered ceramic inserts in silicon substrate openings

Michael Fischer, Cathleen Kleinholz, Alexander Schulz, Björn Müller, Jens Müller

Technische Universität Ilmenau, Department of Electronics Technology, Germany

E-align – preliminary tests for novel anisotropically conductive tape

Daniel Wright¹, Guido Sordo¹, Alessandro Liberale¹, Øyvind Alsos², Erik Roede²

1: SINTEF Digital / IMAPS Nordic, Norway; 2: Condalign AS, Oslo, Norway

Advanced Laser-Assisted Technique for Bonding Miniature Multichannel Laser Diode to Silicon Photonics Circuit

Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina

Tampere University, Finland

Advanced Microscopy Techniques for Accurate Alignment in Photonic Integration

Aleksandr Vlasov¹, Igor Shevkunov², Karen Egiazarian², Andrei Gurovich^1,4, Denis Rozhkov⁵, Mikko Närhi³, Jukka Viheriälä¹, Mircea Guina¹

1: Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; 2: Computational Imaging Group, ICT Faculty, Tampere University; 3: Advanced Coherent Sources Group, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; 4: Ampliconyx Oy, Finland; 5: TU Ilmenau, Germany

Cu sinter bonding for SiC power devices in air

Dongjin Kim, YehRi Kim

Korea Insititute of Industrial Technology (KITECH), Korea, Republic of (South Korea)

Al FPCB/Cu FPCB lap solder joints based on transient and steady thermal transfer methods

Shin-Il Kim, Eunjin Jo, YehRi Kim, Dongjin Kim

Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea)

Hermetic packaging challenges for a pressure sensor design

Åsmund Sandvand

MEMSCAP AS, Norway