Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview | |
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Location: Konferancesal Ground Floor |
| Date: Tuesday, 10/June/2025 | |
| 9:00am - 10:15am |
OS: Opening session and exhibitor presentations Location: Konferancesal Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic This session opens the conference and includes also presentations from our excellent exhibitors.
This session is open to all participants, also "exhibition only" |
| 11:00am - 12:00pm |
DL: Distringuisehd Lecture by John Lau, Unimicron Technology Corporation Location: Konferancesal Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic This session is open to all participants, also "exhibition only" passes. |
| 1:00pm - 4:30pm |
WS_Photo: Workshop on Photonics sensing and packaging Location: Konferancesal Chair: Dr. Firehun Dullo, SINTEF AS Photonic platforms integrate multiple optical components into compact designs, enabling precise light control and manipulation. They have transformed traditionally bulky and expensive systems into miniaturized, cost-effective on-a chip devices with multi-modal integration and enhanced performance.
To fully realize the potential of photonics technology, advanced packaging is essential. This includes integrating light sources, detectors, and microfluidics using heterogeneous, monolithic, and hybrid approaches, along with microelectronics co-integration for seamless operation. This workshop will explore these advancements, addressing key challenges and innovations in photonics sensing and packaging to drive future breakthroughs |
| 5:00pm - 5:30pm |
IMAPS_GM: IMAPS Nordic General Meeting Location: Konferancesal Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic IMAPS Nordic General Meeting for IMAPS Nordic members. |
| Date: Wednesday, 11/June/2025 | |
| 9:00am - 9:45am |
Keynote 1: Thor Højlund Olsen, Demant - Amplifying innovation: Harnessing technology to revolutionize Hearing Healthcare Location: Konferancesal Chair: Anders E. Petersen, Demant / Oticon Thor Højlund Olsen, Demant - Amplifying innovation: Harnessing technology to revolutionize Hearing Healthcare |
| 10:15am - 12:15pm |
T1A: Application of novel packaging technologies Location: Konferancesal Thick 3D Graphene coating with lower weight and enhanced heat dissipation 1: KTH Royal Institute of Technology, Sweden; 2: Uppsala University, Sweden 10:39am - 11:03am Reverse-offset printed flexible chips assembled on thermoplastic polyurethane: studies on mechanical tolerance 1: VTT Technical Research Centre of Finland Ltd, Finland; 2: Tampere University, Faculty of Information and Communication Sciences, Finland 11:03am - 11:27am Harnessing Genetic Algorithms for On-chip Programmable Optical Router Design Sharif University of Technology, Iran, Islamic Republic of 11:27am - 11:51am Nanosensor for Detection of Explosive Compounds CUNY, United States of America 11:51am - 12:15pm From Organic to Glass Core substrates: the journey of IC substrates to enable AI and HPC systems Yole Group, France |
| 1:15pm - 4:15pm |
WS_Medical: WorkShop - A deep dive on Packaging Electronics for Implantable Medical Devices Location: Konferancesal Chair: Prof. anne vanhoestenberghe, King's College London Interactive workshop with a deep dive into packaging electronics for implantable medical device. A panel discussion with audience questions. |
| 6:00pm - 10:00pm |
CD: Conference dinner Location: Konferancesal |
| Date: Thursday, 12/June/2025 | |
| 9:00am - 9:45am |
Keynote 2: Dr. Suzanne Costello, Forensic Eyes Ltd - Hermeticity of electronic packages: Can we really prove an ultra-low leak rate? Location: Konferancesal |
| 10:15am - 12:15pm |
T2A: Reliability Location: Konferancesal Status of the Howl and Mann equation in different applications: Systematic Review KCL, United Kingdom 10:39am - 11:03am On the Stability of Silicone-Encapsulated CMOS ICs: Accelerated Life Testing for Implantable Electronics Imperial College London, United Kingdom 11:03am - 11:27am A concept for monitoring the failure risk of a power electronic component using a surrogate model Fraunhofer ENAS, Germany 11:27am - 11:51am Effect of applied voltage and condensation on dendritic growth mechanisms and subsequent thermal release on PCBs Technical University of Denmark, Denmark 11:51am - 12:15pm Improved Vacuum Performance and Temperature Uniformity in MEMS Packaging with the SRO Getter Through Advanced Tooling and System Design ATV Technologie GmbH, Germany |
| 1:15pm - 2:00pm |
Keynote 3: Professor Rajan Ambat, DTU - Humidity Caused Failures in Electronics: Obstacle for use in Green Transition Technologies Location: Konferancesal Chair: Anders E. Petersen, Demant / Oticon |
| 2:00pm - 2:30pm |
CLS: Closing session and Best Paper Awards Location: Konferancesal |
Contact and Legal Notice · Contact Address:  Privacy Statement · Conference: NordPac 2025 |
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