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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Date: Thursday, 12/June/2025
8:00am - 10:00am	MS3: Morning snack Location: Exhibition hall Pastry, fruit, coffee and tea available in the exhibition hall.
9:00am - 9:45am	Keynote 2: Dr. Suzanne Costello, Forensic Eyes Ltd - Hermeticity of electronic packages: Can we really prove an ultra-low leak rate? Location: Konferancesal
9:00am - 2:00pm	Exh2 Location: Exhibition hall Open to all participants
9:45am - 10:15am	CB3: Break - Tea, Coffee and networking Location: Exhibition hall
10:15am - 12:15pm	T2A: Reliability Location: Konferancesal 10:15am - 10:39am Status of the Howl and Mann equation in different applications: Systematic Review Melissa Tseung KCL, United Kingdom 10:39am - 11:03am On the Stability of Silicone-Encapsulated CMOS ICs: Accelerated Life Testing for Implantable Electronics Ahmad Shah Idil Imperial College London, United Kingdom 11:03am - 11:27am A concept for monitoring the failure risk of a power electronic component using a surrogate model Jain Chacko, Kshitij Anil Kolas, Sven Rzepka Fraunhofer ENAS, Germany 11:27am - 11:51am Effect of applied voltage and condensation on dendritic growth mechanisms and subsequent thermal release on PCBs Jyothsna Murli Rao, Leila Moazami, Anish Rao Lakkaraju, Kapil Kumar Gupta, Rajan Ambat Technical University of Denmark, Denmark 11:51am - 12:15pm Improved Vacuum Performance and Temperature Uniformity in MEMS Packaging with the SRO Getter Through Advanced Tooling and System Design Veit Große, Christian Hoffmann ATV Technologie GmbH, Germany	T2B: Innovative packaging processes Location: Room 104 10:15am - 10:39am Advanced Laser-Assisted Technique for Bonding Miniature Multichannel Laser Diode to Silicon Photonics Circuit Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina Tampere University, Finland 10:39am - 11:03am Advanced Microscopy Techniques for Accurate Alignment in Photonic Integration Aleksandr Vlasov¹, Igor Shevkunov², Karen Egiazarian², Andrei Gurovich^1,4, Denis Rozhkov⁵, Mikko Närhi³, Jukka Viheriälä¹, Mircea Guina¹ 1: Optoelectronics Research Center, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; 2: Computational Imaging Group, ICT Faculty, Tampere University; 3: Advanced Coherent Sources Group, Physics Unit, Faculty of Engineering and Natural Sciences, Tampere University; 4: Ampliconyx Oy, Finland; 5: TU Ilmenau, Germany 11:03am - 11:27am Cu sinter bonding for SiC power devices in air Dongjin Kim, YehRi Kim Korea Insititute of Industrial Technology (KITECH), Korea, Republic of (South Korea) 11:27am - 11:51am Al FPCB/Cu FPCB lap solder joints based on transient and steady thermal transfer methods Shin-Il Kim, Eunjin Jo, YehRi Kim, Dongjin Kim Korea Institute of Industrial Technology (KITECH), 21999, Yeonsu-gu, Incheon, Republic of Korea, Korea, Republic of (South Korea) 11:51am - 12:15pm Hermetic packaging challenges for a pressure sensor design Åsmund Sandvand MEMSCAP AS, Norway
12:15pm - 1:15pm	Lunch3: Lunch Location: Exhibition hall Only for paying participants
1:15pm - 2:00pm	Keynote 3: Professor Rajan Ambat, DTU - Humidity Caused Failures in Electronics: Obstacle for use in Green Transition Technologies Location: Konferancesal Chair: Anders E. Petersen, Demant / Oticon
2:00pm - 2:30pm	CLS: Closing session and Best Paper Awards Location: Konferancesal

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