Conference Agenda

Thick 3D Graphene coating with lower weight and enhanced heat dissipation

Yingchun Su¹, Zheng Li¹, Shiqian Chen¹, Wei Xia², Jiantong Li¹

1: KTH Royal Institute of Technology, Sweden; 2: Uppsala University, Sweden

Reverse-offset printed flexible chips assembled on thermoplastic polyurethane: studies on mechanical tolerance

Kim Eiroma¹, Katja Laine², Tuomas Happonen¹, Asko Sneck¹, Olli Halonen¹, Henrik Sandberg¹, Matti Mäntysalo², Jaakko Leppäniemi¹

1: VTT Technical Research Centre of Finland Ltd, Finland; 2: Tampere University, Faculty of Information and Communication Sciences, Finland

Harnessing Genetic Algorithms for On-chip Programmable Optical Router Design

Sanaz Zarei

Sharif University of Technology, Iran, Islamic Republic of

Nanosensor for Detection of Explosive Compounds

Bruce Kim, Thambiraj Selvarathinam, Reaz Uddin Bhuiyan

CUNY, United States of America

From Organic to Glass Core substrates: the journey of IC substrates to enable AI and HPC systems

M.Bilal Hachemi

Yole Group, France

Investigation how nanostructured silicon surfaces impact reactive bonding between silicon-silicon and silicon-low-temperature cofired ceramics

Konrad Jaekel¹, Marcus Glaser², Yesenia Haydee Sauni Camposano³, Sebastian Matthes³, Peter Schaaf³, Jean Pierre Bergmann², Jens Müller¹, Heike Bartsch¹

1: Department of Electrical Engineering and Information Technology, Institute of Micro- and Nanotechnologies MacroNano, Electronics Technology Group, Technische Universität Ilmenau, Germany; 2: Production Technology Group, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, Germany; 3: Chair of Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnologies MacroNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany

Graphene based conductive inks on biodegradable substrates

Donald Malcolm Evans¹, Kalpna Rajput¹, Vetle Øversjøen¹, Daniel Nilsen Wright², Morten Eikenes³, Bjørn Gading Solemsli³, Terje Didriksen¹, Tatu Luuk⁴

1: SINTEF Industry, Norway; 2: SINTEF Digital / IMAPS Nordic, Norway; 3: LayerOne Materials AS, Norway; 4: Organic Steel

LTCC-Resistors for High Voltage Sensors

Peter Uhlig¹, Richard Schmidt², Andreas Wien¹, Kathrin Reinhard², Stefan Körner², Sebastian Stark²

1: IMST GmbH, Kamp-Lintfort, Germany; 2: Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Dresden, Germany

Feasibility study of laterally sintered ceramic inserts in silicon substrate openings

Michael Fischer, Cathleen Kleinholz, Alexander Schulz, Björn Müller, Jens Müller

Technische Universität Ilmenau, Department of Electronics Technology, Germany

E-align – preliminary tests for novel anisotropically conductive tape

Daniel Wright¹, Guido Sordo¹, Alessandro Liberale¹, Øyvind Alsos², Erik Roede²

1: SINTEF Digital / IMAPS Nordic, Norway; 2: Condalign AS, Oslo, Norway