Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Tuesday, 10/June/2025
8:00am
-
10:00am
E_setup: Exhibitor setup
Location: Exhibition hall
MS1: Morning snack
Location: Exhibition hall
Pastry, fruit, coffee and tea available in the exhibition hall.
8:00am
-
1:00pm
Reg1: Registration
Location: Exhibition hall
9:00am
-
9:15am
OS: Opening session
Location: Konferancesal
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic
This session opens the conference .
This session is open to all participants, also "exhibition only"
9:15am
-
10:15am
DL: Distringuisehd Lecture by John Lau, Unimicron Technology Corporation
Location: Konferancesal
Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
This session is open to all participants, also "exhibition only" passes.
10:15am
-
11:00am
CB1: Break - Tea, Coffee and networking
Location: Exhibition hall
11:00am
-
12:00pm
EP: Exhibitors' presenations
Location: Konferancesal
Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN)
Please join this session to explore the products and services offered by our fantastic exhibitors. Accessible to participants with "exhibitor only" pass.
12:00pm
-
1:00pm
Lunch1: Lunch
Location: Exhibition hall
Only for paying participants
1:00pm
-
4:30pm
WS_Photo: Workshop on Photonics sensing and packaging
Location: Konferancesal
Chair: Dr. Firehun Dullo, SINTEF AS
Photonic platforms integrate multiple optical components into compact designs, enabling precise light control and manipulation. They have transformed traditionally bulky and expensive systems into miniaturized, cost-effective on-a chip devices with multi-modal integration and enhanced performance.
To fully realize the potential of photonics technology, advanced packaging is essential. This includes integrating light sources, detectors, and microfluidics using heterogeneous, monolithic, and hybrid approaches, along with microelectronics co-integration for seamless operation.
This workshop will explore these advancements, addressing key challenges and innovations in photonics sensing and packaging to drive future breakthroughs
6:00pm
-
8:00pm
WR: Welcome reception
Location: Exhibition hall
Join us at the welcome reception with your fellow conference participants while enjoying the lovely Copenhagen evening. Finger food and drinks will be served.
During the welcome reception we will have short talks by
- Demant, event collaborator
- Innovation Norway, Steinar Brede – information on the Nordic chip Collaboration

 
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