NordPac 2023
The Nordic Conference on Microelectronics Packaging
12th – 14th June 2023
Oslo Science Park, Oslo, Norway
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Monday, 12/June/2023 | |
| 9:00am - 12:00pm |
SC1: Short course 1: Fan-out, Fan-in, and Heterogeneous Integration Packaging - John Lau Fan-out, Fan-in, and Heterogeneous Integration Packaging - John Lau
Requires full registration |
| 12:00pm - 1:00pm |
Short course lunch Requires full registration |
| 1:00pm - 4:00pm |
SC2: Short course 2 - Solid-Liquid Interdiffusion (SLID) Bonding – for Challenges in Microsystem Bonding - Knut Eilif Aasmundtveit & Vesa Vuorinen Location: Faros - Toppsenteret Short course 2 - Solid-Liquid Interdiffusion (SLID) Bonding – for Challenges in Microsystem Bonding - Knut Eilif Aasmundtveit & Vesa Vuorinen Requires full registration |
| 4:00pm - 4:30pm |
INAM: IMAPS Nordic Annual Meeting Location: Faros - Toppsenteret Free admission to IMAPS Nordic members |
| 6:00pm - 9:00pm |
WR: Welcome Reception with SINTEF MiNaLab Clean Room Lab Tour Location: Toppsenteret - roof terrace Requires full registration |
| Date: Tuesday, 13/June/2023 | ||
| 8:45am - 3:00pm |
Reg: Registration Location: Exhibitions Lounge - Toppsenteret |
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| 9:00am - 9:20am |
OS: Opening session Location: Faros - Toppsenteret Chair: Heidi Lundén, Schott Primoceler Oy For free entry, register as "Exhibition Visitor" |
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| 9:20am - 10:50am |
ExP: Exhibitor Presentations Location: Faros - Toppsenteret Chair: Dr. Daniel Wright, SINTEF Digital Exhibitor Presentations For free entry, register as "Exhibition Visitor" |
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| 10:50am - 11:15am |
CB1: Coffee and tea break with exhibition Location: Exhibitions Lounge - Toppsenteret Requires full registration |
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| 10:50am - 5:15pm |
Exh1: Exhibition Location: Exhibitions Lounge - Toppsenteret For free entry register as "Exhibition visitor" |
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| 11:15am - 12:00pm |
Keynote 1: Reliability of Active Implantable Devices: can we predict, and prevent, failure? - Anne Vanhoestenberghe, King’s College London Location: Faros - Toppsenteret Chair: Heidi Lundén, Schott Primoceler Oy
Requires full registration |
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| 12:00pm - 12:45pm |
LT: Lunch Location: Exhibitions Lounge - Toppsenteret Requires full registration |
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| 12:45pm - 3:00pm |
T1A: Innovative packaging processes Location: Hagen 3 Chair: Paul Collander, IMAPS Nordic Requires full registration |
T1B: Reliabitlity Location: Hagen 2 Chair: Dag Andersson, RISE AB Requires full registration |
| 3:00pm - 3:30pm |
CB2: Coffee and tea break with exhibition Location: Exhibitions Lounge - Toppsenteret Requires full registration |
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| 3:30pm - 4:00pm |
Keynote 2: Glass packaging as enabling element - Antti Peltonen, Schott Primoceler Location: Faros - Toppsenteret Chair: Dr. Daniel Wright, SINTEF Digital Requires full registration |
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| 4:00pm - 5:00pm |
IEEE_DL: IEEE EPS Distinguished Lecture - John Lau Location: Faros - Toppsenteret Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN) Open to the public.
For free entry, register as "Exhibition Visitor" |
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| 7:00pm - 11:00pm |
CD: Conference Dinner Location: Holmenkollen Scandic Park Requires full registration |
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Contact and Legal Notice · Contact Address:  Privacy Statement · Conference: NordPac 2023 |
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