Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Monday, 12/June/2023
9:00am
-
12:00pm
SC1: Short course 1: Fan-out, Fan-in, and Heterogeneous Integration Packaging - John Lau
Fan-out, Fan-in, and Heterogeneous Integration Packaging - John Lau
Requires full registration
12:00pm
-
1:00pm
Short course lunch
Requires full registration
1:00pm
-
4:00pm
SC2: Short course 2 - Solid-Liquid Interdiffusion (SLID) Bonding – for Challenges in Microsystem Bonding - Knut Eilif Aasmundtveit & Vesa Vuorinen
Location: Faros - Toppsenteret
Short course 2 - Solid-Liquid Interdiffusion (SLID) Bonding – for Challenges in Microsystem Bonding - Knut Eilif Aasmundtveit & Vesa Vuorinen
Requires full registration
4:00pm
-
4:30pm
INAM: IMAPS Nordic Annual Meeting
Location: Faros - Toppsenteret
Free admission to IMAPS Nordic members
6:00pm
-
9:00pm
WR: Welcome Reception with SINTEF MiNaLab Clean Room Lab Tour
Location: Toppsenteret - roof terrace
Requires full registration
Date: Tuesday, 13/June/2023
8:45am
-
3:00pm
Reg: Registration
Location: Exhibitions Lounge - Toppsenteret
9:00am
-
9:20am
OS: Opening session
Location: Faros - Toppsenteret
Chair: Heidi Lundén, Schott Primoceler Oy
For free entry, register as "Exhibition Visitor"
9:20am
-
10:50am
ExP: Exhibitor Presentations
Location: Faros - Toppsenteret
Chair: Dr. Daniel Wright, SINTEF Digital
Exhibitor Presentations
For free entry, register as "Exhibition Visitor"
10:50am
-
11:15am
CB1: Coffee and tea break with exhibition
Location: Exhibitions Lounge - Toppsenteret
Requires full registration
10:50am
-
5:15pm
Exh1: Exhibition
Location: Exhibitions Lounge - Toppsenteret
For free entry register as "Exhibition visitor"
11:15am
-
12:00pm
Keynote 1: Reliability of Active Implantable Devices: can we predict, and prevent, failure? - Anne Vanhoestenberghe, King’s College London
Location: Faros - Toppsenteret
Chair: Heidi Lundén, Schott Primoceler Oy
Requires full registration
12:00pm
-
12:45pm
LT: Lunch
Location: Exhibitions Lounge - Toppsenteret
Requires full registration
12:45pm
-
3:00pm
T1A: Innovative packaging processes
Location: Hagen 3
Chair: Paul Collander, IMAPS Nordic
Requires full registration
T1B: Reliabitlity
Location: Hagen 2
Chair: Dag Andersson, RISE AB
Requires full registration
3:00pm
-
3:30pm
CB2: Coffee and tea break with exhibition
Location: Exhibitions Lounge - Toppsenteret
Requires full registration
3:30pm
-
4:00pm
Keynote 2: Glass packaging as enabling element - Antti Peltonen, Schott Primoceler
Location: Faros - Toppsenteret
Chair: Dr. Daniel Wright, SINTEF Digital
Requires full registration
4:00pm
-
5:00pm
IEEE_DL: IEEE EPS Distinguished Lecture - John Lau
Location: Faros - Toppsenteret
Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN)
Open to the public. For free entry, register as "Exhibition Visitor"
7:00pm
-
11:00pm
CD: Conference Dinner
Location: Holmenkollen Scandic Park
Requires full registration
Date: Wednesday, 14/June/2023
9:00am
-
3:15pm
Exh2: Exhibition
Location: Exhibitions Lounge - Toppsenteret
For free entry, register as "Exhibition Visitor"
9:00am
-
9:45am
Keynote 3: The role of packaging in IoT product development - Dr. Maaike M. Visser Taklo, Sonitor Technologies AS
Location: Faros - Toppsenteret
Chair: Dr. Daniel Wright, SINTEF Digital
Requires full registration
9:45am
-
10:15am
Keynote 4: Euro Chips act – The need for a full ecosystem approach - Jan Pedersen, NCAB GROUP
Location: Faros - Toppsenteret
Chair: Dag Andersson, RISE AB
Requires full registration
10:15am
-
10:45am
CB3: Coffee and Tea break
Location: Exhibitions Lounge - Toppsenteret
10:45am
-
1:00pm
W1A: Application of novel packaging technologies
Location: Hagen 2
Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd.
W1B: Materias for packaging solutions
Location: Hagen 3
Chair: Johan Liu, Chalmers Technical University
1:00pm
-
2:15pm
LW: Lunch
Location: Exhibitions Lounge - Toppsenteret
2:15pm
-
3:00pm
Keynote 5: Interconnect Reliability: From the Chip to the System - Dr. Dongkai Shangguan, Indium Corporation
Location: Faros - Toppsenteret
Chair: Johan Liu, Chalmers Technical University
Requires full registration
3:00pm
-
3:30pm
CLS: Closing Session
Location: Faros - Toppsenteret
Chair: Heidi Lundén, Schott Primoceler Oy

 
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