NordPac 2022

The Nordic Conference on Microelectronics Packaging

12th – 14th June 2022

Chalmers University of Technology, Gothenburg, Sweden

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Date: Sunday, 12/June/2022
9:00am - 12:00pm	SC1: Climatic reliability of electronics and prevention strategies Location: MC2 - 8th Floor Room Fasrummet Course author: Dr. Rajan Ambat The course is complimentary to registered participants.
12:00pm - 1:00pm	Short course lunch Location: MC2 - 8th Floor Room Fasrummet The lunch is complimentary to short course attendees.
1:00pm - 4:00pm	SC2: Life Prediction of Power Electronic Components based on Thermal Modelling Location: MC2 - 8th Floor Room Fasrummet Course authors: Francesco Iannuzzo and Amir Sajjad Bahman This short course is complimentary to conference participants.
6:00pm - 9:00pm	CP: Cocktail Party Location: Wijkanders Restaurant The cocktail party is a long tradition at IMAPS Nordic conferences. We serve finger food and drinks and facilitate easy networking between conference participants. The event is complimentary for conference participants.

Date: Monday, 13/June/2022
8:45am - 3:00pm	Reg: Registration Location: Exhibition area - MC2 4th floor Conference registration is possible at the dedicated desk in the Foyer of the MC1 building. If you wish to attend the exhibition for free, please register at the registration desk first.
9:00am - 9:30am	OS: Opening session Location: Kollektorn Auditorium - MC2 4th floor
9:30am - 10:15am	Keynote 1: Electronics Industry Growth Markets: Package Choices, Challenges, and Trends - E. Jan Vardaman Location: Kollektorn Auditorium - MC2 4th floor Chair: Dr. Dag Andersson, RISE IVF AB Author: E. Jan Vardaman, TechSearch International, Inc.
10:15am - 11:00am	CB1: Coffee Break Location: Exhibition area - MC2 4th floor
10:15am - 5:15pm	Exh1: Exhibition Location: Exhibition area - MC2 4th floor Please visit our exhibitors and get an overview of their products and services that provide to the packaging industry. The exhibition area is freely accessible to the public. Please register at the registration desk.
11:00am - 1:00pm	M1A: Failure analysis and reliability Location: MC2 - 8th Floor Room Fasrummet Chair: Dr. Daniel Wright, SINTEF Digital	M1B: Advanced packaging solutions Location: MC2 - 8th Floor Room Luftbryggan Chair: Paul Collander, IMAPS Nordic
1:15pm - 2:15pm	Lunch: Lunch in exhbition area Location: Exhibition area - MC2 4th floor
2:30pm - 4:00pm	M2A: Exhibitor presentations Location: Kollektorn Auditorium - MC2 4th floor Chair: Paul Collander, IMAPS Nordic In this session the exhibitors will have the possibility to present their products and services. You can see a list of our exhibitors here This session is free to those who have registered at the registrations desk.
4:00pm - 4:30pm	CB2: Coffee Break and exhibition Location: Exhibition area - MC2 4th floor
4:30pm - 5:00pm	Keynote 2: Cross connect competence HUB and other activities at Swedish strategic innovation program - Smarter Electronic Systems - Thorbjörn Ebefors Location: Kollektorn Auditorium - MC2 4th floor Chair: Dr. Daniel Wright, SINTEF Digital Author: Dr. Thorbjörn ”TOBY” Ebefors
5:00pm - 5:30pm	M3A: IMAPS Nordic Annual Meeting Location: Kollektorn Auditorium - MC2 4th floor Chair: Heidi Lundén, Schott Primoceler Oy
7:00pm - 11:00pm	CD: Conference dinner Location: Chalmerska Huset Restaurant

Date: Tuesday, 14/June/2022
9:00am - 3:15pm	Exh2: Exhibition Location: Exhibition area - MC2 4th floor Please visit our exhibitors and get an overview of their products and services that provide to the packaging industry. The exhibition area is freely accessible to the public. Please register at the registration desk.
9:00am - 9:45am	Keynote 3: Pill Microsystems for Diagnostics and Therapy - Andreas Ostmann Location: Kollektorn Auditorium - MC2 4th floor Chair: Anders E. Petersen, Demant / Oticon Author: Andreas Ostmann, Fraunhofer IZM, Germany
9:45am - 10:30am	Keynote 4: Sensor packaging and stability - Åsmund Sandvand Location: Kollektorn Auditorium - MC2 4th floor Chair: Heidi Lundén, Schott Primoceler Oy Author: Åsmund Sandvand, Safran Sensing Technologies
10:30am - 11:00am	CB3: Coffee Break Location: Exhibition area - MC2 4th floor
11:00am - 1:00pm	T2A: Thermal management Location: MC2 - 8th Floor Room Fasrummet Chair: Johan Liu, Chalmers Technical University	T2B: Materials Location: MC2 - 8th Floor Room Luftbryggan Chair: Prof. Yifeng Fu, Chalmers University of Technology
1:15pm - 2:15pm	Lunch Tuesday: Lunch in exhibition area Location: Exhibition area - MC2 4th floor
2:30pm - 3:15pm	Keynote 5: Advanced Capacitor Technologies - Thomas Ebel Location: Kollektorn Auditorium - MC2 4th floor Chair: Prof. Rajan Ambat, Technical University of Denmark Author: Thomas Ebel, University of Southern Denmark
3:15pm - 3:45pm	CLS: Closing Session Location: Kollektorn Auditorium - MC2 4th floor Chair: Heidi Lundén, Schott Primoceler Oy
3:45pm - 4:45pm	Tour: Clean Room Tour Location: Exhibition area - MC2 4th floor Tour of the Chalmers clean room. Limited capacity.

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