Conference Time: 11th Oct 2024, 10:31:16am CEST
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AP3_Hybrid Bonding II
Time:
Thursday, 12/Sept/2024:
9:15am - 10:30am
Session Chair: Rolf Aschenbrenner , Fraunhofer IZM
Location: MOA 5 MOA 5
Presentations
9:15am - 9:40am High Precision Direct Transfer Bonding for Submicron Die-to-wafer in 3D/Heterogeneous Integration
Ichiro Sano1 , Katsuya Yamada 1 , Yuya Hirai1 , Masanori Yamagishi2 , Shinya Takyu2 , Yusuke Fumita2 , Yoichiro Kurita3
1 TAZMO CO.,LTD.; 2 LINTEC Corporation; 3 Tokyo Institute of Technology, Meguro City, Japan
9:40am - 10:05am Bond Strength Measurement for Wafer-level and Chip-level Hybrid Bonding
Junya Fuse , Yuki Yoshihara, Marie Sano, Fumihiro Inoue
Yokohama National University, Yokohama, Japan
10:05am - 10:30am Optimization of Cu/SiCN Hybrid Bonding Process Using a Cohesive Zone Model
Dong Yan , Ali Roshanghias
Silicon Austria Labs GmbH, Heterogeneous Integration Technologies, Villach, Austria