Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Wed 11 Sept Thu 12 Sept Fri 13 Sept Sat 14 Sept Sun 15 Sept
Wed11Sept
MOA 10-12
MOA 5
MOA 4
MOA 3
MOA 1+2
Atrium
No specific location / location unknown
08:00
09:00
10:00
11:00
12:00
13:00
14:00
15:00
16:00
17:00
18:00
19:00
20:00
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I
8:30am - 10:30am
MOA 10-12
Location: MOA 10-12
Part 1 8.30 – 10.30

Introduction/Opening/Motivation HIR Erik Jung and Klaus Pressel

“Introduction to the HIR Roadmap”
(Erik Jung, Fraunhofer IZM, Klaus Pressel, Bill Chen)

“Integrated Power Electronics”
(Michael Jank, Fraunhofer IISB)

“Trends in Photonics”
(Onno Huiskamp, CITC/TNO N...
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II
10:45am - 12:45pm
MOA 10-12
Location: MOA 10-12
Part 2 10.45 – 12.45

Opening System-in-Package Trends

“Trends in Modelling and Simulation”
(Chris Bailey, Arizona State University, Przemek Gromala, Bosch)

“Virtual development for Advanced Substrates Made in Europe”
(Thomas Krivec, AT&S)

“Impact of Digitalization on Reliability in ...
Opening
1:30pm - 1:45pm
MOA 10-12
Location: MOA 10-12

Opening remarks
Tanja BraunGeneral Chair IEEE ESTC2024

Welcome on behalf of the German Ministry for Education and Research (BMBF)
Engelbert BeyerDeputy Director-General of Directorate 51, Techn...
Keynote 1
1:45pm - 2:30pm
MOA 10-12
Location: MOA 10-12

"A Vision for Modular, Ubiquitous and Scalable Compute Systems"

Bernd Waidhas

Principal Engineer, Silicon Packaging Architecture, Intel



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MIP1_Advanced Material Architectures for Interconnects
2:40pm - 3:55pm
MOA 10-12
Glenn Hamilton Ross
Location: MOA 10-12
Session Chair: Glenn Hamilton Ross, Aalto University
Presentations: 3
Exhibitor Pitches
4:25pm - 4:55pm
MOA 10-12
Location: MOA 10-12
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
5:00pm - 6:15pm
MOA 10-12
Ali Roshanghias
Location: MOA 10-12
Session Chair: Ali Roshanghias, Silicon Austria Labs GmbH
Presentations: 3
PDC: “Advanced Packaging for MEMS and Sensors” I
8:30am - 10:30am
MOA 5
Location: MOA 5
Course instructor: Horst Theuss
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PDC: “Advanced Packaging for MEMS and Sensors” II
10:45am - 12:45pm
MOA 5
Location: MOA 5
Course instructor: Horst Theuss

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AP1_Advanced Substrates
2:40pm - 3:55pm
MOA 5
Andreas Ostmann
Location: MOA 5
Session Chair: Andreas Ostmann, IZM
Presentations: 3
AP2_Hybrid Bonding I
5:00pm - 6:15pm
MOA 5
E Jan Vardaman
Location: MOA 5
Session Chair: E Jan Vardaman, TechSearch International, Inc.
Presentations: 3
PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I
8:30am - 10:30am
MOA 4
Location: MOA 4
Course instructor: Pradeep Lall

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PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II
10:45am - 12:45pm
MOA 4
Location: MOA 4
Course instructor: Pradeep Lall


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Opto1_Photonic Module Packaging
2:40pm - 3:55pm
MOA 4
Henning Schröder
Location: MOA 4
Session Chair: Henning Schröder, Fraunhofer IZM
Presentations: 3
Opto2_Heterogenous PIC Integration
5:00pm - 6:15pm
MOA 4
Giovanni Delrosso
Location: MOA 4
Session Chair: Giovanni Delrosso, VTT
Presentations: 3
PDC: “Flip Chip Fabrication and Applications“ I
8:30am - 10:30am
MOA 3
Location: MOA 3
Course instructor: Eric Perfecto


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PDC: “Flip Chip Fabrication and Applications“ II
10:45am - 12:45pm
MOA 3
Location: MOA 3
Course instructor: Eric Perfecto


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DTM1_Co-design and Modeling for Chiplets
2:40pm - 3:55pm
MOA 3
Chris Bailey
Location: MOA 3
Session Chair: Chris Bailey, Arizona State University
Presentations: 3
DTM2_Reduced Order Modeling for Advanced Packaging
5:00pm - 6:15pm
MOA 3
Kshitij Anil Kolas
Location: MOA 3
Session Chair: Kshitij Anil Kolas, Fraunhofer ENAS
Presentations: 3
Power1_Electronics Measurement and Simulation
2:40pm - 3:55pm
MOA 1+2
Aurelian Kotlar
Location: MOA 1+2
Session Chair: Aurelian Kotlar, Eberspächer
Presentations: 3
Power2_Power Semiconductor Packaging and Cooling
5:00pm - 6:15pm
MOA 1+2
Gudrun Feix
Location: MOA 1+2
Session Chair: Gudrun Feix, ECPE European Center for Power Electronics
Presentations: 3
Exhibition Setup
11:00am - 3:00pm
Atrium
Location: Atrium
Exhibition
3:00pm - 8:00pm
Atrium
Location: Atrium
Coffee Break & Exhibition
3:55pm - 4:25pm
Atrium
Location: Atrium
Poster Session 1
3:55pm - 5:00pm
Atrium
Karl-Friedrich Becker
Location: Atrium
Session Chair: Karl-Friedrich Becker, Fraunhofer IZM
Presentations: 14
Welcome Reception
6:15pm - 8:00pm
Atrium
Location: Atrium
Registration
8:00am - 2:30pm
Break
10:30am - 10:45am
Break
12:45pm - 1:30pm
Room change
2:30pm - 2:40pm
Room change
4:55pm - 5:00pm