Index of Authors

A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding last name. Select the presentation in the right-hand column to access session and presentation details.

 
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List Options: Authors and Sessions · Authors and Presentations
 
Author(s) Organization(s) Session
A. Marques, AntonioInstituto de Telecomunicacoes, PortugalOpto1_Photonic Module Packaging
Aasmundtveit, KNUT EILIFUniversity of South-Eastern Norway, NorwayMIP3_Low-temperature Materials for Interconnects and Packaging
MIP3_Low-temperature Materials for Interconnects and Packaging
Abadie, KarineUniversity Grenoble Alpes CEA, LETI, Grenoble, FranceAP2_Hybrid Bonding I
Abdilla, JonathanBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Abo Ras, MohamadNanotest GmbH, Berlin, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
Ackerl, NorbertBesi Switzerland AG, Steinhausen, SwitzerlandAMT2_Computer-aided Process Control  Presenter
Adavi, KaramatHuber Automotive AG, Muehlhausen, GermanyRF2_Embedded System-in-Package and Interconnections Technologies  Presenter
Adorno, SilviaSTMicroelectronics, ItalyAP6_Challenges and Solutions for HI
Ain, Kaneeze NoorulSilicon Austria Labs (SAL), Villach, Austria;
Delft University of Technology (TUD), Delft, The Netherlands		Power2_Power Semiconductor Packaging and Cooling  Presenter
Akhtar, Mohd ZubairTechnische Hochschule Ingolstadt, Ingolstadt, GermanyDTM3_Reliability and Virtual Prototyping  Presenter
Al-Shami, HashemFraunhofer IZM, GermanyAMT3_Process for Enhancement of Device Robustness  Presenter
Alajoki, TeemuVTT Technical Research Centre of Finland, Espoo, FinlandFlex1_Reliability Assessment of Flexible Electronics
Albrecht, JanFraunhofer ENAS, Chemnitz, GermanyDTM3_Reliability and Virtual Prototyping
Albrecht, OliverTU Dresden, Dresden GermanyPoster Session 2  Presenter
Power1_Electronics Measurement and Simulation
Alexiou, IoannisEvatec AG, Trübbach, SwitzerlandAP1_Advanced Substrates
Alves, Luis NeroInstituto de Telecomunicacoes, PortugalOpto1_Photonic Module Packaging
Ambrosius, NorbertLPKF Laser & Electronics SE, Garbsen, GermanyAP1_Advanced Substrates
Amos, BrianThe Chemours Company, Newark, USAPoster Session 2
Anand, KetanIHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), GermanyAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Andrianov, NikolaiSilicon Austria Labs GmbH, AustriaPoster Session 1
Ankeraa, KimHytekAMT5_Advanced Materials and Processes
Anspach, NilsLPKF Laser & Electronics SE, Garbsen, GermanyAP1_Advanced Substrates
Asseburg, GerretUniversity of Applied Science and Arts, Dortmund Soest, GermanyRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Auer, BenediktBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Azeem, Munir SyedSilicon Austria Labs GmbH, AustriaPoster Session 1