Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
8:00am Registration
8:30am „IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12 PDC: “Advanced Packaging for MEMS and Sensors” I Location: MOA 5 PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I Location: MOA 4 PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3
10:30am Break
10:45am „IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12 PDC: “Advanced Packaging for MEMS and Sensors” II Location: MOA 5 PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II Location: MOA 4 PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3
11:00am Exhibition Setup Location: Atrium
12:45pm Break
1:30pm Opening Location: MOA 10-12
Tanja Braun Engelbert Beyer
1:45pm Keynote 1 Location: MOA 10-12
"A Vision for Modular, Ubiquitous and Scalable Compute Systems"
Bernd Waidhas
Principal Engineer, Silicon Packaging Architecture, Intel
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2:30pm Room change
2:40pm MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross , Aalto UniversityAP1_Advanced Substrates Location: MOA 5 Chair: Andreas Ostmann , IZMOpto1_Photonic Module Packaging Location: MOA 4 Chair: Henning Schröder , Fraunhofer IZMDTM1_Co-design and Modeling for Chiplets Location: MOA 3 Chair: Chris Bailey , Arizona State UniversityPower1_Electronics Measurement and Simulation Location: MOA 1+2 Chair: Aurelian Kotlar , Eberspächer
3:00pm Exhibition Location: Atrium
3:55pm Coffee Break & Exhibition Location: Atrium
3:55pm Poster Session 1 Location: Atrium Chair: Karl-Friedrich Becker , Fraunhofer IZM
4:25pm Exhibitor Pitches Location: MOA 10-12
4:55pm Room change
5:00pm MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Chair: Ali Roshanghias , Silicon Austria Labs GmbHAP2_Hybrid Bonding I Location: MOA 5 Chair: E Jan Vardaman , TechSearch International, Inc.Opto2_Heterogenous PIC Integration Location: MOA 4 Chair: Giovanni Delrosso , VTTDTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Chair: Kshitij Anil Kolas , Fraunhofer ENASPower2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Chair: Gudrun Feix , ECPE European Center for Power Electronics
6:15pm Welcome Reception Location: Atrium
8:30am Keynote 2 Location: MOA 10-12
"Electronics Integration: Challenges in Computed Tomography Scanners"
Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
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8:30am Exhibition Location: Atrium
9:15am MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Chair: Hiroshi Nishikawa , Osaka UniversityAP3_Hybrid Bonding II Location: MOA 5 Chair: Rolf Aschenbrenner , Fraunhofer IZMAMT1_Innovative Assembly Processes Location: MOA 4 Chair: Attila Géczy , Budapest University of Technology and EconomicsDTM3_Reliability and Virtual Prototyping Location: MOA 3 Chair: Pradeep Lall , Auburn UniversityRel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Chair: Matthias Heimann , Siemens AG
10:30am Coffee Break & Exhibition Location: Atrium
10:30am Poster Session 2 Location: Atrium Chair: Karl-Friedrich Becker , Fraunhofer IZM
11:00am Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Chair: Martin Oppermann , TU DresdenAP4_Advances in WLP Technologies I Location: MOA 5 Chair: Rolf Aschenbrenner , Fraunhofer IZMAMT2_Computer-aided Process Control Location: MOA 4 Chair: Erik Jung , Fraunhofer IZMDTM4_Device Level Modeling Location: MOA 3 Chair: Przemyslaw Gromala , Robert Bosch GmbHRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Chair: Romuald Roucou , NXP
12:15pm Lunch
1:45pm Special Session Location: MOA 10-12 Chair: Steffen Kroehnert , ESPAT-ConsultingChair: Klaus Pressel , Infineon
The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
more Info AP5_Advances in WLP Technologies II Location: MOA 5 Chair: Michael Schiffer , Fraunhofer IZMAMT3_Process for Enhancement of Device Robustness Location: MOA 4 Chair: David Henry , CEA LETISpecial Session Location: MOA 3 Special Session Location: MOA 1+2
Education I: The Education, Training and Qualification Offer for Sustainable Electronics
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3:15pm Coffee Break & Exhibition Location: Atrium
3:45pm Special Session Location: MOA 10-12 Chair: Klaus Pressel , InfineonChair: Steffen Kroehnert , ESPAT-Consulting
The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
more Info AP6_Challenges and Solutions for HI Location: MOA 5 Chair: Kay Essig , ASE GroupEmerging II Location: MOA 4 Chair: Martin Schneider-Ramelow , Fraunhofer IZMSpecial Session Location: MOA 3 Chair: Toni Mattila , Business FinlandSpecial Session Location: MOA 1+2 Chair: Jeffrey C. Suhling , Auburn UniversityChair: Klaus-Jürgen Wolter , TU Dresden
5:15pm Panel Discussion
"Chiplet Architectures for Automotive: Package Options and Special Considerations"
E. Jan Vardaman, TechSearch International, Inc.
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7:10pm Bus Transfer
7:30pm Gala Dinner at Wasserwerk
8:30am Keynote 3 Location: MOA 10-12
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"
Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
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8:30am Exhibition Location: Atrium
9:15am MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross , Aalto UniversityAP7_Fan Out Packages Location: MOA 5 Chair: Erik Jung , Fraunhofer IZMAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Chair: Hoang-Vu Nguyen , University of South-Eastern NorwayFlex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Chair: Jean Charles Souriau , CEA-LetiRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Chair: Matthias Wietstruck , IHP - Leibniz Institut für innovative Mikroelektronik
10:30am Coffee Break & Exhibition Location: Atrium
10:30am Poster Session 3 Location: Atrium Chair: Karl-Friedrich Becker , Fraunhofer IZM
11:00am MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Chair: Kay Essig , ASE GroupAP8_Fan Out Reliability Aspects Location: MOA 5 Chair: Grace O'Malley , INEMIAMT5_Advanced Materials and Processes Location: MOA 4 Chair: Attila Géczy , Budapest University of Technology and EconomicsFlex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Chair: Jukka Hast , VTT Technical Research Centre of Finland ltd.Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Chair: Matthias Petzold , Fraunhofer IMWS
12:15pm Lunch
1:45pm MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Chair: Nikhilendu Tiwary , Aalto UniversityAP9_Power Electronics Packaging Location: MOA 5 Chair: Klaus Pressel , InfineonAMT6_Enhanced Process Control Location: MOA 4 Chair: Knut E. Aasmundtveit , University of South-Eastern NorwayRF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Chair: Maurizio Cirillo , Rheinmetall Italia SpARel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Chair: Olaf Wittler , Fraunhofer IZM
3:00pm Room Change Location: Atrium
3:10pm Keynote 4 Location: MOA 10-12
"CHIPS -NAPMP: Overview and Next Steps"
George Orji
Deputy Director of CHIPS NAPMP, USA
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3:55pm Closing
8:30am IEEE EPS Board of Governors Meeting (not public)