Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II
Time:
Wednesday, 11/Sept/2024:
10:45am - 12:45pm
Location: MOA 10-12 MOA 10-12
Part 2 10.45 – 12.45
Opening System-in-Package Trends
“Trends in Modelling and Simulation”
(Chris Bailey, Arizona State University, Przemek Gromala, Bosch)
“Virtual development for Advanced Substrates Made in Europe”
(Thomas Krivec, AT&S)
“Impact of Digitalization on Reliability in Microelectronics – Outcome of the ECSEL JU iRel40 project”
(Klaus Pressel, Infineon)
“Impact of Failure Analysis in Advanced Microelectronics”
(Frank Altmann, Sebastian Brand, Fraunhofer IMWS, FA4.0 project)
Panel discussion & Wrap-up – Link to US and Rest of the World, Erik Jung, Klaus Pressel