Conference Agenda
| Session | ||
Keynote 3
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era" Dr. Yasumitsu Orii Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation |
| Session | ||
Keynote 3
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era" Dr. Yasumitsu Orii Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation |