Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
8:30am PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3
10:45am PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3
2:40pm DTM1_Co-design and Modeling for Chiplets Location: MOA 3 Chair: Chris Bailey , Arizona State University
2:40pm - 3:05pm Simulations of Wafer-to-wafer Bonding Dynamics and Deformation Mechanisms
Oguzhan Orkut Okudur , Serena Iacovo, Shuo Kang, Mario Gonzalez, Eric Beyne
3:05pm - 3:30pm Signal Integrity Optimization for CoWoS Chiplet Interconnection Design Assisted by Reinforcement Learning
Weiyang Miao , Chuan Seng Tan, Mihai Dragos Rotaru
3:30pm - 3:55pm Finite Element Analysis of Stress Variation of Hybrid Bonding During Miniaturization of Interconnects
Yudong Yang , Fengze Hou, Chi Zhang, Rui Ma, Shangyang Shi, Fei Ding, Yu Zhang, Renxi Jin, Qidong Wang, Wei Wang
5:00pm DTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Chair: Kshitij Anil Kolas , Fraunhofer ENAS
5:00pm - 5:25pm Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessments of Power Electronic Modules with Nonlinear Material Behaviours
Sheikh Hassan , Stoyan Stoyanov, Pushparajah Rajaguru, Christopher Bailey
5:25pm - 5:50pm Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behavior Applying the Energy Conserving Sampling and Weighting Method
Mike Feuchter , Hanna Baumgartl, Martin Hanke, Sven Rzepka
5:50pm - 6:15pm Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters
Abinash Pradhan , Giovanna Grosso, Varaha Satya Bharath Kurukuru, Claudio Romano, Roberto Petrella
9:15am DTM3_Reliability and Virtual Prototyping Location: MOA 3 Chair: Pradeep Lall , Auburn University
9:15am - 9:40am Reliability Testing and Virtual Prototyping for Embedded GaN Power Modules in Automotive Applications
Kshitij Anil Kolas , Alexander Otto, Maximilian Hepp, Rico Eichhorn, Jan Albrecht, Sven Rzepka
9:40am - 10:05am Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to improve SAC Solder Reliability Analysis
Mohd Zubair Akhtar , Christian Kreiner, Maximilian Schmid, Andreas Zippelius, Ulrich Tetzlaff, Gordon Elger
10:05am - 10:30am Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics
Chengdong Yuan , Sönke Maeter, Youssef Maniar, Tamara Bechtold
11:00am DTM4_Device Level Modeling Location: MOA 3 Chair: Przemyslaw Gromala , Robert Bosch GmbH
11:00am - 11:25am Latency Insertion Method for FinFET Simulation Incorporating Parasitic Source/Drain Resistances
Yi Zhou, Jose E. Schutt-Aine
11:25am - 11:50am CANCELLED: Adaptive Artificial Neural Networks for Power Loss Prediction in SiC MOSFETs
Giovanni Di Nuzzo , Ajay Poonjal Pai, YiChe Su
11:50am - 12:15pm Simulation Analysis on Thermal Performance of Lidless Fan-out Package
Yongbo Wu , Jian Cai, Changming Song, Lin Tan, Qian Wang
1:45pm Special Session Location: MOA 3
3:45pm Special Session Location: MOA 3 Chair: Toni Mattila , Business Finland
9:15am Flex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Chair: Jean Charles Souriau , CEA-Leti
9:15am - 9:40am Development and Reliability Assessment of a Flexible Printed Capacitive Sensor for Precise Twisting Movement Detection
Ahmed Zakwan, Colleen Stover, Rui Chen
9:40am - 10:05am Reliability Assessment of Temperature Sensors Integrated on Elastic Substrate
Tuomas Happonen , Petri Järvinen, Mikko Paakkolanvaara, Teemu Alajoki
10:05am - 10:30am Comparison of Electrical and Mechanical Properties of Stretchable Circuit Boards
Lukas Werft , Christine Kallmayer, Malte von Krshiwoblozki, Martin Schneider-Ramelow
11:00am Flex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Chair: Jukka Hast , VTT Technical Research Centre of Finland ltd.
11:00am - 11:25am Additively Manufactured Flexible Electronics with Selectively Soldered Surface-mounted Devices Utilising StarJet Technology
Daniel Straubinger , Zeba Khan, Peter Koltay, Roland Zengerle, Sabrina Kartmann, Zhe Shu
11:25am - 11:50am Electroless Nickel/Immersion Gold and Immersion Tin as Final Finish Solutions for Flexible Substrates in EV Batteries
Britta Schafsteller, Mario Rosin, Michael Schwaemmlein, Boris Kraft, Hubertus Mertens, Jasemin Tuerkelly, Sandra Nelle
11:50am - 12:15pm Electrical Characterization of an ALPIDE Chip TAB Bonded with Flexible PCBs
David Novel , Alessandro Lega, Tiziano Facchinelli, Roberto Iuppa, Stefania Beolé, Pierluigi Bellutti
1:45pm RF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Chair: Maurizio Cirillo , Rheinmetall Italia SpA
1:45pm - 2:10pm Integration of Microwave SMD Components into Organic Multilayer PCBs
Lorenzo Giambuzzi , Maurizio Cirillo, David Schütze, Martin Hempel, Thomas Löher
2:10pm - 2:35pm Integration of III-V Components of 5G Transceiver in Embedding PCB-based Technology
Tekfouy Lim , Stefan Kosmider, Kavin Senthil Murugesan, Andreas Ostmann
2:35pm - 3:00pm Passive Intermodulation Estimation of a Novel Printed Circuit Board Interconnection Technology Based on Static I-V
Karamat Adavi , Sebastian Quednau, Xaver Mueller, Daniel Ernst, Karsten Meier, Hanno Platz