Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
8:30am PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I Location: MOA 4
10:45am PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II Location: MOA 4
2:40pm Opto1_Photonic Module Packaging Location: MOA 4 Chair: Henning Schröder , Fraunhofer IZM
2:40pm - 3:05pm Array Packaging with Integrated Mirrors for High Power Multi-chip UVC-LED Modules
Ulli Hansen , Xiaodong Hu, Simon Maus, Oliver Gyenge
3:05pm - 3:30pm Modular Integration of Quantum Cascade Lasers and Drivers in Glass Bench
Gunnar Böttger , Michael Häußler, Lasse Felix Weißenburg, Martin Hempel, Ralf Ziegler, Martin Schneider-Ramelow
3:30pm - 3:55pm Improving the Thermal Management of Power LED Arrays with Diamonds
Shusmitha Kyatam, Antonio A. Marques, Luis Rodrigues, Luis Nero Alves, Joana Catarina Mendes
5:00pm Opto2_Heterogenous PIC Integration Location: MOA 4 Chair: Giovanni Delrosso , VTT
5:00pm - 5:25pm Laser-Assisted Bonding of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit with Through-Silicon Alignment
Aleksandr Vlasov , Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina
5:25pm - 5:50pm Over 100-GHz Bridge Chip Interconnection Between Photonic and Electrical ICs with a Heat-insulating Stress-relief Membrane Structure
Taichi Misawa , Hiroshi Uemura, Keiji Tanaka, Katsumi Uesaka, Yoichiro Kurita
5:50pm - 6:15pm Advanced Ultrathin Spray Coating Process Technology for Heterogeneous Integration Applications
Johanna Rimboeck, Stefan Ertl, Prasanna Ramaswamy, Alex Farrell, Ali Uzun, Mariana Pires, Brian Corbett, Ruggero Loi, Ksenija Varga , Peter Ossieur
9:15am AMT1_Innovative Assembly Processes Location: MOA 4 Chair: Attila Géczy , Budapest University of Technology and Economics
9:15am - 9:40am Secondary Optics Assembly for Micro Concentrating Photovoltaics: A Parallelized and Scalable Approach
Marcus Voitel , Elisa Kaiser, Salar Mehrafsun, Maike Wiesenfarth, Henning Helmers, Karl-Friedrich Becker, Tanja Braun, Martin Schneider-Ramelow
9:40am - 10:05am Massive Parallel Assembly and Interconnection for Micro-LEDs – a Technical Feasibility Study
Charles-Alix Manier , Kai Zoschke, Hermann Oppermann
10:05am - 10:30am Tape Frozen Detachment Process Using Freeze Chuck for Chip to Wafer
Tadatomo Yamada , Ken Takano, Toshiaki Menjo, Shinya Takyu
11:00am AMT2_Computer-aided Process Control Location: MOA 4 Chair: Erik Jung , Fraunhofer IZM
11:00am - 11:25am Advancements in Epoxy Pattern Quality Checks: Harnessing Artificial Intelligence for Enhanced Low-Contrast Analysis
Guodong Zeng, Farnaz Forooghifar, Andreas Wiedmer, Ernst Barmettler, Norbert Ackerl
11:25am - 11:50am Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques
Damien Jon Leech , Akito Hiro, Geert Schoofs, Bensu Tunca Altintas, Alain Phommahaxay, Koen Kennes, Gerald Beyer, Eric Beyne
11:50am - 12:15pm AI Deep-Learning Approach for Manufacturing Optimization During Chiplets and Heterogeneous Package Inspection
Shahab Chitchian , SeungYeol Kim, TaeYoung Jung, TaeYong Lee, ByeongGweon Joo
1:45pm AMT3_Process for Enhancement of Device Robustness Location: MOA 4 Chair: David Henry , CEA LETI
1:45pm - 2:10pm Advanced Wafer Singulation Technique for Miniaturized Metal-oxide (MOX) Micro-hotplates Based Gas Analyzer
Serguei Stoukatch , Francois Dupont, Jean-Michel Redouté
2:10pm - 2:35pm Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package
Ming-Che Hsieh , Pu-Shan Huang, Chi-Yuan Chen, Stanley Lin, JoonYoung Choi, WooSoon Kim, YoungCheol Kim
2:35pm - 3:00pm Automated Highspeed Characterization of Optical Waveguide in large-format Glass Substrates
Hashem Al-Shami , Julian Schwietering, Henning Schröder
3:45pm Emerging II Location: MOA 4 Chair: Martin Schneider-Ramelow , Fraunhofer IZM
10 Golden Rules of Chip- Package- Board Interactions
Evelyn Napetschnig
Trench-Based Fully Integrated Capacitors for Power Delivery in Heterogeneous Integration Platforms
Yousef Safari , Yushu Zhao, Boris Vaisband
Sustainable Temperature and Pressure Sensing Solution for Tire
Kimmo Antero Keränen , Timo Kurkela, Jyrki Ollila, Antti Tanskanen, Marko Korkalainen, Antoine Balin
9:15am AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Chair: Hoang-Vu Nguyen , University of South-Eastern Norway
9:15am - 9:40am First Electrical Performance of Self-assembly Applied to Die-to-wafer Hybrid Bonding
Adèle Thiolon , Pierre Montméat, Thierry Enot, Alice Bond, Carine Ladner, Loic Sanchez, Alain Campo, Thomas Magis, Floriane Baudin, Sébastien Dominguez, Frank Fournel, Emilie Bourjot
9:40am - 10:05am BiCMOS BEOL Coupon Fabrication and Micro Transfer Printing for Heterogeneous Integration Applications
Selin Tolunay Wipf , Steffen Marschmeyer, Martin Drost, Ketan Anand, Matthias Wietstruck
10:05am - 10:30am Impact of Dielectric Types & Surface Profile on Wafer-to-Wafer Hybrid Bonding
Vikas Dubey , Dirk Wünsch, Knut Gottfried, Tobias Fischer, Lutz Hofmann, Maik Wiemer, Stefan E. Schulz
11:00am AMT5_Advanced Materials and Processes Location: MOA 4 Chair: Attila Géczy , Budapest University of Technology and Economics
11:00am - 11:25am Thin Substrate Bonding
Partia Naghibi
11:25am - 11:50am System-in-package Building block Development for Future Space Equipment
Hélène Jochem , Hugo Garcia, Norbert Venet, Mirko Rocci, Lucas Sollecchia, Paolo Scalmati, Monique Mayr, Carlo Tuninetti, Giovanni Cucinella, Kim Ankeraa, Poul Juul
11:50am - 12:15pm Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-tall Indium Bumps Across an Entire Chip
Andreas Schneider , Aswathi Koorikkat, Navid Ghorbanian, Toby G. Brookes, John D. Lipp, David Burt, Marcus J. French
1:45pm AMT6_Enhanced Process Control Location: MOA 4 Chair: Knut E. Aasmundtveit , University of South-Eastern Norway
1:45pm - 2:10pm Invited Paper: A Novel Approach for Wafer level Solder Reflow and Cleaning of Semiconductor Wafer in Silicon Photonics, MEMS and Advanced Packaging
Daniel Lieske
2:10pm - 2:35pm In-situ Measurement of HCOOH, CO2 and H2O Concentrations During Formic Acid Reflow Soldering
Aaron Hutzler
2:35pm - 3:00pm Enhanced Process Control for Dry Etching of Functional TiN Structures on 300 mm Wafer Level.
Johann Fell , Steffen Bickel, Conny Fiedler, Annekatrin Delan, Manuela Junghähnel