Development of Packaging Technology for 2.xD Advanced Packages; Fine Bump Interconnection, Fine Cu Wiring and Large Package

Kei Togasaki, Masashi Minami, Dongchul Kang, Sadaaki Katoh

Advancing Chiplet Architecture Through Heterogeneous Integration on Laser-processed Glass Substrates

Richard Noack, Nils Anspach, Roman Ostholt, Daniel Dunker, Norbert Ambrosius

High Rate and Selective (Deep) Reactive-ion Etching Process for the Formation of High-density Vertical Interconnects into Dielectric Build-up Films

Ioannis Tsigaras, Ioannis Alexiou, Christian Voigt, Lars Böttcher, Ewald Strolz, Roland Rettenmeier

Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations

Margot Faure, Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sébastien Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank Fournel

Overlay Scaling Error Reduction for Hybrid Die-To-wafer Bonding

Pieter Bex, Mario Gonzalez, Steven Brems, Alain Phommahaxay, Koen D`Havé, Prathamesh Dhakras, Dieter H. Cuypers, Ye Lin, Eric Beyne, Jonathan Abdilla, Kawsar Ahmed Prince, Benedikt Auer, Djuro Bikaljevic, Manuel Deubler, Thiago Moura, Stefan Schmid, Pavel Seroglazov

Scatterometry Application on Cu/SiCN Surface Topography Towards High Volume Manufacturing

Soon Aik Chew, Joey Hung, Igor Turoves, Avron Ger, Mohamed Saib, Alain Moussa, Boyao Zhang, Joeri De Vos, Andy Miller, Anne-Laure Charley, Philippe Leray, Eric Beyne

High Precision Direct Transfer Bonding for Submicron Die-to-wafer in 3D/Heterogeneous Integration

Ichiro Sano, Katsuya Yamada, Yuya Hirai, Masanori Yamagishi, Shinya Takyu, Yusuke Fumita, Yoichiro Kurita

Bond Strength Measurement for Wafer-level and Chip-level Hybrid Bonding

Junya Fuse, Yuki Yoshihara, Marie Sano, Fumihiro Inoue

Optimization of Cu/SiCN Hybrid Bonding Process Using a Cohesive Zone Model

Dong Yan, Ali Roshanghias

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD Using low-NA 300mm i-line Stepper

Lili Wang, Murat Pak, Nelson Pinho, John Slabbekoorn, Andy Miller, Eric Beyne

Study of Cross-contamination in Multi-chamber PVD Systems used for High-throughput Seed Layer Deposition

Patrik Carazzetti, Carl Drechsel, Roland Rettenmeier, Jürgen Weichart, Kay Viehweger, Ewald Strolz

Enhanced Defect Detection with Deep Neural Networks Post Wafer Bonding

Fiete Stoll, Vikas Dubey, Dirk Wünsch, Frank Roscher, Maik Wiemer

Package Assembly Design Kits (PADK’s) – The Future of Advanced Wafer-level Manufacturing

Ruben Fuentes

Fan-out Packaging Reaching New Heights: Market and Technology Overview

Gabriela Pereira

Optimizing Laser Direct Write for Fan Out Packaging

Matthias Wahl, Steffen Diez, Christina Lopper, Markus Wöhrmann

Acoustic MEMS Packaging for Audio Micro-System Applications

Luca Maggi, Fabrizio Cerini, Silvia Adorno, Amedeo Maierna, Marco Del Sarto, Alex Gritti, Andrea Ratti, Nazariy Nashkolnyy

IMC Assisted Die-bonding for Stacked Device Integration

Masataka Maehara, Jaber Derakhshandeh, Carine Gerets, Tom Cochet, Dieter H Cuypers, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne

High-throughput In-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Bensu Tunca Altintas, Mohamed Saib, Alain Moussa, Soon Aik Chew, Boyao Zhang, Joeri De Vos, Andy Miller, Eric Beyne, Gian Lorusso, Anne-Laure Charley, Janusz Bogdanowicz, Hiroaki Kasai, Kazuhisa Hasumi, Nobuyuki Mise, Mayuka Osaki, Maki Tanaka

INVITED TALK: Accelerating the AI Economy through Heterogeneous Integration

CP Hung

Development of an Adaptive Re-distribution Patterning Process for Fan-out Packages with Embedded High I/O Components

Ruben Kahle, Lars Böttcher, Luc Steffen Borchardt, Dionysios Manessis, Anna Meierfrankenfeld, Andreas Zluc, Andrea Casto, Stefano Sergio Oggioni

On the Design and Fabrication of SMT-compatible 3D-Freeform Antennas Based on Compression Molding and Direct Cu-Metallization

Marc Dreissigacker, Friedrich Müller, Christian Tschoban, Tanja Braun, Karl-Friedrich Becker, Paul Perlwitz, Martin Schneider-Ramelow

Power Delivery for AI/HPC Microprocessors

Mark Li, Vikas Gupta

Reliability and RF Performance Assessment of Heterogeneous Integrated FO-WLP Test Structure Packages for Mixed RF Digital Front-End Application

Jesse C. Riedl, Vincent Bortolussi, Christophe Chang, Didier Floriot, Jonathan Leroy, Romain Mathieu, Julien Perraud, Hermann Stieglauer, Gregory Uren, Benoit Lambert

No Warpage and Fast Cure: UV-molding for FOWLP/FOPLP

Markus Schindler, Severin Ringelstetter, Martin Bues, Tobias Königer, Kilian Kreul

Additive Fan-out Panel-level Processing for Power MOSFET Devices

Eric Rubingh, Edsger Smits, Francesca Chiappini, Roel Kusters, Tindara Verduci, Jackson Gualberto de Sousa, Thijs Bel, Jeroen van den Brand, Mark Luke Farrugia, Hero ‘t Mannetje

Advancing Packaging Solutions: Integrating Power Electronics Using LTCC Technology

Qaisar Khushi Muhammad, Peter Keil, Uwe Krieger, Manuel Heidenreich, Jörg Töpfer, Beate Capraro, Dirk Schabbel, Koji Koiwai

Thermal Diffusivity Investigation of a Heat Pipe

Corina Ruxandra Mitulescu, Bogdan-Traian Mihailescu, Mihai Branzei, Paul Svasta