Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
8:30am „IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12
10:45am „IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12
1:30pm Opening Location: MOA 10-12
Tanja Braun Engelbert Beyer
1:45pm Keynote 1 Location: MOA 10-12
"A Vision for Modular, Ubiquitous and Scalable Compute Systems"
Bernd Waidhas
Principal Engineer, Silicon Packaging Architecture, Intel
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2:40pm MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross , Aalto University
2:40pm - 3:05pm Solid-state Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems
Steffen Bickel , Juliana Panchenko, Manuela Junghähnel
3:05pm - 3:30pm Superconducting Superlattice Interconnects for Cryogenic Systems
Charles Bon-mardion , Edouard Deschaseaux, Thierry Farjot, Alain Campo, Frédéric Ritton, Rémi Vélard, Hélène Duchemin, Céline Feautrier, Jean-Luc Sauvageot, Jean Charbonnier, Candice Thomas
3:30pm - 3:55pm Aluminium-Aluminium Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminium Bonding Frames
Silvia Braun, Imants Cirulis , Klaus Vogel, Christian Hofmann, Maik Wiemer
4:25pm Exhibitor Pitches Location: MOA 10-12
5:00pm MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Chair: Ali Roshanghias , Silicon Austria Labs GmbH
5:00pm - 5:25pm Tuning of Copper Grain Size for Integration in Hybrid Bonding Applications
Sarabjot Singh , Kathleen Dunn
5:25pm - 5:50pm Fine Pitch Aluminum Hybrid Bonding at Wafer Level: Overcoming the Challenges in Plating, Passivation and Planarization
Imants Cirulis, Vikas Dubey , Silvia Braun, Dirk Wünsch, Maik Wiemer
5:50pm - 6:15pm Surface Activated Bonding for Hybrid and All-metal 3D (AM3D) Interconnect
Tadatomo Suga , Kanji Otsuka, Junsha Wang
8:30am Keynote 2 Location: MOA 10-12
"Electronics Integration: Challenges in Computed Tomography Scanners"
Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
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9:15am MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Chair: Hiroshi Nishikawa , Osaka University
9:15am - 9:40am Low Temperature Die-attach Bonding Using Copper Particle Free Inks
Fabian Steinberger , Nihesh Mohan, Olaf Rämer, Gordon Elger
9:40am - 10:05am Cu–(Sn–Bi) SLID Bond Microstructure Under Different Bonding Temperatures
Lisette Hernandez Gonzalez , Knut E. Aasmundtveit, Hoang-Vu Nguyen
10:05am - 10:30am Die Shear Strength of Au-In-Bi SLID Bonds at Elevated Temperatures
GAYATHRY THAMPI , HOANG-VU NGUYEN, KNUT EILIF AASMUNDTVEIT
11:00am Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Chair: Martin Oppermann , TU Dresden
11:00am - 11:25am Feasibility of Micro-grass on Silicon Cap as An Alternative Antireflective Layer in Vacuum Packaging of Microbolometer Arrays
Hoang-Vu Nguyen , Eivind Bardalen
11:25am - 11:50am Biodegradable PCBs with PLA/flax Substrate: FTIR and SEM Analysis of Degradation
Attila Géczy , Lívia Gyenizse, Csaba Farkas, Dániel Rigler, Balázs Sáfár, András Csiszár
11:50am - 12:15pm A Novel Ultra-thin Dicing Die Attach Film for Various Dicing Processes
Masanori Yamagishi , Yutaro Ishii, Tomoka Kirihata, Manabu Miyawaki
1:45pm Special Session Location: MOA 10-12 Chair: Steffen Kroehnert , ESPAT-ConsultingChair: Klaus Pressel , Infineon
The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
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3:45pm Special Session Location: MOA 10-12 Chair: Klaus Pressel , InfineonChair: Steffen Kroehnert , ESPAT-Consulting
The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
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8:30am Keynote 3 Location: MOA 10-12
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"
Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
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9:15am MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross , Aalto University
9:15am - 9:40am Prediction of High Strain Rate Properties of Bi-doped SnAgCu Solders after Sustained High-temperature Operation
Pradeep Lall , Vishal Mehta, Mrinmoy Saha
9:40am - 10:05am Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages
Soichi Homma , Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Hiroshi Nishikawa
10:05am - 10:30am Effect of Minor Element Addition on Mechanical Properties and Microstructure of Sn-Bi Alloys
Hiroshi Nishikawa , Yuki Hirata, Shiqi Zhou, Chih-han Yang, Shih-kang Lin
11:00am MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Chair: Kay Essig , ASE Group
11:00am - 11:25am Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper
Chih-Yu Wang , Kwang-Lung Lin
11:25am - 11:50am Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging
Abdellah Salahouelhadj , Kris Vanstreels, Joke De Messemaeker, Carine Gerets, John Slabbekoorn, Zaid El-Mekki, Punith Kumar Mudigere Krishne Gowda, Mario Gonzalez, Eric Beyne
11:50am - 12:15pm Study of Intermetallic Compound Evolution of Pure Sn and SnAg Alloy Solder on Single and Multi-layer Under-bump Materials
Tassawar Hussain , Jaber Derakhshandeh, Tom Cochet, Eric Beyne, Jack Hsu, Dongming He, Ingrid De Wolf
1:45pm MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Chair: Nikhilendu Tiwary , Aalto University
1:45pm - 2:10pm Development of Novel BT Laminate Materials for mmWave Antenna and Heterogeneous Integration
Masashi Okaniwa , Yuji Kamata, Amane Matsunaga, Takashi Kobayashi, Takaaki Ogashiwa
2:10pm - 2:35pm Parylene as a Novel Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging
Franz Selbmann , Martin Kühn, Frank Roscher, Maik Wiemer, Harald Kuhn, Yvonne Joseph
2:35pm - 3:00pm Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors
Andrei Costina , Markus Wöhrmann, Michael Schiffer, Martin Schneider-Ramelow
3:10pm Keynote 4 Location: MOA 10-12
"CHIPS -NAPMP: Overview and Next Steps"
George Orji
Deputy Director of CHIPS NAPMP, USA
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