Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
8:30am Keynote 3 Location: MOA 10-12
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"
Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
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8:30am Exhibition Location: Atrium
9:15am MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross , Aalto UniversityAP7_Fan Out Packages Location: MOA 5 Chair: Erik Jung , Fraunhofer IZMAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Chair: Hoang-Vu Nguyen , University of South-Eastern NorwayFlex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Chair: Jean Charles Souriau , CEA-LetiRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Chair: Matthias Wietstruck , IHP - Leibniz Institut für innovative Mikroelektronik
10:30am Coffee Break & Exhibition Location: Atrium
10:30am Poster Session 3 Location: Atrium Chair: Karl-Friedrich Becker , Fraunhofer IZM
11:00am MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Chair: Kay Essig , ASE GroupAP8_Fan Out Reliability Aspects Location: MOA 5 Chair: Grace O'Malley , INEMIAMT5_Advanced Materials and Processes Location: MOA 4 Chair: Attila Géczy , Budapest University of Technology and EconomicsFlex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Chair: Jukka Hast , VTT Technical Research Centre of Finland ltd.Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Chair: Matthias Petzold , Fraunhofer IMWS
12:15pm Lunch
1:45pm MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Chair: Nikhilendu Tiwary , Aalto UniversityAP9_Power Electronics Packaging Location: MOA 5 Chair: Klaus Pressel , InfineonAMT6_Enhanced Process Control Location: MOA 4 Chair: Knut E. Aasmundtveit , University of South-Eastern NorwayRF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Chair: Maurizio Cirillo , Rheinmetall Italia SpARel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Chair: Olaf Wittler , Fraunhofer IZM
3:00pm Room Change Location: Atrium
3:10pm Keynote 4 Location: MOA 10-12
"CHIPS -NAPMP: Overview and Next Steps"
George Orji
Deputy Director of CHIPS NAPMP, USA
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3:55pm Closing