Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Keynote 3 Location: MOA 10-12
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"
Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
more Info
Exhibition Location: Atrium
MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Session Chair: Glenn Hamilton Ross , Aalto University
AP7_Fan Out Packages Location: MOA 5 Session Chair: Erik Jung , Fraunhofer IZM
AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Session Chair: Hoang-Vu Nguyen , University of South-Eastern Norway
Flex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Session Chair: Jean Charles Souriau , CEA-Leti
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Session Chair: Matthias Wietstruck , IHP - Leibniz Institut für innovative Mikroelektronik
Coffee Break & Exhibition Location: Atrium
Poster Session 3 Location: Atrium Session Chair: Karl-Friedrich Becker , Fraunhofer IZM
MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Session Chair: Kay Essig , ASE Group
AP8_Fan Out Reliability Aspects Location: MOA 5 Session Chair: Grace O'Malley , INEMI
AMT5_Advanced Materials and Processes Location: MOA 4 Session Chair: Attila Géczy , Budapest University of Technology and Economics
Flex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Session Chair: Jukka Hast , VTT Technical Research Centre of Finland ltd.
Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Session Chair: Matthias Petzold , Fraunhofer IMWS
Lunch
MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Session Chair: Nikhilendu Tiwary , Aalto University
AP9_Power Electronics Packaging Location: MOA 5 Session Chair: Klaus Pressel , Infineon
AMT6_Enhanced Process Control Location: MOA 4 Session Chair: Knut E. Aasmundtveit , University of South-Eastern Norway
RF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Session Chair: Maurizio Cirillo , Rheinmetall Italia SpA
Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Session Chair: Olaf Wittler , Fraunhofer IZM
Room Change Location: Atrium
Keynote 4 Location: MOA 10-12
"CHIPS -NAPMP: Overview and Next Steps"
George Orji
Deputy Director of CHIPS NAPMP, USA
more Info
Closing