IEEE ESTC 2024
September 11–13, 2024 | Berlin, Germany
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Daily Overview |
Fri13Sept
MOA 10-12
MOA 5
MOA 4
MOA 3
MOA 1+2
Atrium
No specific location / location unknown
08:00
09:00
10:00
11:00
12:00
13:00
14:00
15:00
16:00
17:00
18:00
Keynote 3
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"
Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
more Info
8:30am - 9:15am
MOA 10-12
Location: MOA 10-12
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"
Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
more Info
MIP4_Mechanical properties of Materials for Interconnects
9:15am - 10:30am
MOA 10-12
Glenn Hamilton Ross
Location: MOA 10-12
Session Chair: Glenn Hamilton Ross, Aalto University
Presentations: 3
MIP5_Microstructural Properties of Materials for Interconnects
11:00am - 12:15pm
MOA 10-12
Kay Essig
Location: MOA 10-12
Session Chair: Kay Essig, ASE Group
Presentations: 3
MIP6_New materials for Heterogeneous Integration
1:45pm - 3:00pm
MOA 10-12
Nikhilendu Tiwary
Location: MOA 10-12
Session Chair: Nikhilendu Tiwary, Aalto University
Presentations: 3
Keynote 4
"CHIPS -NAPMP: Overview and Next Steps"
George Orji
Deputy Director of CHIPS NAPMP, USA
more Info
3:10pm - 3:55pm
MOA 10-12
Location: MOA 10-12
"CHIPS -NAPMP: Overview and Next Steps"
George Orji
Deputy Director of CHIPS NAPMP, USA
more Info
AP7_Fan Out Packages
9:15am - 10:30am
MOA 5
Erik Jung
Location: MOA 5
Session Chair: Erik Jung, Fraunhofer IZM
Presentations: 3
AP8_Fan Out Reliability Aspects
11:00am - 12:15pm
MOA 5
Grace O\'Malley
Location: MOA 5
Session Chair: Grace O\'Malley, INEMI
Presentations: 3
AP9_Power Electronics Packaging
1:45pm - 3:00pm
MOA 5
Klaus Pressel
Location: MOA 5
Session Chair: Klaus Pressel, Infineon
Presentations: 3
AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
9:15am - 10:30am
MOA 4
Hoang-Vu Nguyen
Location: MOA 4
Session Chair: Hoang-Vu Nguyen, University of South-Eastern Norway
Presentations: 3
AMT5_Advanced Materials and Processes
11:00am - 12:15pm
MOA 4
Attila Géczy
Location: MOA 4
Session Chair: Attila Géczy, Budapest University of Technology and Economics
Presentations: 3
AMT6_Enhanced Process Control
1:45pm - 3:00pm
MOA 4
Knut E. Aasmundtveit
Location: MOA 4
Session Chair: Knut E. Aasmundtveit, University of South-Eastern Norway
Presentations: 3
Flex1_Reliability Assessment of Flexible Electronics
9:15am - 10:30am
MOA 3
Jean Charles Souriau
Location: MOA 3
Session Chair: Jean Charles Souriau, CEA-Leti
Presentations: 3
Flex2_Formation of a Conductive Interconnection for Flexible Electronics
11:00am - 12:15pm
MOA 3
Jukka Hast
Location: MOA 3
Session Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd.
Presentations: 3
RF2_Embedded System-in-Package and Interconnections Technologies
1:45pm - 3:00pm
MOA 3
Maurizio Cirillo
Location: MOA 3
Session Chair: Maurizio Cirillo, Rheinmetall Italia SpA
Presentations: 3
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
9:15am - 10:30am
MOA 1+2
Matthias Wietstruck
Location: MOA 1+2
Session Chair: Matthias Wietstruck, IHP - Leibniz Institut für innovative Mikroelektronik
Presentations: 3
Rel3_Progress in Failure Analytical and Material Testing Methods
11:00am - 12:15pm
MOA 1+2
Matthias Petzold
Location: MOA 1+2
Session Chair: Matthias Petzold, Fraunhofer IMWS
Presentations: 3
Rel4_New Approaches in Reliability Simulation and Modelling
1:45pm - 3:00pm
MOA 1+2
Olaf Wittler
Location: MOA 1+2
Session Chair: Olaf Wittler, Fraunhofer IZM
Presentations: 3
Poster Session 3
10:30am - 11:45am
Atrium
Karl-Friedrich Becker
Location: Atrium
Session Chair: Karl-Friedrich Becker, Fraunhofer IZM
Presentations: 16