IEEE ESTC 2024
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Thursday, 12/Sept/2024 | |
| 8:30am - 9:15am | Keynote 2 Location: MOA 10-12 "Electronics Integration: Challenges in Computed Tomography Scanners" Dr. Michael Hosemann Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens |
| 8:30am - 7:00pm | Exhibition Location: Atrium |
| 9:15am - 10:30am | MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 |
| 9:15am - 10:30am | AP3_Hybrid Bonding II Location: MOA 5 |
| 9:15am - 10:30am | AMT1_Innovative Assembly Processes Location: MOA 4 |
| 9:15am - 10:30am | DTM3_Reliability and Virtual Prototyping Location: MOA 3 |
| 9:15am - 10:30am | Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 |
| 10:30am - 11:00am | Coffee Break & Exhibition Location: Atrium |
| 10:30am - 11:45am | Poster Session 2 Location: Atrium |
| 11:00am - 12:15pm | Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 |
| 11:00am - 12:15pm | AP4_Advances in WLP Technologies I Location: MOA 5 |
| 11:00am - 12:15pm | AMT2_Computer-aided Process Control Location: MOA 4 |
| 11:00am - 12:15pm | DTM4_Device Level Modeling Location: MOA 3 |
| 11:00am - 12:15pm | Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 |
| 12:15pm - 1:45pm | Lunch |
| 1:45pm - 3:15pm | Special Session Location: MOA 10-12 The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I IPCEI ME/CT and Pack4EU/ EU CHIPS ACT |
| 1:45pm - 3:15pm | AP5_Advances in WLP Technologies II Location: MOA 5 |
| 1:45pm - 3:15pm | AMT3_Process for Enhancement of Device Robustness Location: MOA 4 |
| 1:45pm - 3:15pm | Special Session Location: MOA 3 PUNCH - Photonic Packaging |
| 1:45pm - 3:15pm | Special Session Location: MOA 1+2 Education I: The Education, Training and Qualification Offer for Sustainable Electronics |
| 3:15pm - 3:45pm | Coffee Break & Exhibition Location: Atrium |
| 3:45pm - 5:15pm | Special Session Location: MOA 10-12 The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II IPCEI ME/CT and Pack4EU/ EU CHIPS ACT |
| 3:45pm - 5:15pm | AP6_Challenges and Solutions for HI Location: MOA 5 |
| 3:45pm - 5:15pm | Emerging II Location: MOA 4 |
| 3:45pm - 5:15pm | Special Session Location: MOA 3 Quantum Computing |
| 3:45pm - 5:15pm | Special Session Location: MOA 1+2 Education II: t.b.c. |
| 5:15pm - 6:45pm | Panel Discussion "Chiplet Architectures for Automotive: Package Options and Special Considerations" E. Jan Vardaman, TechSearch International, Inc. |
| 7:10pm - 7:35pm | Bus Transfer |
| 7:30pm - 11:00pm | Gala Dinner at Wasserwerk |