Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
8:30am Keynote 2 Location: MOA 10-12
"Electronics Integration: Challenges in Computed Tomography Scanners"
Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
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8:30am Exhibition Location: Atrium
9:15am MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Chair: Hiroshi Nishikawa , Osaka UniversityAP3_Hybrid Bonding II Location: MOA 5 Chair: Rolf Aschenbrenner , Fraunhofer IZMAMT1_Innovative Assembly Processes Location: MOA 4 Chair: Attila Géczy , Budapest University of Technology and EconomicsDTM3_Reliability and Virtual Prototyping Location: MOA 3 Chair: Pradeep Lall , Auburn UniversityRel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Chair: Matthias Heimann , Siemens AG
10:30am Coffee Break & Exhibition Location: Atrium
10:30am Poster Session 2 Location: Atrium Chair: Karl-Friedrich Becker , Fraunhofer IZM
11:00am Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Chair: Martin Oppermann , TU DresdenAP4_Advances in WLP Technologies I Location: MOA 5 Chair: Rolf Aschenbrenner , Fraunhofer IZMAMT2_Computer-aided Process Control Location: MOA 4 Chair: Erik Jung , Fraunhofer IZMDTM4_Device Level Modeling Location: MOA 3 Chair: Przemyslaw Gromala , Robert Bosch GmbHRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Chair: Romuald Roucou , NXP
12:15pm Lunch
1:45pm Special Session Location: MOA 10-12 Chair: Steffen Kroehnert , ESPAT-ConsultingChair: Klaus Pressel , Infineon
The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
more Info AP5_Advances in WLP Technologies II Location: MOA 5 Chair: Michael Schiffer , Fraunhofer IZMAMT3_Process for Enhancement of Device Robustness Location: MOA 4 Chair: David Henry , CEA LETISpecial Session Location: MOA 3 Special Session Location: MOA 1+2
Education I: The Education, Training and Qualification Offer for Sustainable Electronics
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3:15pm Coffee Break & Exhibition Location: Atrium
3:45pm Special Session Location: MOA 10-12 Chair: Klaus Pressel , InfineonChair: Steffen Kroehnert , ESPAT-Consulting
The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
more Info AP6_Challenges and Solutions for HI Location: MOA 5 Chair: Kay Essig , ASE GroupEmerging II Location: MOA 4 Chair: Martin Schneider-Ramelow , Fraunhofer IZMSpecial Session Location: MOA 3 Chair: Toni Mattila , Business FinlandSpecial Session Location: MOA 1+2 Chair: Jeffrey C. Suhling , Auburn UniversityChair: Klaus-Jürgen Wolter , TU Dresden
5:15pm Panel Discussion
"Chiplet Architectures for Automotive: Package Options and Special Considerations"
E. Jan Vardaman, TechSearch International, Inc.
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7:10pm Bus Transfer
7:30pm Gala Dinner at Wasserwerk