Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Thursday, 12/Sept/2024
8:30am - 9:15amKeynote 2
Location: MOA 10-12

"Electronics Integration: Challenges in Computed Tomography Scanners"

Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
8:30am - 7:00pmExhibition
Location: Atrium
9:15am - 10:30amMIP3_Low-temperature Materials for Interconnects and Packaging
Location: MOA 10-12
Session Chair: Hiroshi Nishikawa, Osaka University
9:15am - 10:30amAP3_Hybrid Bonding II
Location: MOA 5
Session Chair: Rolf Aschenbrenner, Fraunhofer IZM
9:15am - 10:30amAMT1_Innovative Assembly Processes
Location: MOA 4
Session Chair: Attila Géczy, Budapest University of Technology and Economics
9:15am - 10:30amDTM3_Reliability and Virtual Prototyping
Location: MOA 3
Session Chair: Pradeep Lall, Auburn University
9:15am - 10:30amRel1_Reliability Performance and Electromigration Behavior
Location: MOA 1+2
Session Chair: Matthias Heimann, Siemens AG
10:30am - 11:00amCoffee Break & Exhibition
Location: Atrium
10:30am - 11:45amPoster Session 2
Location: Atrium
Session Chair: Karl-Friedrich Becker, Fraunhofer IZM
11:00am - 12:15pmEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Location: MOA 10-12
Session Chair: Martin Oppermann, TU Dresden
11:00am - 12:15pmAP4_Advances in WLP Technologies I
Location: MOA 5
Session Chair: Rolf Aschenbrenner, Fraunhofer IZM
11:00am - 12:15pmAMT2_Computer-aided Process Control
Location: MOA 4
Session Chair: Erik Jung, Fraunhofer IZM
11:00am - 12:15pmDTM4_Device Level Modeling
Location: MOA 3
Session Chair: Przemyslaw Gromala, Robert Bosch GmbH
11:00am - 12:15pmRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Location: MOA 1+2
Session Chair: Romuald Roucou, NXP
12:15pm - 1:45pmLunch
1:45pm - 3:15pmSpecial Session
Location: MOA 10-12
Session Chair: Steffen Kroehnert, ESPAT-Consulting
Session Chair: Klaus Pressel, Infineon

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



1:45pm - 3:15pmAP5_Advances in WLP Technologies II
Location: MOA 5
Session Chair: Michael Schiffer, Fraunhofer IZM
1:45pm - 3:15pmAMT3_Process for Enhancement of Device Robustness
Location: MOA 4
Session Chair: David Henry, CEA LETI
1:45pm - 3:15pmSpecial Session
Location: MOA 3

PUNCH - Photonic Packaging



1:45pm - 3:15pmSpecial Session
Location: MOA 1+2

Education I: The Education, Training and Qualification Offer for Sustainable Electronics



3:15pm - 3:45pmCoffee Break & Exhibition
Location: Atrium
3:45pm - 5:15pmSpecial Session
Location: MOA 10-12
Session Chair: Klaus Pressel, Infineon
Session Chair: Steffen Kroehnert, ESPAT-Consulting

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



3:45pm - 5:15pmAP6_Challenges and Solutions for HI
Location: MOA 5
Session Chair: Kay Essig, ASE Group
3:45pm - 5:15pmEmerging II
Location: MOA 4
Session Chair: Martin Schneider-Ramelow, Fraunhofer IZM
3:45pm - 5:15pmSpecial Session
Location: MOA 3
Session Chair: Toni Mattila, Business Finland

Quantum Computing



3:45pm - 5:15pmSpecial Session
Location: MOA 1+2
Session Chair: Jeffrey C. Suhling, Auburn University
Session Chair: Klaus-Jürgen Wolter, TU Dresden

Education II: t.b.c.



5:15pm - 6:45pmPanel Discussion

"Chiplet Architectures for Automotive: Package Options and Special Considerations"

E. Jan Vardaman, TechSearch International, Inc.
Vikas Gupta, ASE





7:10pm - 7:35pmBus Transfer
7:30pm - 11:00pmGala Dinner at Wasserwerk