Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Wed 11 Sept Thu 12 Sept Fri 13 Sept Sat 14 Sept Sun 15 Sept
Thu12Sept
MOA 10-12
MOA 5
MOA 4
MOA 3
MOA 1+2
Atrium
No specific location / location unknown
08:00
09:00
10:00
11:00
12:00
13:00
14:00
15:00
16:00
17:00
18:00
19:00
20:00
21:00
22:00
23:00
Keynote 2
8:30am - 9:15am
MOA 10-12
Location: MOA 10-12

"Electronics Integration: Challenges in Computed Tomography Scanners"

Dr. Michael Hosemann

Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens



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MIP3_Low-temperature Materials for Interconnects and Packaging
9:15am - 10:30am
MOA 10-12
Hiroshi Nishikawa
Location: MOA 10-12
Session Chair: Hiroshi Nishikawa, Osaka University
Presentations: 3
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies
11:00am - 12:15pm
MOA 10-12
Martin Oppermann
Location: MOA 10-12
Session Chair: Martin Oppermann, TU Dresden
Presentations: 3
Special Session
1:45pm - 3:15pm
MOA 10-12
Steffen Kroehnert, Klaus Pressel
Location: MOA 10-12
Session Chair: Steffen Kroehnert, ESPAT-Consulting
Session Chair: Klaus Pressel, Infineon

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I

IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



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Special Session
3:45pm - 5:15pm
MOA 10-12
Klaus Pressel, Steffen Kroehnert
Location: MOA 10-12
Session Chair: Klaus Pressel, Infineon
Session Chair: Steffen Kroehnert, ESPAT-Consulting

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II

IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



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AP3_Hybrid Bonding II
9:15am - 10:30am
MOA 5
Rolf Aschenbrenner
Location: MOA 5
Session Chair: Rolf Aschenbrenner, Fraunhofer IZM
Presentations: 3
AP4_Advances in WLP Technologies I
11:00am - 12:15pm
MOA 5
Rolf Aschenbrenner
Location: MOA 5
Session Chair: Rolf Aschenbrenner, Fraunhofer IZM
Presentations: 3
AP5_Advances in WLP Technologies II
1:45pm - 3:15pm
MOA 5
Michael Schiffer
Location: MOA 5
Session Chair: Michael Schiffer, Fraunhofer IZM
Presentations: 3
AP6_Challenges and Solutions for HI
3:45pm - 5:15pm
MOA 5
Kay Essig
Location: MOA 5
Session Chair: Kay Essig, ASE Group
Presentations: 3
AMT1_Innovative Assembly Processes
9:15am - 10:30am
MOA 4
Attila Géczy
Location: MOA 4
Session Chair: Attila Géczy, Budapest University of Technology and Economics
Presentations: 3
AMT2_Computer-aided Process Control
11:00am - 12:15pm
MOA 4
Erik Jung
Location: MOA 4
Session Chair: Erik Jung, Fraunhofer IZM
Presentations: 3
AMT3_Process for Enhancement of Device Robustness
1:45pm - 3:15pm
MOA 4
David Henry
Location: MOA 4
Session Chair: David Henry, CEA LETI
Presentations: 3
Emerging II
3:45pm - 5:15pm
MOA 4
Martin Schneider-Ramelow
Location: MOA 4
Session Chair: Martin Schneider-Ramelow, Fraunhofer IZM
Presentations: 3
DTM3_Reliability and Virtual Prototyping
9:15am - 10:30am
MOA 3
Pradeep Lall
Location: MOA 3
Session Chair: Pradeep Lall, Auburn University
Presentations: 3
DTM4_Device Level Modeling
11:00am - 12:15pm
MOA 3
Przemyslaw Gromala
Location: MOA 3
Session Chair: Przemyslaw Gromala, Robert Bosch GmbH
Presentations: 3
Special Session
1:45pm - 3:15pm
MOA 3
Location: MOA 3

PUNCH - Photonic Packaging



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Special Session
3:45pm - 5:15pm
MOA 3
Toni Mattila
Location: MOA 3
Session Chair: Toni Mattila, Business Finland

Quantum Computing



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Rel1_Reliability Performance and Electromigration Behavior
9:15am - 10:30am
MOA 1+2
Matthias Heimann
Location: MOA 1+2
Session Chair: Matthias Heimann, Siemens AG
Presentations: 3
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
11:00am - 12:15pm
MOA 1+2
Romuald Roucou
Location: MOA 1+2
Session Chair: Romuald Roucou, NXP
Presentations: 3
Special Session
1:45pm - 3:15pm
MOA 1+2
Location: MOA 1+2

Education I: The Education, Training and Qualification Offer for Sustainable Electronics



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Special Session
3:45pm - 5:15pm
MOA 1+2
Jeffrey C. Suhling, Klaus-Jürgen Wolter
Location: MOA 1+2
Session Chair: Jeffrey C. Suhling, Auburn University
Session Chair: Klaus-Jürgen Wolter, TU Dresden

Education II: t.b.c.



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Exhibition
8:30am - 7:00pm
Atrium
Location: Atrium
Coffee Break & Exhibition
10:30am - 11:00am
Atrium
Location: Atrium
Poster Session 2
10:30am - 11:45am
Atrium
Karl-Friedrich Becker
Location: Atrium
Session Chair: Karl-Friedrich Becker, Fraunhofer IZM
Presentations: 16
Coffee Break & Exhibition
3:15pm - 3:45pm
Atrium
Location: Atrium
Lunch
12:15pm - 1:45pm
Panel Discussion
5:15pm - 6:45pm

"Chiplet Architectures for Automotive: Package Options and Special Considerations"

E. Jan Vardaman, TechSearch International, Inc.Vikas Gupta, ASE




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Bus Transfer
7:10pm - 7:35pm
Gala Dinner at Wasserwerk
7:30pm - 11:00pm