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6:15pm |
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Location: MOA 10-12
Chair: Ali Roshanghias, Silicon Austria Labs GmbH
5:00pm - 5:25pm
Tuning of Copper Grain Size for Integration in Hybrid Bonding Applications
Sarabjot Singh, Kathleen Dunn
5:25pm - 5:50pm
Fine Pitch Aluminum Hybrid Bonding at Wafer Level: Overcoming the Challenges in Plating, Passivation and Planarization
Imants Cirulis, Vikas Dubey, Silvia Braun, Dirk Wünsch, Maik Wiemer
5:50pm - 6:15pm
Surface Activated Bonding for Hybrid and All-metal 3D (AM3D) Interconnect
Tadatomo Suga, Kanji Otsuka, Junsha Wang
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AP2_Hybrid Bonding I
Location: MOA 5
Chair: E Jan Vardaman, TechSearch International, Inc.
5:00pm - 5:25pm
Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations
Margot Faure, Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sébastien Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank Fournel
5:25pm - 5:50pm
Overlay Scaling Error Reduction for Hybrid Die-To-wafer Bonding
Pieter Bex, Mario Gonzalez, Steven Brems, Alain Phommahaxay, Koen D`Havé, Prathamesh Dhakras, Dieter H. Cuypers, Ye Lin, Eric Beyne, Jonathan Abdilla, Kawsar Ahmed Prince, Benedikt Auer, Djuro Bikaljevic, Manuel Deubler, Thiago Moura, Stefan Schmid, Pavel Seroglazov
5:50pm - 6:15pm
Scatterometry Application on Cu/SiCN Surface Topography Towards High Volume Manufacturing
Soon Aik Chew, Joey Hung, Igor Turoves, Avron Ger, Mohamed Saib, Alain Moussa, Boyao Zhang, Joeri De Vos, Andy Miller, Anne-Laure Charley, Philippe Leray, Eric Beyne
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Opto2_Heterogenous PIC Integration
Location: MOA 4
Chair: Giovanni Delrosso, VTT
5:00pm - 5:25pm
Laser-Assisted Bonding of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit with Through-Silicon Alignment
Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina
5:25pm - 5:50pm
Over 100-GHz Bridge Chip Interconnection Between Photonic and Electrical ICs with a Heat-insulating Stress-relief Membrane Structure
Taichi Misawa, Hiroshi Uemura, Keiji Tanaka, Katsumi Uesaka, Yoichiro Kurita
5:50pm - 6:15pm
Advanced Ultrathin Spray Coating Process Technology for Heterogeneous Integration Applications
Johanna Rimboeck, Stefan Ertl, Prasanna Ramaswamy, Alex Farrell, Ali Uzun, Mariana Pires, Brian Corbett, Ruggero Loi, Ksenija Varga, Peter Ossieur
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DTM2_Reduced Order Modeling for Advanced Packaging
Location: MOA 3
Chair: Kshitij Anil Kolas, Fraunhofer ENAS
5:00pm - 5:25pm
Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessments of Power Electronic Modules with Nonlinear Material Behaviours
Sheikh Hassan, Stoyan Stoyanov, Pushparajah Rajaguru, Christopher Bailey
5:25pm - 5:50pm
Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behavior Applying the Energy Conserving Sampling and Weighting Method
Mike Feuchter, Hanna Baumgartl, Martin Hanke, Sven Rzepka
5:50pm - 6:15pm
Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters
Abinash Pradhan, Giovanna Grosso, Varaha Satya Bharath Kurukuru, Claudio Romano, Roberto Petrella
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Power2_Power Semiconductor Packaging and Cooling
Location: MOA 1+2
Chair: Gudrun Feix, ECPE European Center for Power Electronics
5:00pm - 5:25pm
Model-based Development to Improve Electrical and Thermal Performances for Robust Si Power MOSFETs Using Embedded Die Packaging Technology
Kentaro Mori, Kohei Oasa, Hitoshi Imi, Yutaro Hayashi, Tatsuya Ohguro, Tatsuya Nishiwaki, Fumiyoshi Kawashiro
5:25pm - 5:50pm
Research on Ultra-compact 3D SiC Power Module for EVs with Double Layer Cooling Technology
Keita Suzuki, Takumi Yumoto, Koji Bando, Tetsuo Endoh, Yoshikazu Takahashi
5:50pm - 6:15pm
An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®
Kaneeze Noorul Ain, Guo Qi Zhang, Augusto Rodrigues, Md Nazmul Hasan, Karen Geens, Urmimala Chatterjee, Ali Roshanghias, Dominik Holzmann
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