Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
8:00am Registration
8:30am „IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12 PDC: “Advanced Packaging for MEMS and Sensors” I Location: MOA 5 PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I Location: MOA 4 PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3
10:30am Break
10:45am „IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12 PDC: “Advanced Packaging for MEMS and Sensors” II Location: MOA 5 PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II Location: MOA 4 PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3
11:00am Exhibition Setup Location: Atrium
12:45pm Break
1:30pm Opening Location: MOA 10-12
Tanja Braun Engelbert Beyer
1:45pm Keynote 1 Location: MOA 10-12
"A Vision for Modular, Ubiquitous and Scalable Compute Systems"
Bernd Waidhas
Principal Engineer, Silicon Packaging Architecture, Intel
more Info
2:30pm Room change
2:40pm MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Chair: Glenn Hamilton Ross , Aalto UniversityAP1_Advanced Substrates Location: MOA 5 Chair: Andreas Ostmann , IZMOpto1_Photonic Module Packaging Location: MOA 4 Chair: Henning Schröder , Fraunhofer IZMDTM1_Co-design and Modeling for Chiplets Location: MOA 3 Chair: Chris Bailey , Arizona State UniversityPower1_Electronics Measurement and Simulation Location: MOA 1+2 Chair: Aurelian Kotlar , Eberspächer
3:00pm Exhibition Location: Atrium
3:55pm Coffee Break & Exhibition Location: Atrium
3:55pm Poster Session 1 Location: Atrium Chair: Karl-Friedrich Becker , Fraunhofer IZM
4:25pm Exhibitor Pitches Location: MOA 10-12
4:55pm Room change
5:00pm MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Chair: Ali Roshanghias , Silicon Austria Labs GmbHAP2_Hybrid Bonding I Location: MOA 5 Chair: E Jan Vardaman , TechSearch International, Inc.Opto2_Heterogenous PIC Integration Location: MOA 4 Chair: Giovanni Delrosso , VTTDTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Chair: Kshitij Anil Kolas , Fraunhofer ENASPower2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Chair: Gudrun Feix , ECPE European Center for Power Electronics
6:15pm Welcome Reception Location: Atrium