Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Registration
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I Location: MOA 10-12
PDC: “Advanced Packaging for MEMS and Sensors” I Location: MOA 5
PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I Location: MOA 4
PDC: “Flip Chip Fabrication and Applications“ I Location: MOA 3
Break
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II Location: MOA 10-12
PDC: “Advanced Packaging for MEMS and Sensors” II Location: MOA 5
PDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II Location: MOA 4
PDC: “Flip Chip Fabrication and Applications“ II Location: MOA 3
Exhibition Setup Location: Atrium
Break
Opening Location: MOA 10-12
Tanja Braun Engelbert Beyer
Keynote 1 Location: MOA 10-12
"A Vision for Modular, Ubiquitous and Scalable Compute Systems"
Bernd Waidhas
Principal Engineer, Silicon Packaging Architecture, Intel
more Info
Room change
MIP1_Advanced Material Architectures for Interconnects Location: MOA 10-12 Session Chair: Glenn Hamilton Ross , Aalto University
AP1_Advanced Substrates Location: MOA 5 Session Chair: Andreas Ostmann , IZM
Opto1_Photonic Module Packaging Location: MOA 4 Session Chair: Henning Schröder , Fraunhofer IZM
DTM1_Co-design and Modeling for Chiplets Location: MOA 3 Session Chair: Chris Bailey , Arizona State University
Power1_Electronics Measurement and Simulation Location: MOA 1+2 Session Chair: Aurelian Kotlar , Eberspächer
Exhibition Location: Atrium
Coffee Break & Exhibition Location: Atrium
Poster Session 1 Location: Atrium Session Chair: Karl-Friedrich Becker , Fraunhofer IZM
Exhibitor Pitches Location: MOA 10-12
Room change
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects Location: MOA 10-12 Session Chair: Ali Roshanghias , Silicon Austria Labs GmbH
AP2_Hybrid Bonding I Location: MOA 5 Session Chair: E Jan Vardaman , TechSearch International, Inc.
Opto2_Heterogenous PIC Integration Location: MOA 4 Session Chair: Giovanni Delrosso , VTT
DTM2_Reduced Order Modeling for Advanced Packaging Location: MOA 3 Session Chair: Kshitij Anil Kolas , Fraunhofer ENAS
Power2_Power Semiconductor Packaging and Cooling Location: MOA 1+2 Session Chair: Gudrun Feix , ECPE European Center for Power Electronics
Welcome Reception Location: Atrium
Keynote 2 Location: MOA 10-12
"Electronics Integration: Challenges in Computed Tomography Scanners"
Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
more Info
Exhibition Location: Atrium
MIP3_Low-temperature Materials for Interconnects and Packaging Location: MOA 10-12 Session Chair: Hiroshi Nishikawa , Osaka University
AP3_Hybrid Bonding II Location: MOA 5 Session Chair: Rolf Aschenbrenner , Fraunhofer IZM
AMT1_Innovative Assembly Processes Location: MOA 4 Session Chair: Attila Géczy , Budapest University of Technology and Economics
DTM3_Reliability and Virtual Prototyping Location: MOA 3 Session Chair: Pradeep Lall , Auburn University
Rel1_Reliability Performance and Electromigration Behavior Location: MOA 1+2 Session Chair: Matthias Heimann , Siemens AG
Coffee Break & Exhibition Location: Atrium
Poster Session 2 Location: Atrium Session Chair: Karl-Friedrich Becker , Fraunhofer IZM
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies Location: MOA 10-12 Session Chair: Martin Oppermann , TU Dresden
AP4_Advances in WLP Technologies I Location: MOA 5 Session Chair: Rolf Aschenbrenner , Fraunhofer IZM
AMT2_Computer-aided Process Control Location: MOA 4 Session Chair: Erik Jung , Fraunhofer IZM
DTM4_Device Level Modeling Location: MOA 3 Session Chair: Przemyslaw Gromala , Robert Bosch GmbH
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects Location: MOA 1+2 Session Chair: Romuald Roucou , NXP
Lunch
Special Session Location: MOA 10-12 Session Chair: Steffen Kroehnert , ESPAT-ConsultingSession Chair: Klaus Pressel , Infineon
The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
more Info
AP5_Advances in WLP Technologies II Location: MOA 5 Session Chair: Michael Schiffer , Fraunhofer IZM
AMT3_Process for Enhancement of Device Robustness Location: MOA 4 Session Chair: David Henry , CEA LETI
Special Session Location: MOA 3
Special Session Location: MOA 1+2
Education I: The Education, Training and Qualification Offer for Sustainable Electronics
more Info
Coffee Break & Exhibition Location: Atrium
Special Session Location: MOA 10-12 Session Chair: Klaus Pressel , InfineonSession Chair: Steffen Kroehnert , ESPAT-Consulting
The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT
more Info
AP6_Challenges and Solutions for HI Location: MOA 5 Session Chair: Kay Essig , ASE Group
Emerging II Location: MOA 4 Session Chair: Martin Schneider-Ramelow , Fraunhofer IZM
Special Session Location: MOA 3 Session Chair: Toni Mattila , Business Finland
Special Session Location: MOA 1+2 Session Chair: Jeffrey C. Suhling , Auburn UniversitySession Chair: Klaus-Jürgen Wolter , TU Dresden
Panel Discussion
"Chiplet Architectures for Automotive: Package Options and Special Considerations"
E. Jan Vardaman, TechSearch International, Inc.
more Info
Bus Transfer
Gala Dinner at Wasserwerk
Keynote 3 Location: MOA 10-12
"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"
Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
more Info
Exhibition Location: Atrium
MIP4_Mechanical properties of Materials for Interconnects Location: MOA 10-12 Session Chair: Glenn Hamilton Ross , Aalto University
AP7_Fan Out Packages Location: MOA 5 Session Chair: Erik Jung , Fraunhofer IZM
AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration Location: MOA 4 Session Chair: Hoang-Vu Nguyen , University of South-Eastern Norway
Flex1_Reliability Assessment of Flexible Electronics Location: MOA 3 Session Chair: Jean Charles Souriau , CEA-Leti
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems Location: MOA 1+2 Session Chair: Matthias Wietstruck , IHP - Leibniz Institut für innovative Mikroelektronik
Coffee Break & Exhibition Location: Atrium
Poster Session 3 Location: Atrium Session Chair: Karl-Friedrich Becker , Fraunhofer IZM
MIP5_Microstructural Properties of Materials for Interconnects Location: MOA 10-12 Session Chair: Kay Essig , ASE Group
AP8_Fan Out Reliability Aspects Location: MOA 5 Session Chair: Grace O'Malley , INEMI
AMT5_Advanced Materials and Processes Location: MOA 4 Session Chair: Attila Géczy , Budapest University of Technology and Economics
Flex2_Formation of a Conductive Interconnection for Flexible Electronics Location: MOA 3 Session Chair: Jukka Hast , VTT Technical Research Centre of Finland ltd.
Rel3_Progress in Failure Analytical and Material Testing Methods Location: MOA 1+2 Session Chair: Matthias Petzold , Fraunhofer IMWS
Lunch
MIP6_New materials for Heterogeneous Integration Location: MOA 10-12 Session Chair: Nikhilendu Tiwary , Aalto University
AP9_Power Electronics Packaging Location: MOA 5 Session Chair: Klaus Pressel , Infineon
AMT6_Enhanced Process Control Location: MOA 4 Session Chair: Knut E. Aasmundtveit , University of South-Eastern Norway
RF2_Embedded System-in-Package and Interconnections Technologies Location: MOA 3 Session Chair: Maurizio Cirillo , Rheinmetall Italia SpA
Rel4_New Approaches in Reliability Simulation and Modelling Location: MOA 1+2 Session Chair: Olaf Wittler , Fraunhofer IZM
Room Change Location: Atrium
Keynote 4 Location: MOA 10-12
"CHIPS -NAPMP: Overview and Next Steps"
George Orji
Deputy Director of CHIPS NAPMP, USA
more Info
Closing
IEEE EPS Board of Governors Meeting (not public)