Details can be found on our website. https://www.esref2022.org/tutorials/

Details can be found on our website. https://www.esref2022.org/tutorials/

Details can be found on our website. https://www.esref2022.org/tutorials/

Welcome Message by Prof. Dr. Martin Schneider Ramelow (Director of Fraunhofer IZM)

"Sovereignty and chips – How microelectronics opens up new horizons"

Speaker: Dr. Gunther Kegel, ZVEI’s President

"Bridging across domains: Reducing escapes and optimizing costs by utilizing inline manufacturing inspection data to complement test"

Speaker: David W. Price, Ph.D., Sr. Director, Automotive Semiconductor Process Control Solutions

"Achieving automotive quality and reliability targets on electric vehicle with wide-bandgap materials"

Speaker: Vincenzo Militano, ADG Quality & Reliability Director, STMicroelectronics

Invited Talk 1: "Evaluating forksheet FET reliability concerns by experimental comparison with co-integrated nanosheets"

Speaker: Michiel Vandemaele (IMEC)

Best Paper from IRPS Conference

"Nanoscale Conductivity Mapping: Live Imaging of Dielectric Breakdown with STEM EBIC"
Speaker: Dr. William Hubbard (NanoElectronic Imaging Inc.)

IPFA 2022 Best Paper Award in Reliability

Introduction & Workshop Goals
Speakers: Horst Gieser, Fraunhofer EMFT & Frank Altmann, Fraunhofer IMWS

Optical attacks on the IC and methods to protect the IC backside
Speakers: Elham Amini & Tuba Kiyan, TU Berlin

Backside E Beam probing methods for functional analysis and attacks of sub 20nm nodes
Speaker: Jörg Jatzkowski, Fraunhofer IMWS

A versatile, low-cost microscope for optical side channel and failure analysis
Speaker: Enrico Dietz, German Aerospace Center Institute of Optical Sensor Systems (DLR)

Discussion

Invited Talk 3: "Reliability challenges on GaN technology designed for highly linear sub 6GHz applications"
Speaker: Jose L. Jimenez (Qorvo Inc.)

Securing a multiple source supply chain
Speaker: Matthias Lewicky, Zollner Elektronik AG

Analysis techniques for counterfeit detection
Speaker: Frank Altmann, Fraunhofer IMWS

Hardware analysis of identification structures in printed circuit boards and assemblies
Speaker: Christoph Lehnberger, Andus Electronic GmbH

Examples for counterfeit detection
Speaker: Horst Gieser, Fraunhofer EMFT

Discussion

PUFs: Overview and design challenges
Speaker: Robert Hesselbarth, Fraunhofer AISEC

MEMS Fingerprinting for Hardware Security (VIDES)
Speaker: Katja Meinel, Fraunhofer ENAS

Image correlation-based self-authentication and identification of valuable objects, products and documents based on stochastic markings
Speaker: Ralf Döring, Chemnitzer Werkstoffmechanik GmbH

Enabling trustworthiness of an electronic device along the supply chain
Speaker: Daniel Schneider, Siemens AG

Discussion

Physical Verification of IOT Devices
Bernhard Lippmann, Infineon AG

ZEISS MultiSEM: towards Full Chip Scanning in Semiconductor Reverse Engineering
Stephan Nickell, ZEISS MulitSEM GmbH

Discussion and Wrap-up

"Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope"
Speaker: Dr. David Glenn (EuQlid)

ISTFA Best Paper Award

Introduction to Applause
Speaker: Moritz Stoerring / imec BE

Highly accurate C2W Bonding Equipment and Optical Transceiver Assembly
Speaker: Yasser Makki / Besi Austria

Improved heart monitoring device for Cardiac Surgery Patients
Speaker: Jonas Tysso / Cardiaccs
Volker Steier / OSYPKA

Hermetic wafer level bonding for MEMS/MOEMS applications
Speaker: Knut Eilif Aasmundtveit / University of South-Eastern Norway (USN)
Avisek Roy / University of South-Eastern Norway (USN)
Vesa Vuorinen / Aalto University
Tobias Wernicke / EV Group
Rony Jose James / CSEM
Charles-Alix Manier / Fraunhofer IZM

High-speed datacom 400Gb/s transceiver with reduced manufacturing cost
Speaker: Helene Debregeas / Almae Technologies

The design of a flexible, stretchable multimodal wearable vital sign patch for clinical use
Speaker: Bernard Grundlehner / Imec the Netherlands