Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Wednesday, 13/July/2022
9:30am
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11:30am
Company Visit Lithoz_1
Mollardgasse 85A, 1060 Vienna, Austria
12:30pm
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12:45pm
Welcome/ Opening Ceremony
12:45pm
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1:45pm
Keynote 1: How to Improve Surface Functions Using Laser-based Fabrication Methods. New concepts and perspectives

Andrés F. Lasagni
Technical University Dresden and Fraunhofer IWS

1:45pm
-
2:15pm
Coffee Break
2:15pm
-
4:45pm
Emerging Materials
 

Novel LTCC Material with Low Dielectric Constant Co-fired with Copper-electrodes

Yasutaka Sugimoto, Sadaaki Sakamoto, Yutaka Senshu, Hiroshige Adachi, Nobuhiko Tanaka

Murata Manufacturing, Kyoto, Japan



Novel LTCC and HTCC Baseplates with Ag Based Metallization and Al Bonding Analysis

Kostja Makarovič1,2,3, Aleksander Sešek4

1: KEKO Equipment, Žužemberk, Slovenia; 2: Jožef Stefan Institute, Ljubljana, Slovenia; 3: Centre of Excellence NAMASTE, Ljubljana, Slovenia; 4: Faculty of Electrical Engineering, University of Ljubljana, Ljubljana, Slovenia



ULTCC Materials, Tapes and Pastes Fireable at 650 °C

Jobin Varghese, Kathrin Reinhardt, Stefan Körner, Steffen Ziesche, Uwe Partsch

Fraunhofer IKTS, Dresden, Germany



Screen-Printed Carbon-based Electrodes for Pesticide Detection

Barbara Repič1,2, Maksimiljan Dekleva3, Ema Gričar3, Mitja Kolar3, Gregor Marolt3, Helena Prosen3, Kostja Makarovič1, Darko Belavič1, Danjela Kuščer1,2

1: Jožef Stefan Institute, Ljubljana, Slovenia; 2: Jožef Stefan International Postgraduate School, Lubljana, Slovenia; 3: Faculty of Chemistry and Chemical Technology, University of Ljubljana, Ljubljana, Slovenia



Individual Surface Profiles in LTCC-based Ceramic Substrates for Identification of Trustworthy Electronics

Uwe Krieger1, Franz Bechtold1, Thomas Herbst1, Gunter Hagen2

1: VIA electronic GmbH, Hermsdorf, Germany; 2: KMS Technology Center GmbH, Dresden, Germany



Advanced RoHS Compliant Gold Conductor Paste for High-Performance Thick-Film Circuits

Gregg Berube, Matt Sgriccia, Ryan Persons, Stephanie Edwards, Caitlin Shahbazi

Heraeus, Hanau, Germany

Applications
 

High-performance Sodium Potassium Niobate-based Multilayer Structure for Medical Imaging

Danjela Kuscer1, Brigita Kmet1, Silvo Drnovšek1, Jullien Bustillo2, Franck Levassort2

1: Jožef Stefan Institute, Ljubljana, Slovenia; 2: GREMAN UMR7347, Université de Tours, Tours, France



Diode Laser Integration on DCB - The EXOMARS Green Laser

Erik Beckert, Grucheska Rosario-Rodriguez, Felix Timmermann

Fraunhofer IOF, Jena, Germany



An Investigation of LTCC Based Piezoresistive Pressure Sensors for the Operation at High and Low Extreme Temperatures

Kostja Makarovič1,2,3, Darko Belavič2,3, Mitja Jerlah3, Barbara Malič2

1: Keko-Equipment, Žužemberk, Slovenia; 2: Jožef Stefan Institute, Ljubljana, Slovenia; 3: Center of Excellence NAMASTE, Ljubljana, Slovenia



LTCC for Sensors under Harsh Environment Conditions

Jens Müller1, Johannes Schur1, Waleed Ehrhardt2, Steffen Welsch3

1: Technical University Ilmenau, Illmenau, Germany; 2: Electronics & Sensors, Ilmenau, Germany; 3: Consens GmbH, Ilmenau, Germany



A Self-sterilizing Touch Keypad in Ceramic Technology

Krzysztof Zaraska1, Monika Machnik1, Kamil Mazela1, Wiesław Zaraska2, Kiranmai Uppuluri1

1: Łukasiewicz - Instytut Mikroelektroniki i Fotoniki, Warsaw, Poland; 2: Grupa Techniczna CODI, Warszawa, Poland



Enhancement of Antenna Performance for Sub Teraherz Communication with Different Shape Low Permittivity Lense

Heli Jantunen

Microelectronics Research Unit, University of Oulu, Oulu, Finland

Date: Thursday, 14/July/2022
9:00am
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10:00am
Keynote 2: Structured Glass Substrates for Packaging of Electronic Components

Martin Letz
SCHOTT AG

10:00am
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10:30am
Coffee Break
10:30am
-
12:00pm
Integrated Passive Devices
 

Fringe Field, Polarizability, and Accumulation/Depletion Layer Contributions to Capacitance Enhancement of Thin Film Capacitors on LTCC

Daniel S Krueger1, Zachary J Legenzoff1, J Ambrose Wolf1, James B Claypool2, Robert W Schwartz2, Wayne Huebner2

1: The Department of Energy’s Kansas City National Security Campus is operated and managed by Honeywell Federal Manufacturing & Technologies, LLC under contract number DE-NA0002839; 2: Missouri University of Science and Technology, Missouri, USA



Demonstration of the First 3D Inductor on Corning Alumina Ribbon Ceramic for 5G Integrated Passive Devices Application

Chenggang Zhuang1, Heather Vanselous-Barrett1, Rajesh Vaddi1, ChuanChe Wang1, Seong-ho Seok1, Je-Hsiung Lan2, Jonghae Kim2

1: Corning Incorporated, Harrodsburg, USA; 2: Qualcomm Technologies Incorporated, San Diego, USA



Microscopic Stresses on Alumina Particles in DuPont 951 LTCC

Steve Dai, Kevin Strong, Brenton Elisberg, Steve Meserole

Ssndia National Labs, Albuquerque, USA

Conductor Technology
 

Transfer Technology for High-resolution Patterning on LTCC

Shraddha Supreeti, Joachim Döll, Michael Fischer, Mathias Fritz, Jens Müller

TU Ilmenau, Ilmenau, Germany



Laser Ablation of Metallization Pastes for SMD Assembly Technologies onto LTCC Substrates

Cathleen Kleinholz, Alexander Schulz, Jens Müller

Technical University Ilmenau, Illmenau, Germany



Smaller than MLCC: CCW (Ceramic Capacitor Wire)

Soojae Park

Samsung Electronics Company, Gyeonggi-Do, Republic of South Korea

12:00pm
-
1:30pm
Lunch Break
1:30pm
-
3:00pm
Advanced Materials
 

Wet Chemical Etching of CaO-SiO2-B2O3 Crystallizing Glass LTCC

Ali Hajian1, Zhifu Liu2, Stefan Smetaczek3, Thomas Konegger3, Andreas Limbeck3, Christopher Zellner1, Ulrich Schmid1

1: Institute of Sensor and Actuator Systems, TU Wien, Vienna, Austria; 2: Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, Republic of China; 3: Institute of Chemical Technologies and Analytics, TU Wien, Vienna, Austria



Characterization of Reactive Multilayer Systems Deposited on LTCC Screen Printing Pastes Featuring Different Surface Morphologies Suitable for Reactive Joining Applications

Alexander Schulz1, Andreas Ruh2, Steffen Wiese2, Jens Müller1

1: Technical University Ilmenau, Illmenau, Germany; 2: Universität des Saarlandes, Saarbrücken, Germany



Programmable LTCC Substrates for RF Applications

Ammar Kouki

Ecole de technologie supérieure, Montreal, Canada

Process Technology
 

Comparison of Lamination Methods to Control Low Temperature Co-fired Ceramic Shrinkage

Camilla Kärnfelt1,2, Maïna Sinou1,2, Artem Ivanov3

1: IMT Atlantique,Nantes, France; 2: Lab-STICC UMR CNRS 6285, Brest, France; 3: Hochschule Landshut, University of Applied Sciences, Landshut, Germany



Embedding of SiC Semiconductor Devices in Full Ceramic LTCC Pre-packages using Pressure-Assisted Sintering Technology

Christian Lenz1, Steffen Ziesche1, Kathrin Reinhardt1, Stefan Körner1, Andreas Schletz2, Linh Bach2, Benjamin Bayer2, Ingo Schmidt3, Bianca Böttge4

1: Fraunhofer IKTS, Dresden, Germany; 2: Fraunhofer IISB, Erlangen, Germany; 3: Fraunhofer IWM, Breisgau, Germany; 4: Fraunhofer IMWS, Halle, Germany



Wafer Level Packaging Based on Wafer Bonding and TSVs to Integrate Advanced MEMS-in-Ceramics Technologies

Roy Knechtel1, Manuela Göbelt2

1: Hochschule Schmalkalden, Schmalkalden, Germany; 2: X-FAB MEMS Foundry GmbH, Erfurt, Germany

3:00pm
-
3:30pm
Coffee Break
3:30pm
-
5:30pm
Si-/LTCC-Compound Substrate Technology
 

SiCer Technology – Silicon Ceramic Compound Substrates as Generic Platform for High-performance Multi-sensors

Peter Keil1, Boris Goj2, Manikandan Adaikkan1, Thomas Handte2, Lars Dittrich2, Uwe Krieger1, Franz Bechtold1

1: VIA electronic GmbH, Hermsdorf, Germany; 2: 5microns GmbH, Ilmenau, Germany



Tape Casting and Optimization of the Slurry Composition of a SiCer-compatible LTCC-tape

Clemens Motzkus, Beate Capraro

Fraunhofer IKTS, Hermsdorf, Germany



TEM Investigation of the LTCC-Silicon Interface of Carrier Substrates that are Designed by SiCer Technology

Hannes Engelhardt1, Clemens Motzkus1, Katharina Elisabeth Freiberg2, Martin Seyring2, Beate Capraro1, Arno Ludwig Görne1, Markus Rettenmayr2

1: Fraunhofer IKTS, Hermsdorf, Germany; 2: Friedrich Schiller University Jena, Jena, Germany



Integration of Functional Materials into the SiCer-process.

Manuel Heidenreich, Thomas Schulz, Christian Teichmann, Jörg Töpfer

Ernst-Abbe-Hochschule Jena, Jena, Germany

RF & Microwave
 

Realization and Characterization of HF-structures with Au-resinate Paste on Glass Wafers

Mahsa Kaltwasser, Jens Müller

Technical University Ilmenau, Illmenau, Germany



A Miniaturized Wideband Quadrature Coupler In LTCC For GNSS Applications

Michael L. Laurenzi1,2, Yahia M. M. Antar1, Alois P. Freundorfer2, Michel Clénet3, Slobodan Jović3

1: Royal Military College, Kingston, Canada; 2: Queen's University, Kingston, Canada; 3: Defense Research and Development Canada, Ottawa, Canada



A 30 GHz Microwave TX Frontend Module with Substrate-Integrated Liquid Cooling

Peter Uhlig1, Carsten Günner1, Uwe Gollor1, Alexandra Serwa1, Chuangxin Jiang2

1: IMST GmbH, Kamp-Lintfort, Germany; 2: Sichuan Institute of Piezoelectric and Acousto-Optic Technology, Chengdu, Republic of China



A Broadband and Miniaturized 140 GHz AperturecCoupled Stacked-patch Array Antenna for Antenna-in-packages in LTCC-technology

Martin Ihle1, Steffen Ziesche1, Christian Zech2, Benjamin Baumann2

1: Fraunhofer IKTS, Dresden, Germany; 2: Fraunhofer AIF, Freiburg, Germany

7:00pm
-
9:00pm
Conference Dinner
Date: Friday, 15/July/2022
9:00am
-
10:00am
Keynote 3: Volumetric 3D Printing of High Performance Ceramics

Christophe Moser
EPFL

10:00am
-
10:30am
Coffee Break
10:30am
-
1:00pm
Metallization Pastes
 

Effects of Organic Carrier on Rheological Behaviors and Performance of Silver Pastes for LTCC Applications

JingJing Feng, Yujun Gao, Zhifu Liu

Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, People's Republic of China



Photoimageable Resistor Pastes – New Possibilities in Voltage Sensorics

Kathrin Reinhardt, Stefan Körner, Richard Schmidt, Uwe Partsch

Fraunhofer IKTS, Dresden, Germany



Conductor Development for Lead-free LTCC Tape System (DuPontTM GreenTapeTM LF95C)

Young Jun Yoon, Gerald Dooling, Brian Laughlin, Bradley Schickling

DuPont Microcircuit Materials, NC, USA



New Ruthenium-based Conducting Phases for High Ohmic Resistor Pastes for Aluminum Nitride Ceramics

Richard Schmidt, Manja Marcinkowski, Stefan Körner, Uwe Partsch

Fraunhofer IKTS, Dresden, Germany



Constantan Thick-film Pastes – A Possible Replacement for Silver-Palladium Resistors?

Stefan Körner, Kathrin Reinhardt

Fraunhofer IKTS, Dresden, Germany

Additive Manufacturing
 

The Powder Aerosol Deposition Method as Supplementary Process for Additive Manufacturing

Jaroslaw Kita, Tobias Nazarenus, Lukas Hennerici, Nico Leupold, Mario Linz, Daniel Paulus, Mutlucan Sozak, Ralf Moos

Functional Materials, University of Bayreuth, Bayreuth, Germany



Multi-material Additive Manufacturing of Ceramic - Ceramic and Glass Ceramic - Metal

Christoph Hofstetter, Serkan Nohut, Julia Rabitsch, Sebastian Geier, Martin Schwentenwein

Lithoz GmbH, Vienna, Austria



Stereolithographic Additive Manufacturing for Electromagnetic Wave Control

Soshu Kirihara

Osaka University, Suita, Japan



Lithography-based Additive Mof Dielectric and Piezoceramic Materials

Martin Schwentenwein, Julia Rabitsch, Dominik Brouczek, Christoph Hofstetter

Lithoz GmbH, Vienna, Austria



3D-ceramic Interconnect Devices Produced via Direct Laser-induced Metallization of Modified Al2O3

Alexander Schilling1, Philipp Ninz2, Sascha Weser3, Andrea Knöller3, Thomas Günther1, Wolfgang Eberhardt3, Frank Kern2, André Zimmermann1,3

1: Institute for Micro Integration, University of Stuttgart, Stutgart, Germany; 2: Institue for Manufacturing Technologies of Ceramic Components and Composites, University of Stuttgart, Stutgart, Germany; 3: Hahn-Schickard, Stutgart, Germany

1:00pm
-
1:15pm
Farewell/ Closing Ceremony
2:00pm
-
4:00pm
Company Visit Lithoz_2
Mollardgasse 85A, 1060 Vienna, Austria

 
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