Conference Agenda

Novel LTCC Material with Low Dielectric Constant Co-fired with Copper-electrodes

Yasutaka Sugimoto, Sadaaki Sakamoto, Yutaka Senshu, Hiroshige Adachi, Nobuhiko Tanaka

Murata Manufacturing, Kyoto, Japan

Novel LTCC and HTCC Baseplates with Ag Based Metallization and Al Bonding Analysis

Kostja Makarovič^1,2,3, Aleksander Sešek⁴

1: KEKO Equipment, Žužemberk, Slovenia; 2: Jožef Stefan Institute, Ljubljana, Slovenia; 3: Centre of Excellence NAMASTE, Ljubljana, Slovenia; 4: Faculty of Electrical Engineering, University of Ljubljana, Ljubljana, Slovenia

ULTCC Materials, Tapes and Pastes Fireable at 650 °C

Jobin Varghese, Kathrin Reinhardt, Stefan Körner, Steffen Ziesche, Uwe Partsch

Fraunhofer IKTS, Dresden, Germany

Screen-Printed Carbon-based Electrodes for Pesticide Detection

Barbara Repič^1,2, Maksimiljan Dekleva³, Ema Gričar³, Mitja Kolar³, Gregor Marolt³, Helena Prosen³, Kostja Makarovič¹, Darko Belavič¹, Danjela Kuščer^1,2

1: Jožef Stefan Institute, Ljubljana, Slovenia; 2: Jožef Stefan International Postgraduate School, Lubljana, Slovenia; 3: Faculty of Chemistry and Chemical Technology, University of Ljubljana, Ljubljana, Slovenia

Individual Surface Profiles in LTCC-based Ceramic Substrates for Identification of Trustworthy Electronics

Uwe Krieger¹, Franz Bechtold¹, Thomas Herbst¹, Gunter Hagen²

1: VIA electronic GmbH, Hermsdorf, Germany; 2: KMS Technology Center GmbH, Dresden, Germany

Advanced RoHS Compliant Gold Conductor Paste for High-Performance Thick-Film Circuits

Gregg Berube, Matt Sgriccia, Ryan Persons, Stephanie Edwards, Caitlin Shahbazi

Heraeus, Hanau, Germany

High-performance Sodium Potassium Niobate-based Multilayer Structure for Medical Imaging

Danjela Kuscer¹, Brigita Kmet¹, Silvo Drnovšek¹, Jullien Bustillo², Franck Levassort²

1: Jožef Stefan Institute, Ljubljana, Slovenia; 2: GREMAN UMR7347, Université de Tours, Tours, France

Diode Laser Integration on DCB - The EXOMARS Green Laser

Erik Beckert, Grucheska Rosario-Rodriguez, Felix Timmermann

Fraunhofer IOF, Jena, Germany

LTCC for Sensors under Harsh Environment Conditions

Jens Müller¹, Johannes Schur¹, Waleed Ehrhardt², Steffen Welsch³

1: Technical University Ilmenau, Illmenau, Germany; 2: Electronics & Sensors, Ilmenau, Germany; 3: Consens GmbH, Ilmenau, Germany

A Self-sterilizing Touch Keypad in Ceramic Technology

Krzysztof Zaraska¹, Monika Machnik¹, Kamil Mazela¹, Wiesław Zaraska², Kiranmai Uppuluri¹

1: Łukasiewicz - Instytut Mikroelektroniki i Fotoniki, Warsaw, Poland; 2: Grupa Techniczna CODI, Warszawa, Poland

Enhancement of Antenna Performance for Sub Teraherz Communication with Different Shape Low Permittivity Lense

Heli Jantunen

Microelectronics Research Unit, University of Oulu, Oulu, Finland

LTCC Based Micro Hotplate Infrared Emitter for NDIR Gas Analysis

Martin Ebermann¹, Armin Günther¹, Adrian Goldberg², Steffen Ziesche²

1: InfraTec GmbH, Dresden, Germany; 2: Fraunhofer IKTS, Dresden, Germany

An Investigation of LTCC Based Piezoresistive Pressure Sensors for the Operation at High and Low Extreme Temperatures

Kostja Makarovič^1,2,3, Darko Belavič^2,3, Mitja Jerlah³, Barbara Malič²

1: Keko-Equipment, Žužemberk, Slovenia; 2: Jožef Stefan Institute, Ljubljana, Slovenia; 3: Center of Excellence NAMASTE, Ljubljana, Slovenia

Fringe Field, Polarizability, and Accumulation/Depletion Layer Contributions to Capacitance Enhancement of Thin Film Capacitors on LTCC

Daniel S Krueger¹, Zachary J Legenzoff¹, J Ambrose Wolf¹, James B Claypool², Robert W Schwartz², Wayne Huebner²

1: The Department of Energy’s Kansas City National Security Campus is operated and managed by Honeywell Federal Manufacturing & Technologies, LLC under contract number DE-NA0002839; 2: Missouri University of Science and Technology, Missouri, USA

Demonstration of the First 3D Inductor on Corning Alumina Ribbon Ceramic for 5G Integrated Passive Devices Application

Chenggang Zhuang¹, Heather Vanselous-Barrett¹, Rajesh Vaddi¹, ChuanChe Wang¹, Seong-ho Seok¹, Je-Hsiung Lan², Jonghae Kim²

1: Corning Incorporated, Corning, USA; 2: Qualcomm Technologies Incorporated, San Diego, USA

Microscopic Stresses on Alumina Particles in DuPont 951 LTCC

Steve Dai, Kevin Strong, Brenton Elisberg, Steve Meserole

Ssndia National Labs, Albuquerque, USA

Transfer Technology for High-resolution Patterning on LTCC

Shraddha Supreeti, Joachim Döll, Michael Fischer, Mathias Fritz, Jens Müller

TU Ilmenau, Ilmenau, Germany

Laser Ablation of Metallization Pastes for SMD Assembly Technologies onto LTCC Substrates

Cathleen Kleinholz, Alexander Schulz, Jens Müller

Technical University Ilmenau, Illmenau, Germany

Smaller than MLCC: CCW (Ceramic Capacitor Wire)

Soojae Park

Samsung Electronics Company, Gyeonggi-Do, Republic of South Korea

Wet Chemical Etching of CaO-SiO2-B2O3 Crystallizing Glass LTCC

Ali Hajian¹, Zhifu Liu², Stefan Smetaczek³, Thomas Konegger³, Andreas Limbeck³, Christopher Zellner¹, Ulrich Schmid¹

1: Institute of Sensor and Actuator Systems, TU Wien, Vienna, Austria; 2: Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, People's Republic of China; 3: Institute of Chemical Technologies and Analytics, TU Wien, Vienna, Austria

Characterization of Reactive Multilayer Systems Deposited on LTCC Screen Printing Pastes Featuring Different Surface Morphologies Suitable for Reactive Joining Applications

Alexander Schulz¹, Andreas Ruh², Steffen Wiese², Jens Müller¹

1: Technical University Ilmenau, Illmenau, Germany; 2: Universität des Saarlandes, Saarbrücken, Germany

Programmable LTCC Substrates for RF Applications

Ammar Kouki

Ecole de technologie supérieure, Montreal, Canada

Comparison of Lamination Methods to Control Low Temperature Co-fired Ceramic Shrinkage

Camilla Kärnfelt^1,2, Maïna Sinou^1,2, Artem Ivanov³

1: IMT Atlantique,Nantes, France; 2: Lab-STICC UMR CNRS 6285, Brest, France; 3: Hochschule Landshut, University of Applied Sciences, Landshut, Germany

Embedding of SiC Semiconductor Devices in Full Ceramic LTCC Pre-packages using Pressure-Assisted Sintering Technology

Christian Lenz¹, Steffen Ziesche¹, Kathrin Reinhardt¹, Stefan Körner¹, Andreas Schletz², Linh Bach², Benjamin Bayer², Ingo Schmidt³, Bianca Böttge⁴

1: Fraunhofer IKTS, Dresden, Germany; 2: Fraunhofer IISB, Erlangen, Germany; 3: Fraunhofer IWM, Breisgau, Germany; 4: Fraunhofer IMWS, Halle, Germany

Wafer Level Packaging Based on Wafer Bonding and TSVs to Integrate Advanced MEMS-in-Ceramics Technologies

Roy Knechtel¹, Manuela Göbelt²

1: Hochschule Schmalkalden, Schmalkalden, Germany; 2: X-FAB MEMS Foundry GmbH, Erfurt, Germany

SiCer Technology – Silicon Ceramic Compound Substrates as Generic Platform for High-performance Multi-sensors

Peter Keil¹, Boris Goj², Manikandan Adaikkan¹, Thomas Handte², Lars Dittrich², Uwe Krieger¹, Franz Bechtold¹

1: VIA electronic GmbH, Hermsdorf, Germany; 2: 5microns GmbH, Ilmenau, Germany

Tape Casting and Optimization of the Slurry Composition of a SiCer-compatible LTCC-tape

Clemens Motzkus, Beate Capraro

Fraunhofer IKTS, Hermsdorf, Germany

TEM Investigation of the LTCC-Silicon Interface of Carrier Substrates that are Designed by SiCer Technology

Hannes Engelhardt¹, Clemens Motzkus¹, Katharina Elisabeth Freiberg², Martin Seyring², Beate Capraro¹, Arno Ludwig Görne¹, Markus Rettenmayr²

1: Fraunhofer IKTS, Hermsdorf, Germany; 2: Friedrich Schiller University Jena, Jena, Germany

Integration of Functional Materials into the SiCer-process.

Manuel Heidenreich, Thomas Schulz, Christian Teichmann, Jörg Töpfer

Ernst-Abbe-Hochschule Jena, Jena, Germany

Realization and Characterization of HF-structures with Au-resinate Paste on Glass Wafers

Mahsa Kaltwasser, Jens Müller

Technical University Ilmenau, Illmenau, Germany

A Miniaturized Wideband Quadrature Coupler In LTCC For GNSS Applications

Michael L. Laurenzi^1,2, Yahia M. M. Antar¹, Alois P. Freundorfer², Michel Clénet³, Slobodan Jović³

1: Royal Military College, Kingston, Canada; 2: Queen's University, Kingston, Canada; 3: Defense Research and Development Canada, Ottawa, Canada

A 30 GHz Microwave TX Frontend Module with Substrate-Integrated Liquid Cooling

Peter Uhlig¹, Carsten Günner¹, Uwe Gollor¹, Alexandra Serwa¹, Chuangxin Jiang²

1: IMST GmbH, Kamp-Lintfort, Germany; 2: Sichuan Institute of Piezoelectric and Acousto-Optic Technology, Chengdu, People's Republic of China

A Broadband and Miniaturized 140 GHz Aperture Coupled Stacked-patch Array Antenna for Antenna-in-packages in LTCC-technology

Martin Ihle¹, Steffen Ziesche¹, Christian Zech², Benjamin Baumann²

1: Fraunhofer IKTS, Dresden, Germany; 2: Fraunhofer AIF, Freiburg, Germany

Photoimageable Resistor Pastes – New Possibilities in Voltage Sensorics

Kathrin Reinhardt, Stefan Körner, Richard Schmidt, Uwe Partsch

Fraunhofer IKTS, Dresden, Germany

Conductor Development for Lead-free LTCC Tape System (DuPontTM GreenTapeTM LF95C)

Young Jun Yoon, Gerald Dooling, Brian Laughlin, Bradley Schickling

DuPont Microcircuit Materials, NC, USA

New Ruthenium-based Conducting Phases for High Ohmic Resistor Pastes for Aluminum Nitride Ceramics

Richard Schmidt, Manja Marcinkowski, Stefan Körner, Uwe Partsch

Fraunhofer IKTS, Dresden, Germany

Constantan Thick-film Pastes – A Possible Replacement for Silver-Palladium Resistors?

Stefan Körner, Kathrin Reinhardt

Fraunhofer IKTS, Dresden, Germany

The Powder Aerosol Deposition Method as Supplementary Process for Additive Manufacturing

Jaroslaw Kita, Tobias Nazarenus, Lukas Hennerici, Nico Leupold, Mario Linz, Daniel Paulus, Mutlucan Sozak, Ralf Moos

Functional Materials, University of Bayreuth, Bayreuth, Germany

Multi-material Additive Manufacturing of Ceramic - Ceramic and Glass Ceramic - Metal

Christoph Hofstetter, Serkan Nohut, Julia Rabitsch, Sebastian Geier, Martin Schwentenwein

Lithoz GmbH, Vienna, Austria

Lithography-based Additive Mof Dielectric and Piezoceramic Materials

Martin Schwentenwein, Julia Rabitsch, Dominik Brouczek, Christoph Hofstetter

Lithoz GmbH, Vienna, Austria

3D-ceramic Interconnect Devices Produced via Direct Laser-induced Metallization of Modified Al2O3

Alexander Schilling¹, Philipp Ninz², Sascha Weser³, Andrea Knöller³, Thomas Günther¹, Wolfgang Eberhardt³, Frank Kern², André Zimmermann^1,3

1: Institute for Micro Integration, University of Stuttgart, Stutgart, Germany; 2: Institue for Manufacturing Technologies of Ceramic Components and Composites, University of Stuttgart, Stutgart, Germany; 3: Hahn-Schickard, Stutgart, Germany