Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
Date: Wednesday, 13/July/2022 | ||
9:30am - 11:30am |
Company Visit Lithoz_1 Mollardgasse 85A, 1060 Vienna, Austria |
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12:30pm - 12:45pm |
Welcome/ Opening Ceremony |
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12:45pm - 1:45pm |
Keynote 1: How to Improve Surface Functions Using Laser-based Fabrication Methods. New concepts and perspectives Andrés F. Lasagni Technical University Dresden and Fraunhofer IWS |
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1:45pm - 2:15pm |
Coffee Break |
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2:15pm - 4:45pm |
Emerging Materials Novel LTCC Material with Low Dielectric Constant Co-fired with Copper-electrodes Murata Manufacturing, Kyoto, Japan Novel LTCC and HTCC Baseplates with Ag Based Metallization and Al Bonding Analysis 1: KEKO Equipment, Žužemberk, Slovenia; 2: Jožef Stefan Institute, Ljubljana, Slovenia; 3: Centre of Excellence NAMASTE, Ljubljana, Slovenia; 4: Faculty of Electrical Engineering, University of Ljubljana, Ljubljana, Slovenia ULTCC Materials, Tapes and Pastes Fireable at 650 °C Fraunhofer IKTS, Dresden, Germany Screen-Printed Carbon-based Electrodes for Pesticide Detection 1: Jožef Stefan Institute, Ljubljana, Slovenia; 2: Jožef Stefan International Postgraduate School, Lubljana, Slovenia; 3: Faculty of Chemistry and Chemical Technology, University of Ljubljana, Ljubljana, Slovenia Individual Surface Profiles in LTCC-based Ceramic Substrates for Identification of Trustworthy Electronics 1: VIA electronic GmbH, Hermsdorf, Germany; 2: KMS Technology Center GmbH, Dresden, Germany Advanced RoHS Compliant Gold Conductor Paste for High-Performance Thick-Film Circuits Heraeus, Hanau, Germany |
Applications High-performance Sodium Potassium Niobate-based Multilayer Structure for Medical Imaging 1: Jožef Stefan Institute, Ljubljana, Slovenia; 2: GREMAN UMR7347, Université de Tours, Tours, France Diode Laser Integration on DCB - The EXOMARS Green Laser Fraunhofer IOF, Jena, Germany An Investigation of LTCC Based Piezoresistive Pressure Sensors for the Operation at High and Low Extreme Temperatures 1: Keko-Equipment, Žužemberk, Slovenia; 2: Jožef Stefan Institute, Ljubljana, Slovenia; 3: Center of Excellence NAMASTE, Ljubljana, Slovenia LTCC for Sensors under Harsh Environment Conditions 1: Technical University Ilmenau, Illmenau, Germany; 2: Electronics & Sensors, Ilmenau, Germany; 3: Consens GmbH, Ilmenau, Germany A Self-sterilizing Touch Keypad in Ceramic Technology 1: Łukasiewicz - Instytut Mikroelektroniki i Fotoniki, Warsaw, Poland; 2: Grupa Techniczna CODI, Warszawa, Poland Enhancement of Antenna Performance for Sub Teraherz Communication with Different Shape Low Permittivity Lense Microelectronics Research Unit, University of Oulu, Oulu, Finland |
Date: Thursday, 14/July/2022 | ||
9:00am - 10:00am |
Keynote 2: Structured Glass Substrates for Packaging of Electronic Components Martin Letz SCHOTT AG |
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10:00am - 10:30am |
Coffee Break |
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10:30am - 12:00pm |
Integrated Passive Devices Fringe Field, Polarizability, and Accumulation/Depletion Layer Contributions to Capacitance Enhancement of Thin Film Capacitors on LTCC 1: The Department of Energy’s Kansas City National Security Campus is operated and managed by Honeywell Federal Manufacturing & Technologies, LLC under contract number DE-NA0002839; 2: Missouri University of Science and Technology, Missouri, USA Demonstration of the First 3D Inductor on Corning Alumina Ribbon Ceramic for 5G Integrated Passive Devices Application 1: Corning Incorporated, Harrodsburg, USA; 2: Qualcomm Technologies Incorporated, San Diego, USA Microscopic Stresses on Alumina Particles in DuPont 951 LTCC Ssndia National Labs, Albuquerque, USA |
Conductor Technology Transfer Technology for High-resolution Patterning on LTCC TU Ilmenau, Ilmenau, Germany Laser Ablation of Metallization Pastes for SMD Assembly Technologies onto LTCC Substrates Technical University Ilmenau, Illmenau, Germany Smaller than MLCC: CCW (Ceramic Capacitor Wire) Samsung Electronics Company, Gyeonggi-Do, Republic of South Korea |
12:00pm - 1:30pm |
Lunch Break |
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1:30pm - 3:00pm |
Advanced Materials Wet Chemical Etching of CaO-SiO2-B2O3 Crystallizing Glass LTCC 1: Institute of Sensor and Actuator Systems, TU Wien, Vienna, Austria; 2: Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, Republic of China; 3: Institute of Chemical Technologies and Analytics, TU Wien, Vienna, Austria Characterization of Reactive Multilayer Systems Deposited on LTCC Screen Printing Pastes Featuring Different Surface Morphologies Suitable for Reactive Joining Applications 1: Technical University Ilmenau, Illmenau, Germany; 2: Universität des Saarlandes, Saarbrücken, Germany Programmable LTCC Substrates for RF Applications Ecole de technologie supérieure, Montreal, Canada |
Process Technology Comparison of Lamination Methods to Control Low Temperature Co-fired Ceramic Shrinkage 1: IMT Atlantique,Nantes, France; 2: Lab-STICC UMR CNRS 6285, Brest, France; 3: Hochschule Landshut, University of Applied Sciences, Landshut, Germany Embedding of SiC Semiconductor Devices in Full Ceramic LTCC Pre-packages using Pressure-Assisted Sintering Technology 1: Fraunhofer IKTS, Dresden, Germany; 2: Fraunhofer IISB, Erlangen, Germany; 3: Fraunhofer IWM, Breisgau, Germany; 4: Fraunhofer IMWS, Halle, Germany Wafer Level Packaging Based on Wafer Bonding and TSVs to Integrate Advanced MEMS-in-Ceramics Technologies 1: Hochschule Schmalkalden, Schmalkalden, Germany; 2: X-FAB MEMS Foundry GmbH, Erfurt, Germany |
3:00pm - 3:30pm |
Coffee Break |
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3:30pm - 5:30pm |
Si-/LTCC-Compound Substrate Technology SiCer Technology – Silicon Ceramic Compound Substrates as Generic Platform for High-performance Multi-sensors 1: VIA electronic GmbH, Hermsdorf, Germany; 2: 5microns GmbH, Ilmenau, Germany Tape Casting and Optimization of the Slurry Composition of a SiCer-compatible LTCC-tape Fraunhofer IKTS, Hermsdorf, Germany TEM Investigation of the LTCC-Silicon Interface of Carrier Substrates that are Designed by SiCer Technology 1: Fraunhofer IKTS, Hermsdorf, Germany; 2: Friedrich Schiller University Jena, Jena, Germany Integration of Functional Materials into the SiCer-process. Ernst-Abbe-Hochschule Jena, Jena, Germany |
RF & Microwave Realization and Characterization of HF-structures with Au-resinate Paste on Glass Wafers Technical University Ilmenau, Illmenau, Germany A Miniaturized Wideband Quadrature Coupler In LTCC For GNSS Applications 1: Royal Military College, Kingston, Canada; 2: Queen's University, Kingston, Canada; 3: Defense Research and Development Canada, Ottawa, Canada A 30 GHz Microwave TX Frontend Module with Substrate-Integrated Liquid Cooling 1: IMST GmbH, Kamp-Lintfort, Germany; 2: Sichuan Institute of Piezoelectric and Acousto-Optic Technology, Chengdu, Republic of China A Broadband and Miniaturized 140 GHz AperturecCoupled Stacked-patch Array Antenna for Antenna-in-packages in LTCC-technology 1: Fraunhofer IKTS, Dresden, Germany; 2: Fraunhofer AIF, Freiburg, Germany |
7:00pm - 9:00pm |
Conference Dinner |
Date: Friday, 15/July/2022 | ||
9:00am - 10:00am |
Keynote 3: Volumetric 3D Printing of High Performance Ceramics Christophe Moser EPFL |
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10:00am - 10:30am |
Coffee Break |
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10:30am - 1:00pm |
Metallization Pastes Effects of Organic Carrier on Rheological Behaviors and Performance of Silver Pastes for LTCC Applications Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, People's Republic of China Photoimageable Resistor Pastes – New Possibilities in Voltage Sensorics Fraunhofer IKTS, Dresden, Germany Conductor Development for Lead-free LTCC Tape System (DuPontTM GreenTapeTM LF95C) DuPont Microcircuit Materials, NC, USA New Ruthenium-based Conducting Phases for High Ohmic Resistor Pastes for Aluminum Nitride Ceramics Fraunhofer IKTS, Dresden, Germany Constantan Thick-film Pastes – A Possible Replacement for Silver-Palladium Resistors? Fraunhofer IKTS, Dresden, Germany |
Additive Manufacturing The Powder Aerosol Deposition Method as Supplementary Process for Additive Manufacturing Functional Materials, University of Bayreuth, Bayreuth, Germany Multi-material Additive Manufacturing of Ceramic - Ceramic and Glass Ceramic - Metal Lithoz GmbH, Vienna, Austria Stereolithographic Additive Manufacturing for Electromagnetic Wave Control Osaka University, Suita, Japan Lithography-based Additive Mof Dielectric and Piezoceramic Materials Lithoz GmbH, Vienna, Austria 3D-ceramic Interconnect Devices Produced via Direct Laser-induced Metallization of Modified Al2O3 1: Institute for Micro Integration, University of Stuttgart, Stutgart, Germany; 2: Institue for Manufacturing Technologies of Ceramic Components and Composites, University of Stuttgart, Stutgart, Germany; 3: Hahn-Schickard, Stutgart, Germany |
1:00pm - 1:15pm |
Farewell/ Closing Ceremony |
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2:00pm - 4:00pm |
Company Visit Lithoz_2 Mollardgasse 85A, 1060 Vienna, Austria |
Contact and Legal Notice · Contact Address: Privacy Statement · Conference: CICMT 2022 |
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